JP2005203665A5 - - Google Patents

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Publication number
JP2005203665A5
JP2005203665A5 JP2004010221A JP2004010221A JP2005203665A5 JP 2005203665 A5 JP2005203665 A5 JP 2005203665A5 JP 2004010221 A JP2004010221 A JP 2004010221A JP 2004010221 A JP2004010221 A JP 2004010221A JP 2005203665 A5 JP2005203665 A5 JP 2005203665A5
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JP
Japan
Prior art keywords
heat
fins
heat pipe
base plate
heat radiation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2004010221A
Other languages
English (en)
Japanese (ja)
Other versions
JP4493350B2 (ja
JP2005203665A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2004010221A priority Critical patent/JP4493350B2/ja
Priority claimed from JP2004010221A external-priority patent/JP4493350B2/ja
Publication of JP2005203665A publication Critical patent/JP2005203665A/ja
Publication of JP2005203665A5 publication Critical patent/JP2005203665A5/ja
Application granted granted Critical
Publication of JP4493350B2 publication Critical patent/JP4493350B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2004010221A 2004-01-19 2004-01-19 放熱モジュールの構造およびその製造方法 Expired - Fee Related JP4493350B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004010221A JP4493350B2 (ja) 2004-01-19 2004-01-19 放熱モジュールの構造およびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004010221A JP4493350B2 (ja) 2004-01-19 2004-01-19 放熱モジュールの構造およびその製造方法

Publications (3)

Publication Number Publication Date
JP2005203665A JP2005203665A (ja) 2005-07-28
JP2005203665A5 true JP2005203665A5 (enExample) 2006-01-12
JP4493350B2 JP4493350B2 (ja) 2010-06-30

Family

ID=34823015

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004010221A Expired - Fee Related JP4493350B2 (ja) 2004-01-19 2004-01-19 放熱モジュールの構造およびその製造方法

Country Status (1)

Country Link
JP (1) JP4493350B2 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100464621C (zh) * 2006-05-12 2009-02-25 富准精密工业(深圳)有限公司 散热装置
WO2007142023A1 (ja) * 2006-06-02 2007-12-13 Kabushiki Kaisha Yaskawa Denki モータ制御装置
KR100790790B1 (ko) 2006-09-14 2008-01-02 (주)셀시아테크놀러지스한국 집적회로용 히트싱크 및 쿨러
TW200830976A (en) * 2007-01-11 2008-07-16 Delta Electronics Inc Heat dissipating apparatus, heat dissipating base and its manufacturing method
TW200821811A (en) * 2008-01-11 2008-05-16 Chung-Shian Huang Heat dissipation device without a base
KR200447710Y1 (ko) * 2008-02-04 2010-02-11 충-시엔 후앙 열파이프를 구비한 개선된 방열기
KR20110033596A (ko) * 2009-09-25 2011-03-31 잘만테크 주식회사 전자부품용 냉각장치
JP5228115B2 (ja) * 2010-01-18 2013-07-03 古河電気工業株式会社 ヒートシンク
JP5373829B2 (ja) * 2011-01-17 2013-12-18 奇▲こう▼科技股▲ふん▼有限公司 散熱モジュールの組合せ方法
CN110227397B (zh) * 2018-03-06 2024-03-29 山东豪迈化工技术有限公司 一种可视流动微反应器
CN114284221A (zh) * 2022-01-28 2022-04-05 奇鋐科技股份有限公司 散热模块结构

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