KR101265722B1

KR101265722B1 - Robe unit for integrated circuit contact and manufacturing method of the same

Info

Publication number: KR101265722B1
Application number: KR1020090128872A
Authority: KR
Inventors: 김헌민
Original assignee: 주식회사 코디에스
Priority date: 2009-08-26
Filing date: 2009-12-22
Publication date: 2013-05-21
Also published as: CN101996977A; KR20110021614A; JP5119282B2; TW201107757A; JP2011047919A

Abstract

The present invention relates to an integrated circuit contact probe unit and a method of manufacturing the same, and more particularly, to an integrated circuit contact probe unit which can be easily expanded to have an electrode pitch formed on a pad of an object by expanding an electrode pitch of an integrated circuit film part. And a method for producing the same.

An integrated circuit contact probe unit according to the present invention comprises a probe block; An integrated circuit film part fixed to the probe block, the integrated circuit film part including a first electrode part, a driving IC, and a second electrode part directly contacting the pad of the test object; And a flexible printed circuit board electrically connected to the second electrode unit, wherein the electrode pitch of the first electrode unit is extended so that the electrodes of the first electrode unit contact the electrodes of the pad. .

Flat panel display element. inspection. Probe. Integrated circuit film section. electrode. pitch.

Description

Integrated circuit contact probe unit and its manufacturing method {ROBE UNIT FOR INTEGRATED CIRCUIT CONTACT AND MANUFACTURING METHOD OF THE SAME}

In general, in the manufacturing process of a flat panel display device, a semiconductor, etc., several electrical inspections are performed.

The flat panel display device includes a cell process for injecting liquid crystal between a TFT substrate and a color filter substrate, a module process for attaching an integrated circuit film unit equipped with a driving IC to the cell, and a set process for mounting a frame to the module. For example, an electrical test of the cell is performed before the module process.

In more detail, before attaching the integrated circuit film portion to the pad of the cell, a test is performed by applying a signal while the pad of the cell and the integrated circuit film portion are electrically connected. To proceed.

A probe unit is used to perform this electrical test. The conventional general probe unit includes a probe block, a probe pin for connecting a pad of a cell (subject) and an electrode part of an integrated circuit film part, an integrated circuit film part electrically connected to the probe pin and to which a driving IC is attached, And a printed circuit board electrically connected to the integrated circuit film unit, and a printed circuit board electrically connected to the flexible circuit board.

That is, the conventional probe unit is to test by applying an electrical signal temporarily through the probe pin between the pad of the object to be ultimately connected and the integrated circuit film portion. As a result, there is a possibility that the loss of the electric signal, that is, the applied electric signal may not be accurately transmitted to the pad. In addition, there is a manufacturing problem that the probe pin must be manufactured separately and arranged in a fine pitch.

Therefore, in order to overcome this problem, the applicant has already invented the patent 720378. Referring to FIG. 1, the improved conventional probe unit 1 includes a probe block 10, an integrated circuit film unit 20, and a flexible circuit board 40. A fastening member 30 is attached to one surface of the integrated circuit film part 20, and fixes the integrated circuit film part 20 to the probe block 10 by using the fastening member 30. The other end of the flexible circuit board 40 is a printed circuit board (not shown) is electrically connected. That is, it can be seen that the improved conventional probe unit 1 is not provided with a probe pin. In other words, the integrated circuit film unit 20 adopts a method of directly contacting the pad of the object under test. This overcomes the problems noted above.

Referring to FIG. 2, the integrated circuit film part 20 includes a first electrode part 23 contacting the pad of the test object on the insulating substrate 21, and a second electrode part electrically connected to the flexible circuit board. 24 and a drive IC 22 are provided. In addition, the first electrode part 23 is formed of a plurality of electrodes 23a and a connection wiring 23b in 1: 1 contact with the electrodes of the pad.

3 illustrates a state in which the first electrode portion 23 of the integrated circuit film portion 20 is in contact with the pad 50 of the test object L. Referring to FIG. As shown in the figure, it can be seen that the electrode 23a of the first electrode portion 23 is exactly in contact with the electrode 51 of the pad 50 to some extent at the center of the contact portion (see also partially enlarged center).

However, the electrode 23a of the first electrode portion 23 does not contact with the center of the electrode 51 of the pad 50 more accurately toward the right side of the contact portion, and is located on the left side of the electrode 51 of the pad 50 (right side). See also partial enlargement of).

