JP2004072101A5 - - Google Patents

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Publication number
JP2004072101A5
JP2004072101A5 JP2003276764A JP2003276764A JP2004072101A5 JP 2004072101 A5 JP2004072101 A5 JP 2004072101A5 JP 2003276764 A JP2003276764 A JP 2003276764A JP 2003276764 A JP2003276764 A JP 2003276764A JP 2004072101 A5 JP2004072101 A5 JP 2004072101A5
Authority
JP
Japan
Prior art keywords
heat sink
thermal material
cavity
heat
movable pedestal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2003276764A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004072101A (ja
JP4094505B2 (ja
Filing date
Publication date
Priority claimed from US10/210,000 external-priority patent/US6625026B1/en
Application filed filed Critical
Publication of JP2004072101A publication Critical patent/JP2004072101A/ja
Publication of JP2004072101A5 publication Critical patent/JP2004072101A5/ja
Application granted granted Critical
Publication of JP4094505B2 publication Critical patent/JP4094505B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2003276764A 2002-07-31 2003-07-18 熱起動自己整合ヒートシンク Expired - Fee Related JP4094505B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/210,000 US6625026B1 (en) 2002-07-31 2002-07-31 Heat-activated self-aligning heat sink

Publications (3)

Publication Number Publication Date
JP2004072101A JP2004072101A (ja) 2004-03-04
JP2004072101A5 true JP2004072101A5 (enExample) 2005-05-26
JP4094505B2 JP4094505B2 (ja) 2008-06-04

Family

ID=28041360

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003276764A Expired - Fee Related JP4094505B2 (ja) 2002-07-31 2003-07-18 熱起動自己整合ヒートシンク

Country Status (2)

Country Link
US (1) US6625026B1 (enExample)
JP (1) JP4094505B2 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6878573B2 (en) * 2001-06-19 2005-04-12 Koninklijke Philips Electronics N.V. Method of manufacturing a semiconductor device and semiconductor device
US6868899B1 (en) * 2003-08-25 2005-03-22 Hewlett-Packard Development Company, L.P. Variable height thermal interface
TWM302874U (en) * 2006-07-06 2006-12-11 Cooler Master Co Ltd Combinative structure of heat radiator
US20080173427A1 (en) * 2007-01-23 2008-07-24 Richard Schumacher Electronic component cooling
DE112008004257T5 (de) * 2008-12-29 2013-05-29 Hewlett-Packard Development Company, L.P. Systeme und verfahren einer trägervorrichtung zur platzierung vonthermisohen schnittstellen-materialien
US20110162828A1 (en) * 2010-01-06 2011-07-07 Graham Charles Kirk Thermal plug for use with a heat sink and method of assembling same
CN103096678B (zh) * 2011-10-27 2017-09-15 全亿大科技（佛山）有限公司 散热装置
ES2671714T3 (es) * 2014-02-20 2018-06-08 Gallus Ferd. Rüesch AG Plantilla de serigrafía y procedimiento para su insolación
US9913412B2 (en) 2014-03-18 2018-03-06 Apple Inc. Shielding structures for system-in-package assemblies in portable electronic devices
US9949359B2 (en) 2014-03-18 2018-04-17 Apple Inc. Multi-layer thin-film coatings for system-in-package assemblies in portable electronic devices
US9820373B2 (en) * 2014-06-26 2017-11-14 Apple Inc. Thermal solutions for system-in-package assemblies in portable electronic devices

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4897764A (en) * 1988-10-31 1990-01-30 Control Data Corporation Conductive cooling cup module
JP3241639B2 (ja) * 1997-06-30 2001-12-25 日本電気株式会社 マルチチップモジュールの冷却構造およびその製造方法
US6292362B1 (en) * 1999-12-22 2001-09-18 Dell Usa, L.P. Self-contained flowable thermal interface material module
JP3690729B2 (ja) * 2000-09-11 2005-08-31 インターナショナル・ビジネス・マシーンズ・コーポレーション 電気回路装置及びコンピュータ

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