JP5429334B2 - 配線板モジュール及び該配線板モジュールの製造方法 - Google Patents

配線板モジュール及び該配線板モジュールの製造方法 Download PDF

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Publication number
JP5429334B2
JP5429334B2 JP2012179087A JP2012179087A JP5429334B2 JP 5429334 B2 JP5429334 B2 JP 5429334B2 JP 2012179087 A JP2012179087 A JP 2012179087A JP 2012179087 A JP2012179087 A JP 2012179087A JP 5429334 B2 JP5429334 B2 JP 5429334B2
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Japan
Prior art keywords
wiring board
anisotropic conductive
electronic component
wiring
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2012179087A
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English (en)
Japanese (ja)
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JP2012238903A (ja
JP2012238903A5 (enExample
Inventor
惠司 小山
正道 山本
勝成 御影
辰珠 朴
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP2012179087A priority Critical patent/JP5429334B2/ja
Publication of JP2012238903A publication Critical patent/JP2012238903A/ja
Publication of JP2012238903A5 publication Critical patent/JP2012238903A5/ja
Application granted granted Critical
Publication of JP5429334B2 publication Critical patent/JP5429334B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29199—Material of the matrix
    • H01L2224/2929—Material of the matrix with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H01L2224/29299—Base material
    • H01L2224/293—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/83851—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester being an anisotropic conductive adhesive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers

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  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Combinations Of Printed Boards (AREA)
JP2012179087A 2012-08-10 2012-08-10 配線板モジュール及び該配線板モジュールの製造方法 Active JP5429334B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012179087A JP5429334B2 (ja) 2012-08-10 2012-08-10 配線板モジュール及び該配線板モジュールの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012179087A JP5429334B2 (ja) 2012-08-10 2012-08-10 配線板モジュール及び該配線板モジュールの製造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2007072720A Division JP2008235556A (ja) 2007-03-20 2007-03-20 配線板モジュール及び該配線板モジュールの製造方法

Publications (3)

Publication Number Publication Date
JP2012238903A JP2012238903A (ja) 2012-12-06
JP2012238903A5 JP2012238903A5 (enExample) 2013-08-01
JP5429334B2 true JP5429334B2 (ja) 2014-02-26

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Country Link
JP (1) JP5429334B2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12313943B2 (en) 2020-10-05 2025-05-27 Samsung Electronics Co., Ltd. Display device with slim control assembly

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6705244B2 (ja) * 2016-03-25 2020-06-03 大日本印刷株式会社 フレキシブル回路コネクタ、回路装置および情報記録装置
KR102734459B1 (ko) 2020-07-02 2024-11-27 가부시키가이샤 무라타 세이사쿠쇼 안테나 모듈, 접속 부재 및 그것을 탑재한 통신 장치
CN115803964A (zh) * 2020-07-02 2023-03-14 株式会社村田制作所 天线模块、连接构件以及搭载有天线模块的通信装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0723267A (ja) * 1993-06-30 1995-01-24 Sony Corp 電子機器及び撮像装置
JP4627125B2 (ja) * 2001-07-27 2011-02-09 三井化学株式会社 異方性導電ペースト
JP4433449B2 (ja) * 2001-11-09 2010-03-17 住友電気工業株式会社 異方導電膜とその製造方法
JP2004063710A (ja) * 2002-07-29 2004-02-26 Hitachi Cable Ltd 配線板および電子装置、ならびに配線板の製造方法および電子装置の製造方法
WO2006126586A1 (ja) * 2005-05-25 2006-11-30 Matsushita Electric Industrial Co., Ltd. 回路基板の接続構造および回路基板の接続方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12313943B2 (en) 2020-10-05 2025-05-27 Samsung Electronics Co., Ltd. Display device with slim control assembly

Also Published As

Publication number Publication date
JP2012238903A (ja) 2012-12-06

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