DE60315911D1 - Kühlkörper mit Vielfachoberflächenvergrösserung - Google Patents

Kühlkörper mit Vielfachoberflächenvergrösserung

Info

Publication number
DE60315911D1
DE60315911D1 DE60315911T DE60315911T DE60315911D1 DE 60315911 D1 DE60315911 D1 DE 60315911D1 DE 60315911 T DE60315911 T DE 60315911T DE 60315911 T DE60315911 T DE 60315911T DE 60315911 D1 DE60315911 D1 DE 60315911D1
Authority
DE
Germany
Prior art keywords
heat sink
multiple surface
surface enlargement
enlargement
sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60315911T
Other languages
English (en)
Other versions
DE60315911T2 (de
Inventor
Warren L Gawve
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Delphi Technologies Inc
Original Assignee
Delphi Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Delphi Technologies Inc filed Critical Delphi Technologies Inc
Application granted granted Critical
Publication of DE60315911D1 publication Critical patent/DE60315911D1/de
Publication of DE60315911T2 publication Critical patent/DE60315911T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE60315911T 2002-04-09 2003-03-24 Kühlkörper mit Vielfachoberflächenvergrösserung Expired - Fee Related DE60315911T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US119911 2002-04-09
US10/119,911 US6668910B2 (en) 2002-04-09 2002-04-09 Heat sink with multiple surface enhancements

Publications (2)

Publication Number Publication Date
DE60315911D1 true DE60315911D1 (de) 2007-10-11
DE60315911T2 DE60315911T2 (de) 2008-05-29

Family

ID=28453994

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60315911T Expired - Fee Related DE60315911T2 (de) 2002-04-09 2003-03-24 Kühlkörper mit Vielfachoberflächenvergrösserung

Country Status (3)

Country Link
US (1) US6668910B2 (de)
EP (1) EP1353376B1 (de)
DE (1) DE60315911T2 (de)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6826050B2 (en) * 2000-12-27 2004-11-30 Fujitsu Limited Heat sink and electronic device with heat sink
US6847525B1 (en) * 2002-05-24 2005-01-25 Unisys Corporation Forced convection heat sink system with fluid vector control
FI20021027A0 (fi) * 2002-05-31 2002-05-31 Outokumpu Oy Jäähdytinelementti elektroniikkalaitteeseen
TWM244508U (en) * 2003-04-16 2004-09-21 Asia Vital Components Co Ltd Improved fan structure
US7065173B2 (en) * 2003-12-02 2006-06-20 General Electric Company Method and apparatus for thermal management of CT electronics
US7038911B2 (en) * 2004-06-30 2006-05-02 International Business Machines Corporation Push-pull dual fan fansink
US7256996B2 (en) * 2004-10-14 2007-08-14 Bountiful Wifi Llc Wireless router
US20060098414A1 (en) * 2004-11-10 2006-05-11 Meng-Cheng Huang Heat sink
US20060215364A1 (en) * 2005-03-28 2006-09-28 Le Cuong D Heatsink for high-power microprocessors
US20070159796A1 (en) * 2006-01-12 2007-07-12 Dell Products L.P. Heat sink with vertical air flow panels
CN100444714C (zh) * 2006-02-10 2008-12-17 富准精密工业(深圳)有限公司 散热器
CN100574597C (zh) * 2006-07-21 2009-12-23 鸿富锦精密工业（深圳）有限公司 散热器
US20090165996A1 (en) * 2007-12-26 2009-07-02 Lynch Thomas W Reticulated heat dissipation with coolant
EP2101351B1 (de) * 2008-03-13 2016-08-17 Siemens Aktiengesellschaft Kühlvorrichtung zur Kühlung eines Bauteils
US7969733B1 (en) * 2008-12-17 2011-06-28 Nvidia Corporation Heat transfer system, method, and computer program product for use with multiple circuit board environments
ATE554361T1 (de) * 2009-04-28 2012-05-15 Abb Research Ltd Wärmerohr mit gewundenem rohr
EP2246654B1 (de) * 2009-04-29 2013-12-11 ABB Research Ltd. Mehrreihiger Thermosyphon-Wärmetauscher
DE112011101959B4 (de) * 2010-06-07 2016-11-24 Mitsubishi Electric Corporation Wärmesenke und Verfahren zu deren Herstellung
US11604035B2 (en) * 2013-09-29 2023-03-14 Huawei Technologies Co., Ltd. Support plateheat dissipation apparatus
US10665848B2 (en) 2015-01-05 2020-05-26 Cps Technology Holdings Llc Battery module bus bar carrier having guide extensions system and method
CN104602490B (zh) * 2015-01-15 2017-09-22 华为技术有限公司 散热装置
USD806646S1 (en) 2015-02-27 2018-01-02 Johnson Controls Technology Company Battery module cooling fins and footings
KR101794007B1 (ko) * 2016-04-06 2017-11-07 (주)휴맥스 방열모듈 조립체 및 이를 갖는 셋탑박스
CN108151555B (zh) * 2018-01-03 2024-08-09 格力电器（合肥）有限公司 换热器及具有其的空调器
US12092399B2 (en) * 2020-07-14 2024-09-17 Raytheon Company Chimney cooler design for rugged maximum free convection heat transfer with minimum footprint
CN113675160B (zh) * 2021-08-16 2024-01-30 西北工业大学 一种适用于高热流密度器件的冲击流双层导流微通道热沉

