CN206441763U - 一种倒装芯片封装结构 - Google Patents
一种倒装芯片封装结构 Download PDFInfo
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- CN206441763U CN206441763U CN201720169630.0U CN201720169630U CN206441763U CN 206441763 U CN206441763 U CN 206441763U CN 201720169630 U CN201720169630 U CN 201720169630U CN 206441763 U CN206441763 U CN 206441763U
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CN201720169630.0U CN206441763U (zh) | 2017-02-24 | 2017-02-24 | 一种倒装芯片封装结构 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN106653977A (zh) * | 2017-02-24 | 2017-05-10 | 厦门多彩光电子科技有限公司 | 一种倒装芯片封装结构及成型方法 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN106653977A (zh) * | 2017-02-24 | 2017-05-10 | 厦门多彩光电子科技有限公司 | 一种倒装芯片封装结构及成型方法 |
CN106653977B (zh) * | 2017-02-24 | 2018-11-13 | 厦门多彩光电子科技有限公司 | 一种倒装芯片封装结构及成型方法 |
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Denomination of utility model: Flip chip encapsulation structure and fabrication process thereof Effective date of registration: 20190918 Granted publication date: 20170825 Pledgee: Xiamen finance Company limited by guarantee Pledgor: XIAMEN DACOL PHOTOELECTRONICS TECHNOLOGY Co.,Ltd. Registration number: Y2019990000252 |
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Date of cancellation: 20220221 Granted publication date: 20170825 Pledgee: Xiamen finance Company limited by guarantee Pledgor: XIAMEN DACOL PHOTOELECTRONICS TECHNOLOGY Co.,Ltd. Registration number: Y2019990000252 |
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