Similarly, the electrode 23a of the first electrode portion 23 does not accurately contact the center of the electrode 51 of the pad 50 as it goes to the left side of the contact portion, and is located on the right side of the electrode 51 of the pad 50 (left side). See also partial enlargement of).

This is a phenomenon that occurs because the electrode pitch P1 of the integrated circuit film portion first electrode portion 23 is smaller than the electrode pitch P2 of the test subject pad 50 (P2> P1).

This is quite natural. When the inspection process is completed and the module process is performed, the first electrode portion of the integrated circuit film portion is electrically connected to the pad in the state in which the first electrode portion is placed on the pad. At this time, since the heat is applied, the electrode pitch of the first electrode portion is extended. Therefore, if the electrode pitches of the first electrode part and the pad are formed to be the same from the beginning, there is a problem in that the electrode pitch of the first electrode part is extended and not matched with each other by the heat applied during the connection. In consideration of such electrode pitch expansion, the electrode pitch of the first electrode portion is formed to be smaller than the electrode pitch of the pad.

Therefore, there is a problem of contact performance in the method of directly contacting and inspecting an integrated circuit film part having a small electrode pitch. That is, the electrodes of the integrated circuit film unit and the electrode of the pad should be in contact with each other, but the electrodes of the integrated circuit film unit and the electrodes of the test pad are different from each other in pitch and thus have poor contact performance.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to easily expand the electrode pitch of an integrated circuit film unit and to make it the same as an electrode pitch formed on a pad of an inspected object; It is to provide a method of manufacturing the same.

In order to solve the above technical problem, the integrated circuit contact probe unit according to the present invention includes a probe block; An integrated circuit film part fixed to the probe block, the integrated circuit film part including a first electrode part, a driving IC, and a second electrode part directly contacting the pad of the test object; And a flexible printed circuit board electrically connected to the second electrode unit, wherein the electrode pitch of the first electrode unit is extended so that the electrodes of the first electrode unit contact the electrodes of the pad. .

In addition, it is preferable that a spacing member is attached to the first electrode so that the extended electrode pitch is not restored to its original state.

In addition, the spacing member is preferably a thermosetting tape.

In addition, it is preferable that at least one or more of glass, ceramic, metal, nonferrous metal and resin are attached on the thermosetting tape.

1) expanding the electrode pitch of the first electrode portion so that the electrodes formed on the first electrode portion of the integrated circuit film portion can contact the electrodes formed on the pad of the test object; And 2) electrically connecting the flexible circuit board to the second electrode part of the integrated circuit film part.

In addition, in the step 1), it is preferable to expand the electrode pitch by applying heat or pressure to the first electrode part.

In addition, it is preferable to attach a space keeping member to the first electrode portion before or after heating or pressing so that the expanded electrode pitch is not restored to its original state even after the heat or pressure is removed.

In addition, the spacing member is preferably a thermosetting tape.

In addition, after the thermosetting tape is interposed on the first electrode portion, it is preferable to heat or pressurize the thermosetting tape and the first electrode portion with a hot plate.

In addition, in the step 1), it is preferable to extend both electrode portions by stretching both side portions of the first electrode portion.

In addition, it is preferable to stretch while applying heat to the first electrode.

According to the present invention, there is an effect that the electrode pitch of the integrated circuit film portion can be easily expanded to be the same as the electrode pitch formed on the pad of the inspected object.

Therefore, the electrodes of the integrated circuit film part can contact the test object more accurately.

Hereinafter, with reference to the accompanying drawings will be described the configuration and operation of the embodiment according to the present invention.

Referring to FIG. 4, an embodiment according to the present invention includes a probe block (see 10 in FIG. 1), an integrated circuit film unit 120, a flexible circuit board (see 40 in FIG. 1), and a printed circuit board (not shown). It includes.

The integrated circuit film part 120 may include an insulating substrate 121, a first electrode part 123 contacting a pad of an object to be inspected, a second electrode part 124 electrically connected to a flexible circuit board, and driving; IC 122 is included.

In particular, the first electrode portion 123 can be seen that the pitch (P3) is extended so that the 1: 1 contact in the entire area of the pad. That is, it can be seen that the contact performance is improved by contacting the electrode 123a of the first electrode part with the center of the electrode 51 of the pad not only at the center of the contact portion but also at the left side or the right side (see also partially enlarged view).