Family Cites Families (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6138237Y2 (de) 1978-11-17 1986-11-05
US4733293A (en) 1987-02-13 1988-03-22 Unisys Corporation Heat sink device assembly for encumbered IC package
US4768581A (en) * 1987-04-06 1988-09-06 International Business Machines Corporation Cooling system for semiconductor modules
US4807441A (en) 1987-07-17 1989-02-28 Allied-Signal Inc. Cooling system for a sealed enclosure
US5132780A (en) 1988-01-07 1992-07-21 Prime Computer, Inc. Heat sink apparatus with an air deflection member
US5019880A (en) * 1988-01-07 1991-05-28 Prime Computer, Inc. Heat sink apparatus
US4884631A (en) 1988-03-17 1989-12-05 California Institute Of Technology Forced air heat sink apparatus
US5205353A (en) 1989-11-30 1993-04-27 Akzo N.V. Heat exchanging member
JP2544497B2 (ja) 1990-02-28 1996-10-16 株式会社日立製作所 コンピュ―タ冷却装置
JP3232618B2 (ja) * 1992-02-05 2001-11-26 株式会社日立製作所 Ｌｓｉ冷却装置
US5309983B1 (en) 1992-06-23 1997-02-04 Pcubid Computer Tech Low profile integrated heat sink and fan assembly
KR0159134B1 (ko) * 1992-08-06 1998-12-15 사에구사 히로유끼 발열소자 냉각장치
US5368094A (en) * 1993-11-02 1994-11-29 Hung; Chin-Ping Bipartite heat sink positioning device for computer chips
US5494098A (en) 1994-06-17 1996-02-27 Wakefield Engineering, Inc. Fan driven heat sink
JP3525498B2 (ja) * 1994-07-13 2004-05-10 株式会社デンソー 沸騰冷却装置
US5603376A (en) 1994-08-31 1997-02-18 Fujitsu Network Communications, Inc. Heat exchanger for electronics cabinet
US5709263A (en) * 1995-10-19 1998-01-20 Silicon Graphics, Inc. High performance sinusoidal heat sink for heat removal from electronic equipment
US5706160A (en) 1995-12-22 1998-01-06 Illinois Tool Works, Inc. Transmission bandwidth extender/category 5 protector
US5896917A (en) 1996-02-22 1999-04-27 Lemont Aircraft Corporation Active heat sink structure with flow augmenting rings and method for removing heat
JPH104164A (ja) * 1996-06-14 1998-01-06 Toyo Radiator Co Ltd 空冷ヒートシンク
US5957194A (en) * 1996-06-27 1999-09-28 Advanced Thermal Solutions, Inc. Plate fin heat exchanger having fluid control means
US5983997A (en) 1996-10-17 1999-11-16 Brazonics, Inc. Cold plate having uniform pressure drop and uniform flow rate
US6018459A (en) * 1997-11-17 2000-01-25 Cray Research, Inc. Porous metal heat sink
DE29806082U1 (de) 1998-04-02 1998-06-18 Ideal Electronics Inc., San Chung, Taipei Kühleinrichtung für eine zentrale Recheneinheit
US6269863B1 (en) * 1998-10-09 2001-08-07 Molex Incorporated Integrated processor mounting mechanism and heat sink
DE19856955A1 (de) * 1998-12-10 2000-06-15 Ameur Raouf Ben Gehäuse für einen Kühlkörper
US6176299B1 (en) 1999-02-22 2001-01-23 Agilent Technologies, Inc. Cooling apparatus for electronic devices
US6199624B1 (en) 1999-04-30 2001-03-13 Molex Incorporated Folded fin heat sink and a heat exchanger employing the heat sink
US6181556B1 (en) 1999-07-21 2001-01-30 Richard K. Allman Thermally-coupled heat dissipation apparatus for electronic devices
US6851467B1 (en) * 1999-08-30 2005-02-08 Molex Incorporated Heat sink assembly
US6304442B1 (en) * 2000-06-29 2001-10-16 Hewlett-Packard Company Actively cooled daughterboard system
US20020109970A1 (en) * 2000-12-18 2002-08-15 Samsung Electro-Mechanics Co., Ltd. Heat sink for cooling electronic chip
DE20105208U1 (de) * 2001-03-20 2001-05-31 Cooler Master Co., Ltd., Chung-Ho, Taipeh Kühlkörper für eine Zentralprozessoreinheit

Also Published As

Publication number Publication date
EP1353376A3 (de) 2006-03-29
EP1353376B1 (de) 2007-08-29
US6668910B2 (en) 2003-12-30
DE60315911T2 (de) 2008-05-29
US20030188849A1 (en) 2003-10-09
EP1353376A2 (de) 2003-10-15

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee