JP2003258170A5 - - Google Patents

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Publication number
JP2003258170A5
JP2003258170A5 JP2002101927A JP2002101927A JP2003258170A5 JP 2003258170 A5 JP2003258170 A5 JP 2003258170A5 JP 2002101927 A JP2002101927 A JP 2002101927A JP 2002101927 A JP2002101927 A JP 2002101927A JP 2003258170 A5 JP2003258170 A5 JP 2003258170A5
Authority
JP
Japan
Prior art keywords
fin
heat sink
base
sink according
integrally
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002101927A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003258170A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2002101927A priority Critical patent/JP2003258170A/ja
Priority claimed from JP2002101927A external-priority patent/JP2003258170A/ja
Publication of JP2003258170A publication Critical patent/JP2003258170A/ja
Publication of JP2003258170A5 publication Critical patent/JP2003258170A5/ja
Pending legal-status Critical Current

Links

JP2002101927A 2002-02-26 2002-02-26 ヒートシンク Pending JP2003258170A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002101927A JP2003258170A (ja) 2002-02-26 2002-02-26 ヒートシンク

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002101927A JP2003258170A (ja) 2002-02-26 2002-02-26 ヒートシンク

Publications (2)

Publication Number Publication Date
JP2003258170A JP2003258170A (ja) 2003-09-12
JP2003258170A5 true JP2003258170A5 (enExample) 2005-08-25

Family

ID=28672163

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002101927A Pending JP2003258170A (ja) 2002-02-26 2002-02-26 ヒートシンク

Country Status (1)

Country Link
JP (1) JP2003258170A (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7306027B2 (en) * 2004-07-01 2007-12-11 Aavid Thermalloy, Llc Fluid-containing cooling plate for an electronic component
US7772036B2 (en) * 2006-04-06 2010-08-10 Freescale Semiconductor, Inc. Lead frame based, over-molded semiconductor package with integrated through hole technology (THT) heat spreader pin(s) and associated method of manufacturing
JP2010167454A (ja) * 2009-01-22 2010-08-05 Welcon:Kk 熱交換器及びその製造方法
IN2015DN02361A (enExample) 2012-09-21 2015-09-04 Mitsubishi Materials Corp
IN2015DN03283A (enExample) * 2012-10-16 2015-10-09 Mitsubishi Materials Corp
JP7334214B2 (ja) * 2021-07-14 2023-08-28 プライムプラネットエナジー＆ソリューションズ株式会社 端子部品、該端子部品の製造方法、および二次電池

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