In other words, the electrode pitch P2 of the pad and the electrode pitch P3 of the first electrode portion are extended to be equal to or close to each other (P2 = P3).

Meanwhile, in the present exemplary embodiment, the thermosetting tape T and the reinforcement part of the first electrode part 123 are maintained so that the extended electrode pitch P3 of the first electrode part 123 is maintained in the expanded state without being restored to its original state. It turns out that (A) is attached. This will be described later in detail.

In the present embodiment, other components except for the integrated circuit film unit 123 are omitted since they are not different from the related art.

Hereinafter, a method of expanding the electrode pitch of the first electrode unit will be described.

First, a spacing holding member is formed. In this embodiment, the reinforcing portion A is attached to the thermosetting tape T. The reinforcement part A selects a material having a property of having a property of shrinkage smaller than that of the thermosetting tape T such as glass, ceramic, metal, nonferrous metal, and resin.

Next, the thermosetting tape T having the reinforcing part A attached to the first electrode part 123 of the integrated circuit film part 120 is attached or simply placed (see FIG. 5A).

Next, the thermosetting tape T to which the reinforcement part A is attached and the first electrode part 123 are heated and pressurized using the hot plate H heated sufficiently (see FIG. 5B). When a certain time passes in this state, the first electrode portion 123 may have an extended electrode pitch due to heat and pressure. In addition, the thermosetting tape T adheres to the electrodes of the first electrode part 123 in which the pitch is extended due to the heat. As such, when the thermosetting tape T is attached to the first electrode unit 123, the extended electrode pitch of the first electrode unit 123 may be maintained even when the hot plate H is removed to remove heat and pressure. do. In particular, since the reinforcing portion A having a small shrinkage rate is attached to the rear surface of the thermosetting tape T, the extended electrode pitch of the first electrode portion 123 is maintained as it is. Otherwise, removing the hotplate to remove heat and pressure will cause the extended electrode pitch to return to its original state.

That is, the thermosetting tape T to which the reinforcing portion A is attached is a component that maintains the pitch of the extended electrode as the gap maintaining member. Alternatively, the same purpose can be achieved by attaching an adhesive tape after extending the electrode pitch by applying heat and pressure with a hot plate.

Another method of expanding the electrode pitch of the first electrode unit of the integrated circuit film unit will be described with reference to FIG. 6. As shown in the drawing, both sides of the first electrode part 123 are gripped by the gripper G, and then pulled outward to tension the first electrode part 123. In this way, the electrode pitch can be easily expanded. In addition, when the first electrode portion 123 is tensioned, heat is applied to the upper or lower portion of the first electrode portion 123 to more easily expand the electrode pitch.

As such, the probe unit may be manufactured by electrically connecting the flexible circuit board to the second electrode part of the integrated circuit film part having the extended electrode pitch and fixing the integrated circuit film part to the probe block.

In the detailed description of the present invention described above with reference to the preferred embodiment of the present invention, the scope of protection of the present invention is not limited to the above embodiment, and those skilled in the art of the present invention It will be understood that various modifications and changes can be made in the present invention without departing from the spirit and scope of the invention.

1 shows a conventional probe unit.

FIG. 2 illustrates an integrated circuit film part of the probe unit shown in FIG. 1.

3 shows a state of use of the probe unit shown in FIG.

Figure 4 shows a probe unit and its use according to the present invention.

5a and 5b show a method for manufacturing a probe unit according to the present invention.

Figure 6 shows another method of manufacturing a probe unit according to the present invention.

Claims

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1) expanding the electrode pitch of the first electrode portion so that the electrodes formed on the first electrode portion of the integrated circuit film portion may contact the electrodes formed on the pad of the object under test; And

2) electrically connecting a flexible circuit board to the second electrode part of the integrated circuit film part; Including,

Step 1) is characterized in that the electrode pitch is extended by applying heat or pressure to the first electrode,

After the heat or pressure is removed from the first electrode portion, the gap holding member is attached to the first electrode portion before being heated or pressurized so that the expanded electrode pitch is not restored to its original state. The gap holding member is a thermosetting tape. At least one or more of glass, ceramic, metal, nonferrous metal, and resin are attached on the thermosetting tape, and the thermosetting tape is seated on the first electrode part, and then the thermosetting tape and the first electrode are hot plated. A method of manufacturing an integrated circuit contact probe unit, characterized by heating or pressurizing a part.

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