JP2004528702A5 - - Google Patents

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Publication number
JP2004528702A5
JP2004528702A5 JP2002543696A JP2002543696A JP2004528702A5 JP 2004528702 A5 JP2004528702 A5 JP 2004528702A5 JP 2002543696 A JP2002543696 A JP 2002543696A JP 2002543696 A JP2002543696 A JP 2002543696A JP 2004528702 A5 JP2004528702 A5 JP 2004528702A5
Authority
JP
Japan
Prior art keywords
lid
microelectronic component
package
microelectronic
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2002543696A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004528702A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2001/044849 external-priority patent/WO2002041394A2/en
Publication of JP2004528702A publication Critical patent/JP2004528702A/ja
Publication of JP2004528702A5 publication Critical patent/JP2004528702A5/ja
Withdrawn legal-status Critical Current

Links

JP2002543696A 2000-11-14 2001-10-30 マイクロ電子部品用蓋、熱スプレッダ、および半導体パッケージ Withdrawn JP2004528702A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US24904300P 2000-11-14 2000-11-14
PCT/US2001/044849 WO2002041394A2 (en) 2000-11-14 2001-10-30 Lid and heat spreader design for a semiconductor package

Publications (2)

Publication Number Publication Date
JP2004528702A JP2004528702A (ja) 2004-09-16
JP2004528702A5 true JP2004528702A5 (enExample) 2005-05-19

Family

ID=22941809

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002543696A Withdrawn JP2004528702A (ja) 2000-11-14 2001-10-30 マイクロ電子部品用蓋、熱スプレッダ、および半導体パッケージ

Country Status (7)

Country Link
US (2) US6958536B2 (enExample)
EP (1) EP1336199A2 (enExample)
JP (1) JP2004528702A (enExample)
KR (1) KR20040014412A (enExample)
CN (1) CN1575520A (enExample)
AU (1) AU2002217965A1 (enExample)
WO (1) WO2002041394A2 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD509482S1 (en) * 2003-03-06 2005-09-13 Datech Technology Co., Ltd. Heat sink cap
US6888238B1 (en) * 2003-07-09 2005-05-03 Altera Corporation Low warpage flip chip package solution-channel heat spreader
DE112004002702B4 (de) * 2004-02-03 2009-03-05 Infineon Technologies Ag Verfahren zum Herstellen einer Halbleiterbaugruppe und Matrixbaugruppe
KR100799614B1 (ko) 2006-05-23 2008-01-30 삼성전기주식회사 열 방출 기능을 가진 멤스 모듈 패키지
EP2238617A2 (en) * 2008-01-31 2010-10-13 Raytheon Company Methods and apparatus for heat transfer for a component
WO2012074775A1 (en) 2010-11-19 2012-06-07 Analog Devices, Inc. Packaged integrated device with electrically conductive lid
CN104192790A (zh) * 2014-09-15 2014-12-10 华东光电集成器件研究所 一种mems器件热应力隔离结构
US9837333B1 (en) 2016-09-21 2017-12-05 International Business Machines Corporation Electronic package cover having underside rib
US10622282B2 (en) * 2017-07-28 2020-04-14 Qualcomm Incorporated Systems and methods for cooling an electronic device
US20230320039A1 (en) * 2022-04-05 2023-10-05 Honeywell International Inc. Integrated heat spreader

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR860002865A (ko) * 1984-09-04 1986-04-30 로버어트 티이 오어너 열발산장치가 일체로 부착된 집적회로 패키지
US5831836A (en) * 1992-01-30 1998-11-03 Lsi Logic Power plane for semiconductor device
US5459352A (en) * 1993-03-31 1995-10-17 Unisys Corporation Integrated circuit package having a liquid metal-aluminum/copper joint
US5485037A (en) * 1993-04-12 1996-01-16 Amkor Electronics, Inc. Semiconductor device having a thermal dissipator and electromagnetic shielding
US5956576A (en) * 1996-09-13 1999-09-21 International Business Machines Corporation Enhanced protection of semiconductors with dual surface seal
US6075289A (en) * 1996-10-24 2000-06-13 Tessera, Inc. Thermally enhanced packaged semiconductor assemblies
TW359863B (en) 1997-11-28 1999-06-01 Utron Technology Inc Multi-chip stack package
JP3097644B2 (ja) * 1998-01-06 2000-10-10 日本電気株式会社 半導体装置接続構造及び接続方法
US6068051A (en) * 1998-03-23 2000-05-30 Intel Corporation Channeled heat sink
JP2000022044A (ja) * 1998-07-02 2000-01-21 Mitsubishi Electric Corp 半導体装置とその製造方法
US6118177A (en) * 1998-11-17 2000-09-12 Lucent Technologies, Inc. Heatspreader for a flip chip device, and method for connecting the heatspreader
US6091603A (en) * 1999-09-30 2000-07-18 International Business Machines Corporation Customizable lid for improved thermal performance of modules using flip chips
US6222263B1 (en) * 1999-10-19 2001-04-24 International Business Machines Corporation Chip assembly with load-bearing lid in thermal contact with the chip
US6784540B2 (en) * 2001-10-10 2004-08-31 International Rectifier Corp. Semiconductor device package with improved cooling

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