TWI434046B - Probe device and manufacturing method thereof - Google Patents

Probe device and manufacturing method thereof Download PDF

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Publication number
TWI434046B
TWI434046B TW100146171A TW100146171A TWI434046B TW I434046 B TWI434046 B TW I434046B TW 100146171 A TW100146171 A TW 100146171A TW 100146171 A TW100146171 A TW 100146171A TW I434046 B TWI434046 B TW I434046B
Authority
TW
Taiwan
Prior art keywords
wiring sheet
wiring
interval
probe device
maintaining member
Prior art date
Application number
TW100146171A
Other languages
English (en)
Chinese (zh)
Other versions
TW201234018A (en
Inventor
Shuji Naraoka
Takao Yasuta
Yasuaki Osanai
Makoto Yokoyama
Original Assignee
Nihon Micronics Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nihon Micronics Kk filed Critical Nihon Micronics Kk
Publication of TW201234018A publication Critical patent/TW201234018A/zh
Application granted granted Critical
Publication of TWI434046B publication Critical patent/TWI434046B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755—Material aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2879—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to electrical aspects, e.g. to voltage or current supply or stimuli or to electrical loads
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1306—Details
    • G02F1/1309—Repairing; Testing

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Nonlinear Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Optics & Photonics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Geometry (AREA)
  • Toxicology (AREA)
  • Measuring Leads Or Probes (AREA)
  • Liquid Crystal (AREA)
  • Surgical Instruments (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
TW100146171A 2011-02-04 2011-12-14 Probe device and manufacturing method thereof TWI434046B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011022590A JP5597564B2 (ja) 2011-02-04 2011-02-04 プローブ装置及びその製造方法

Publications (2)

Publication Number Publication Date
TW201234018A TW201234018A (en) 2012-08-16
TWI434046B true TWI434046B (zh) 2014-04-11

Family

ID=46587173

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100146171A TWI434046B (zh) 2011-02-04 2011-12-14 Probe device and manufacturing method thereof

Country Status (4)

Country Link
JP (1) JP5597564B2 (ja)
KR (1) KR101231700B1 (ja)
CN (1) CN102628879A (ja)
TW (1) TWI434046B (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102158895B1 (ko) 2013-03-12 2020-09-22 마리 케이 인코포레이티드 보존 시스템
KR101574530B1 (ko) * 2014-07-31 2015-12-04 임근환 전자 부품 특성 검사용 프로브, 및 이에 사용되는 cof 제조 방법
CN110346617A (zh) * 2019-07-23 2019-10-18 深圳市卓精微智能机器人设备有限公司 一种管装ic的烧录与测试针座

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100516887C (zh) * 1999-11-16 2009-07-22 东丽工程株式会社 探测装置的制造方法
JP3866058B2 (ja) * 2001-07-05 2007-01-10 シャープ株式会社 半導体装置、配線基板及びテープキャリア
JP2004212068A (ja) * 2002-12-26 2004-07-29 Tokyo Cathode Laboratory Co Ltd 両端接触型多ピンループプローブ及び両端接触型多ピンループプローブを含む測定器具
TWI239685B (en) * 2003-05-13 2005-09-11 Jsr Corp Flaky probe, its manufacturing method and its application
JP2006064647A (ja) * 2004-08-30 2006-03-09 Optonix Seimitsu:Kk 電子回路検査用プローブ
JP2006098344A (ja) * 2004-09-30 2006-04-13 Kobe Steel Ltd プローブカード
JP2006284362A (ja) 2005-03-31 2006-10-19 Nhk Spring Co Ltd コンタクトプローブ
KR100720378B1 (ko) 2005-04-13 2007-05-22 주식회사 코디에스 액정 디스플레이 패널 검사용 프로브 유니트
JP5364240B2 (ja) * 2007-03-20 2013-12-11 株式会社日本マイクロニクス プローブユニット及び検査装置
TW201107757A (en) * 2009-08-26 2011-03-01 Kodi S Co Ltd Contact-type integrated circuit probe unit for inspecting monitor and manufacture method thereof
KR20110133279A (ko) * 2010-06-04 2011-12-12 티에스씨멤시스(주) 평판 표시 소자 검사 조립체
KR20120009241A (ko) * 2010-07-23 2012-02-01 주식회사 코디에스 필름타입의 프로브 장치 및 프로브 제조방법

Also Published As

Publication number Publication date
JP5597564B2 (ja) 2014-10-01
TW201234018A (en) 2012-08-16
CN102628879A (zh) 2012-08-08
KR101231700B1 (ko) 2013-02-12
KR20120090754A (ko) 2012-08-17
JP2012163397A (ja) 2012-08-30

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