JP2004528702A5 - - Google Patents

Download PDF

Info

Publication number
JP2004528702A5
JP2004528702A5 JP2002543696A JP2002543696A JP2004528702A5 JP 2004528702 A5 JP2004528702 A5 JP 2004528702A5 JP 2002543696 A JP2002543696 A JP 2002543696A JP 2002543696 A JP2002543696 A JP 2002543696A JP 2004528702 A5 JP2004528702 A5 JP 2004528702A5
Authority
JP
Japan
Prior art keywords
lid
microelectronic component
package
microelectronic
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2002543696A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004528702A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2001/044849 external-priority patent/WO2002041394A2/en
Publication of JP2004528702A publication Critical patent/JP2004528702A/ja
Publication of JP2004528702A5 publication Critical patent/JP2004528702A5/ja
Withdrawn legal-status Critical Current

Links

JP2002543696A 2000-11-14 2001-10-30 マイクロ電子部品用蓋、熱スプレッダ、および半導体パッケージ Withdrawn JP2004528702A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US24904300P 2000-11-14 2000-11-14
PCT/US2001/044849 WO2002041394A2 (en) 2000-11-14 2001-10-30 Lid and heat spreader design for a semiconductor package

Publications (2)

Publication Number Publication Date
JP2004528702A JP2004528702A (ja) 2004-09-16
JP2004528702A5 true JP2004528702A5 (enExample) 2005-05-19

Family

ID=22941809

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002543696A Withdrawn JP2004528702A (ja) 2000-11-14 2001-10-30 マイクロ電子部品用蓋、熱スプレッダ、および半導体パッケージ

Country Status (7)

Country Link
US (2) US6958536B2 (enExample)
EP (1) EP1336199A2 (enExample)
JP (1) JP2004528702A (enExample)
KR (1) KR20040014412A (enExample)
CN (1) CN1575520A (enExample)
AU (1) AU2002217965A1 (enExample)
WO (1) WO2002041394A2 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD509482S1 (en) * 2003-03-06 2005-09-13 Datech Technology Co., Ltd. Heat sink cap
US6888238B1 (en) * 2003-07-09 2005-05-03 Altera Corporation Low warpage flip chip package solution-channel heat spreader
US7521792B2 (en) 2004-02-03 2009-04-21 Infineon Technologies Ag Semiconductor package with heat spreader
KR100799614B1 (ko) 2006-05-23 2008-01-30 삼성전기주식회사 열 방출 기능을 가진 멤스 모듈 패키지
WO2009099934A2 (en) * 2008-01-31 2009-08-13 Raytheon Company Methods and apparatus for heat transfer for a component
WO2012074775A1 (en) 2010-11-19 2012-06-07 Analog Devices, Inc. Packaged integrated device with electrically conductive lid
CN104192790A (zh) * 2014-09-15 2014-12-10 华东光电集成器件研究所 一种mems器件热应力隔离结构
US9837333B1 (en) 2016-09-21 2017-12-05 International Business Machines Corporation Electronic package cover having underside rib
US10622282B2 (en) * 2017-07-28 2020-04-14 Qualcomm Incorporated Systems and methods for cooling an electronic device
US20230320039A1 (en) * 2022-04-05 2023-10-05 Honeywell International Inc. Integrated heat spreader

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR860002865A (ko) * 1984-09-04 1986-04-30 로버어트 티이 오어너 열발산장치가 일체로 부착된 집적회로 패키지
US5831836A (en) * 1992-01-30 1998-11-03 Lsi Logic Power plane for semiconductor device
US5459352A (en) * 1993-03-31 1995-10-17 Unisys Corporation Integrated circuit package having a liquid metal-aluminum/copper joint
US5482898A (en) * 1993-04-12 1996-01-09 Amkor Electronics, Inc. Method for forming a semiconductor device having a thermal dissipator and electromagnetic shielding
US5956576A (en) * 1996-09-13 1999-09-21 International Business Machines Corporation Enhanced protection of semiconductors with dual surface seal
US6075289A (en) * 1996-10-24 2000-06-13 Tessera, Inc. Thermally enhanced packaged semiconductor assemblies
TW359863B (en) 1997-11-28 1999-06-01 Utron Technology Inc Multi-chip stack package
JP3097644B2 (ja) * 1998-01-06 2000-10-10 日本電気株式会社 半導体装置接続構造及び接続方法
US6068051A (en) * 1998-03-23 2000-05-30 Intel Corporation Channeled heat sink
JP2000022044A (ja) * 1998-07-02 2000-01-21 Mitsubishi Electric Corp 半導体装置とその製造方法
US6118177A (en) * 1998-11-17 2000-09-12 Lucent Technologies, Inc. Heatspreader for a flip chip device, and method for connecting the heatspreader
US6091603A (en) * 1999-09-30 2000-07-18 International Business Machines Corporation Customizable lid for improved thermal performance of modules using flip chips
US6222263B1 (en) * 1999-10-19 2001-04-24 International Business Machines Corporation Chip assembly with load-bearing lid in thermal contact with the chip
US6784540B2 (en) * 2001-10-10 2004-08-31 International Rectifier Corp. Semiconductor device package with improved cooling

Similar Documents

Publication Publication Date Title
JP2004528702A5 (enExample)
US20060219386A1 (en) Heat dissipating assembly with composite heat dissipating structure
JP4028452B2 (ja) 電子部品搭載基板およびその製造方法
US6957898B2 (en) Adhesive type LED lead frame
EP1463112A3 (en) Heat sink with visible logo
CN113097162A (zh) 散热片、芯片及电路板
CN201369329Y (zh) 耐热防潮大功率引线框架
JP2005129577A (ja) 金属−セラミックス接合基板およびその製造方法
KR20100065813A (ko) 결합형 히트싱크
CN201853698U (zh) 短脚三极管引线框架
CN201547732U (zh) Led灯散热装置
JP2005203665A5 (enExample)
CN104949080B (zh) 蜂窝金属散热器及其加工工艺
JP2001358480A (ja) 複合式ヒートシンク及びその製造方法
CN116742468A (zh) 一种半导体激光器的封装结构及封装方法
CN203467056U (zh) 一种带散热材料的夹铝基线路板
CN113937207A (zh) 一种可弯曲的热电模块及其制作方法
KR101002369B1 (ko) 산열장치의 제조방법
CN209859943U (zh) 一种局部镀银的引线框架
CN206449416U (zh) 一种大功率led标准模组散热器
CN207818556U (zh) 一种散热元件和igbt模组
JP4738250B2 (ja) 半導体装置
CN207697179U (zh) 双面铜基覆铜板
CN202651203U (zh) 一种金属片
CN209561394U (zh) 功率集成电路用电镀引线框架