JP2005353740A5 - - Google Patents

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Publication number
JP2005353740A5
JP2005353740A5 JP2004171215A JP2004171215A JP2005353740A5 JP 2005353740 A5 JP2005353740 A5 JP 2005353740A5 JP 2004171215 A JP2004171215 A JP 2004171215A JP 2004171215 A JP2004171215 A JP 2004171215A JP 2005353740 A5 JP2005353740 A5 JP 2005353740A5
Authority
JP
Japan
Prior art keywords
semiconductor element
groove
adhesive
heat generating
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004171215A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005353740A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2004171215A priority Critical patent/JP2005353740A/ja
Priority claimed from JP2004171215A external-priority patent/JP2005353740A/ja
Priority to US10/975,385 priority patent/US7215013B2/en
Publication of JP2005353740A publication Critical patent/JP2005353740A/ja
Publication of JP2005353740A5 publication Critical patent/JP2005353740A5/ja
Pending legal-status Critical Current

Links

JP2004171215A 2004-06-09 2004-06-09 半導体素子及び半導体装置 Pending JP2005353740A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2004171215A JP2005353740A (ja) 2004-06-09 2004-06-09 半導体素子及び半導体装置
US10/975,385 US7215013B2 (en) 2004-06-09 2004-10-29 Semiconductor device and semiconductor apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004171215A JP2005353740A (ja) 2004-06-09 2004-06-09 半導体素子及び半導体装置

Publications (2)

Publication Number Publication Date
JP2005353740A JP2005353740A (ja) 2005-12-22
JP2005353740A5 true JP2005353740A5 (enExample) 2007-07-05

Family

ID=35459695

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004171215A Pending JP2005353740A (ja) 2004-06-09 2004-06-09 半導体素子及び半導体装置

Country Status (2)

Country Link
US (1) US7215013B2 (enExample)
JP (1) JP2005353740A (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4904769B2 (ja) * 2005-10-21 2012-03-28 富士通セミコンダクター株式会社 半導体装置
DE102009028360B3 (de) * 2009-08-07 2010-12-09 Infineon Technologies Ag Verfahren zur Herstellung einer Schaltungsträgeranordnung und eines Leistungselektronikmoduls mit einer Verankerungsstruktur zur Herstellung einer temperaturwechselstabilen Lötverbindung
JP2011187518A (ja) * 2010-03-05 2011-09-22 Nippon Telegr & Teleph Corp <Ntt> 半導体装置およびその製造方法
US8748750B2 (en) 2011-07-08 2014-06-10 Honeywell International Inc. Printed board assembly interface structures
FR2994769B1 (fr) * 2012-08-27 2015-07-17 Oberthur Technologies Circuit integre protege d'une attaque lumiere
CN108022845B (zh) * 2016-11-02 2020-06-26 中芯国际集成电路制造(上海)有限公司 芯片封装方法及封装结构
DE112019007675T5 (de) * 2019-08-27 2022-06-15 Mitsubishi Electric Corporation Halbleitervorrichtung und Halbleiter-Chip

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06177178A (ja) 1992-12-01 1994-06-24 Nissan Motor Co Ltd 半導体チップの構造
KR100421301B1 (ko) 1995-10-16 2004-09-18 인터유니베르지테르 마이크로-엘렉트로니카 센트룸 파우체트베 마이크로파회로시스템을위한폴리머스터드그리드어레이
JP3526376B2 (ja) * 1996-08-21 2004-05-10 株式会社東芝 半導体装置及びその製造方法
WO1999012207A1 (en) * 1997-09-01 1999-03-11 Fanuc Ltd Method of joining small parts and assembly of small parts
EP1186031A1 (de) 1999-05-20 2002-03-13 Siemens Aktiengesellschaft Substrat mit mindestens zwei metallisierten polymerhöckern für die lötverbindung mit einer verdrahtung
US6406636B1 (en) * 1999-06-02 2002-06-18 Megasense, Inc. Methods for wafer to wafer bonding using microstructures
DE10045249A1 (de) * 2000-09-13 2002-04-04 Siemens Ag Photovoltaisches Bauelement und Verfahren zum Herstellen des Bauelements
US7001798B2 (en) * 2001-11-14 2006-02-21 Oki Electric Industry Co., Ltd. Method of manufacturing semiconductor device
WO2004085321A1 (ja) * 2003-03-25 2004-10-07 Asahi Glass Company Limited 溝部を有するガラス基板及びその製造方法及びガラス基板作製用プレス型

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