DE602004003086D1 - Kühlkörper mit sichtbarem Logo - Google Patents

Kühlkörper mit sichtbarem Logo

Info

Publication number
DE602004003086D1
DE602004003086D1 DE602004003086T DE602004003086T DE602004003086D1 DE 602004003086 D1 DE602004003086 D1 DE 602004003086D1 DE 602004003086 T DE602004003086 T DE 602004003086T DE 602004003086 T DE602004003086 T DE 602004003086T DE 602004003086 D1 DE602004003086 D1 DE 602004003086D1
Authority
DE
Germany
Prior art keywords
heat sink
visible logo
logo
visible
sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE602004003086T
Other languages
English (en)
Other versions
DE602004003086T2 (de
Inventor
Ronald R Genova
Duane S Stackhouse
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Viavi Solutions Inc
Original Assignee
JDS Uniphase Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JDS Uniphase Corp filed Critical JDS Uniphase Corp
Publication of DE602004003086D1 publication Critical patent/DE602004003086D1/de
Application granted granted Critical
Publication of DE602004003086T2 publication Critical patent/DE602004003086T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
DE602004003086T 2003-03-25 2004-02-25 Kühlkörper mit sichtbarem Logo Expired - Fee Related DE602004003086T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US396908 2003-03-25
US10/396,908 US6870735B2 (en) 2003-03-25 2003-03-25 Heat sink with visible logo

Publications (2)

Publication Number Publication Date
DE602004003086D1 true DE602004003086D1 (de) 2006-12-21
DE602004003086T2 DE602004003086T2 (de) 2007-05-31

Family

ID=32824962

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602004003086T Expired - Fee Related DE602004003086T2 (de) 2003-03-25 2004-02-25 Kühlkörper mit sichtbarem Logo

Country Status (6)

Country Link
US (1) US6870735B2 (de)
EP (1) EP1463112B1 (de)
JP (1) JP2004297057A (de)
CN (1) CN100399553C (de)
CA (1) CA2458080A1 (de)
DE (1) DE602004003086T2 (de)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB0511692D0 (en) 2005-06-08 2005-07-13 Digital Projection Ltd Heat transfer apparatus
US7387155B2 (en) * 2005-11-15 2008-06-17 Shyh Ming Chen Colored and textured heat dissipating device
JP4968058B2 (ja) * 2007-12-28 2012-07-04 株式会社Ｊｖｃケンウッド 筐体外面に放熱フィンを有する電子機器
KR100901180B1 (ko) * 2008-10-13 2009-06-04 현대통신 주식회사 가변형의 방열통로가 구비된 방열부재 및 이를 이용한 ｌｅｄ 발광 조명등
KR100903192B1 (ko) * 2008-10-17 2009-06-17 현대통신 주식회사 나노스프레더를 이용한 이중 방열판 구조의 ｌｅｄ 발광 조명등
KR100902631B1 (ko) * 2008-10-24 2009-06-12 현대통신 주식회사 나노스프레더를 이용한 원형구조의 ｌｅｄ 발광 조명등
KR100905502B1 (ko) * 2008-11-10 2009-07-01 현대통신 주식회사 엘이디 조명 장치
US8745213B2 (en) 2008-12-19 2014-06-03 Openpeak Inc. Managed services platform and method of operation of same
US8199507B2 (en) * 2008-12-19 2012-06-12 Openpeak Inc. Telephony and digital media services device
US8612582B2 (en) 2008-12-19 2013-12-17 Openpeak Inc. Managed services portals and method of operation of same
US8615581B2 (en) 2008-12-19 2013-12-24 Openpeak Inc. System for managing devices and method of operation of same
US8856322B2 (en) 2008-12-19 2014-10-07 Openpeak Inc. Supervisory portal systems and methods of operation of same
US8788655B2 (en) 2008-12-19 2014-07-22 Openpeak Inc. Systems for accepting and approving applications and methods of operation of same
US8650290B2 (en) 2008-12-19 2014-02-11 Openpeak Inc. Portable computing device and method of operation of same
US8713173B2 (en) 2008-12-19 2014-04-29 Openpeak Inc. System and method for ensuring compliance with organizational policies
WO2012024418A1 (en) 2010-08-17 2012-02-23 Openpeak Inc. System containing a mobile communication device and associated docking station
US8650658B2 (en) 2010-10-25 2014-02-11 Openpeak Inc. Creating distinct user spaces through user identifiers
US8695060B2 (en) 2011-10-10 2014-04-08 Openpeak Inc. System and method for creating secure applications
US9342119B1 (en) * 2013-02-25 2016-05-17 Marvell International Ltd. Method and apparatus for dissipating heat in a mobile device
US11029059B2 (en) * 2013-10-01 2021-06-08 Amazon Technologies, Inc. Passive cooling system with ambient fluid collection
US8938547B1 (en) 2014-09-05 2015-01-20 Openpeak Inc. Method and system for data usage accounting in a computing device
US9100390B1 (en) 2014-09-05 2015-08-04 Openpeak Inc. Method and system for enrolling and authenticating computing devices for data usage accounting
US9350818B2 (en) 2014-09-05 2016-05-24 Openpeak Inc. Method and system for enabling data usage accounting for unreliable transport communication
US9232013B1 (en) 2014-09-05 2016-01-05 Openpeak Inc. Method and system for enabling data usage accounting
US20160071040A1 (en) 2014-09-05 2016-03-10 Openpeak Inc. Method and system for enabling data usage accounting through a relay
USD784922S1 (en) * 2016-01-04 2017-04-25 Myfc Ab Fuel cell based charger
JP1654099S (ja) * 2019-04-12 2020-03-02 放熱構造体

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Publication number Priority date Publication date Assignee Title
JPH0298961A (ja) * 1988-10-05 1990-04-11 Nec Corp ヒートシンク付半導体装置
JPH0529485A (ja) * 1991-07-23 1993-02-05 Nec Corp 集積回路パツケージ
JP2786764B2 (ja) * 1991-11-29 1998-08-13 シャープ株式会社 消耗部品を有する機器および消耗部品
US5461257A (en) * 1994-03-31 1995-10-24 Sgs-Thomson Microelectronics, Inc. Integrated circuit package with flat-topped heat sink
US5499450A (en) 1994-12-19 1996-03-19 Jacoby; John Method of manufacturing a multiple pin heatsink device
US5625228A (en) * 1995-02-27 1997-04-29 Rogren; Philip E. High performance semiconductor package with area array leads
US5547272A (en) * 1995-04-24 1996-08-20 At&T Global Information Solutions Company Modular cabinet bezel
JPH0939265A (ja) * 1995-07-29 1997-02-10 Seiko Epson Corp プリンタにおけるインクカートリッヂ並びにその識別装置
USD387333S (en) 1995-09-25 1997-12-09 Curtis Instruments, Inc. Heatsink enclosure for an electrical controller
USD381011S (en) 1996-03-15 1997-07-15 Motorola, Inc. Heat sink
US5811883A (en) * 1996-09-30 1998-09-22 Intel Corporation Design for flip chip joint pad/LGA pad
USD401225S (en) 1997-02-27 1998-11-17 Rockford Corporation Heat sink
USD400188S (en) 1997-05-22 1998-10-27 Hon Hai Precision Ind. Co., Ltd. Heat sink
USD398589S (en) 1997-05-27 1998-09-22 Dodson Douglas A Cooling device
USD425493S (en) * 1999-03-02 2000-05-23 Huntair Inc. Enclosure for electrical equipment
US6108194A (en) * 1999-03-10 2000-08-22 Lowel-Light Manufacturing, Inc. Electronics case and stand stabilizing weight
JP2001018048A (ja) * 1999-06-30 2001-01-23 Sony Corp 低融点金属材料の射出成形方法、射出成形装置及び筐体
SE521646C2 (sv) * 1999-11-23 2003-11-18 Ericsson Telefon Ab L M Täckande element för modul
CN1148628C (zh) 2000-05-10 2004-05-05 张玉媛 散热器
CN2445432Y (zh) * 2000-10-13 2001-08-29 魏文珍 散热器
US6343016B1 (en) 2000-12-20 2002-01-29 Enlight Corporation Heat sink
USD449587S1 (en) 2001-02-28 2001-10-23 Andrew Corporation Heat sink
US6552899B2 (en) * 2001-05-08 2003-04-22 Xybernaut Corp. Mobile computer
TW529737U (en) 2001-06-20 2003-04-21 Foxconn Prec Components Co Ltd Heat sink apparatus
USD464939S1 (en) 2001-12-26 2002-10-29 Thermal Integration Technology Inc. Heat sink

Also Published As

Publication number Publication date
CN100399553C (zh) 2008-07-02
EP1463112B1 (de) 2006-11-08
EP1463112A2 (de) 2004-09-29
US6870735B2 (en) 2005-03-22
JP2004297057A (ja) 2004-10-21
CA2458080A1 (en) 2004-09-25
US20040190256A1 (en) 2004-09-30
CN1542955A (zh) 2004-11-03
DE602004003086T2 (de) 2007-05-31
EP1463112A3 (de) 2005-12-21

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee