DE29806082U1 - Kühleinrichtung für eine zentrale Recheneinheit - Google Patents

Kühleinrichtung für eine zentrale Recheneinheit

Info

Publication number
DE29806082U1
DE29806082U1 DE29806082U DE29806082U DE29806082U1 DE 29806082 U1 DE29806082 U1 DE 29806082U1 DE 29806082 U DE29806082 U DE 29806082U DE 29806082 U DE29806082 U DE 29806082U DE 29806082 U1 DE29806082 U1 DE 29806082U1
Authority
DE
Germany
Prior art keywords
processing unit
central processing
cooling device
cooling
central
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE29806082U
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
YU SHU JEN
Ideal Electronics Inc
Original Assignee
YU SHU JEN
Ideal Electronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by YU SHU JEN, Ideal Electronics Inc filed Critical YU SHU JEN
Priority to DE29806082U priority Critical patent/DE29806082U1/de
Priority to US09/054,513 priority patent/US5959837A/en
Publication of DE29806082U1 publication Critical patent/DE29806082U1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
DE29806082U 1998-04-02 1998-04-02 Kühleinrichtung für eine zentrale Recheneinheit Expired - Lifetime DE29806082U1 (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE29806082U DE29806082U1 (de) 1998-04-02 1998-04-02 Kühleinrichtung für eine zentrale Recheneinheit
US09/054,513 US5959837A (en) 1998-04-02 1998-04-03 Heat-radiating structure for CPU

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE29806082U DE29806082U1 (de) 1998-04-02 1998-04-02 Kühleinrichtung für eine zentrale Recheneinheit
US09/054,513 US5959837A (en) 1998-04-02 1998-04-03 Heat-radiating structure for CPU

Publications (1)

Publication Number Publication Date
DE29806082U1 true DE29806082U1 (de) 1998-06-18

Family

ID=26061391

Family Applications (1)

Application Number Title Priority Date Filing Date
DE29806082U Expired - Lifetime DE29806082U1 (de) 1998-04-02 1998-04-02 Kühleinrichtung für eine zentrale Recheneinheit

Country Status (2)

Country Link
US (1) US5959837A (de)
DE (1) DE29806082U1 (de)

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FR2773941B1 (fr) * 1998-01-19 2000-04-21 Ferraz Echangeur di-phasique pour au moins un composant electronique de puissance
EP0932330B1 (de) * 1998-01-27 2001-11-28 Lucent Technologies Inc. Elektronisches Gerät
US7875440B2 (en) 1998-05-01 2011-01-25 Arizona Board Of Regents Method of determining the nucleotide sequence of oligonucleotides and DNA molecules
US6780591B2 (en) 1998-05-01 2004-08-24 Arizona Board Of Regents Method of determining the nucleotide sequence of oligonucleotides and DNA molecules
JP4015754B2 (ja) * 1998-06-23 2007-11-28 株式会社東芝 冷却装置および冷却装置を有する電子機器
CA2276795A1 (en) * 1998-07-01 2000-01-01 Keiichiro Ohta Heat sink device for electronic devices
TW450381U (en) * 1998-08-07 2001-08-11 Foxconn Prec Components Co Ltd Heat sink device
US6938679B1 (en) * 1998-09-15 2005-09-06 The Boeing Company Heat transport apparatus
JP2000216575A (ja) * 1999-01-22 2000-08-04 Toshiba Corp 冷却装置及び冷却装置を内蔵した電子機器
US6818395B1 (en) 1999-06-28 2004-11-16 California Institute Of Technology Methods and apparatus for analyzing polynucleotide sequences
TW448711B (en) * 1999-07-22 2001-08-01 Foxconn Prec Components Co Ltd Heat dissipation device
US6191946B1 (en) * 2000-01-03 2001-02-20 Thermal Corp. Heat spreader with excess solder basin
US6394175B1 (en) * 2000-01-13 2002-05-28 Lucent Technologies Inc. Top mounted cooling device using heat pipes
US6328097B1 (en) * 2000-06-30 2001-12-11 Intel Corporation Integrated heat dissipation apparatus
US6283201B1 (en) 2000-09-22 2001-09-04 Sui Yung Lee Heat-radiating structure
US6504721B1 (en) * 2000-09-29 2003-01-07 Intel Corporation Thermal cooling apparatus
US6336497B1 (en) * 2000-11-24 2002-01-08 Ching-Bin Lin Self-recirculated heat dissipating means for cooling central processing unit
US6418018B1 (en) * 2000-12-21 2002-07-09 Foxconn Precision Components Co., Ltd. Heat removal system
US7121327B2 (en) * 2000-12-28 2006-10-17 Hon Hai Precision Ind. Co., Ltd. Heat sink assembly
US6879629B2 (en) * 2001-03-12 2005-04-12 Hitachi Global Storage Technologies Netherlands, B.V. Method and apparatus for enhanced timing loop for a PRML data channel
CA2440754A1 (en) * 2001-03-12 2002-09-19 Stephen Quake Methods and apparatus for analyzing polynucleotide sequences by asynchronous base extension
CA2454252A1 (en) * 2001-07-13 2003-01-23 Coolit Systems Inc. Cooling apparatus for electronic devices
CA2352997A1 (en) 2001-07-13 2003-01-13 Coolit Systems Inc. Computer cooling apparatus
TW572246U (en) * 2001-07-26 2004-01-11 Jiun-Fu Liou Heat dissipating module with a self rapid heat conduction
KR20030010829A (ko) * 2001-07-27 2003-02-06 주식회사 태림테크 냉각장치
US7128131B2 (en) * 2001-07-31 2006-10-31 The Furukawa Electric Co., Ltd. Heat sink for electronic devices and heat dissipating method
US6487076B1 (en) * 2001-10-01 2002-11-26 Auras Technology, Ltd. Compact heat sink module
US7124806B1 (en) 2001-12-10 2006-10-24 Ncr Corp. Heat sink for enhanced heat dissipation
US20050039880A1 (en) * 2001-12-26 2005-02-24 Scott Alexander Robin Walter Computer cooling apparatus
US6626233B1 (en) * 2002-01-03 2003-09-30 Thermal Corp. Bi-level heat sink
US6959755B2 (en) * 2002-01-30 2005-11-01 Kuo Jui Chen Tube-style radiator structure for computer
WO2003088022A1 (en) * 2002-04-06 2003-10-23 Zalman Tech Co., Ltd Chipset cooling device of video graphic adapter card
US6668910B2 (en) 2002-04-09 2003-12-30 Delphi Technologies, Inc. Heat sink with multiple surface enhancements
TW588823U (en) * 2002-05-13 2004-05-21 Shuttle Inc CPU heat dissipation apparatus having heat conduction pipe
TW520146U (en) * 2002-06-13 2003-02-01 Hon Hai Prec Ind Co Ltd Heat pipe assembly
US20040035558A1 (en) * 2002-06-14 2004-02-26 Todd John J. Heat dissipation tower for circuit devices
US6830098B1 (en) * 2002-06-14 2004-12-14 Thermal Corp. Heat pipe fin stack with extruded base
US6980421B2 (en) * 2002-06-28 2005-12-27 Shuttle Inc. Front panel for personal computer
US6625021B1 (en) * 2002-07-22 2003-09-23 Intel Corporation Heat sink with heat pipes and fan
US7143819B2 (en) * 2002-09-17 2006-12-05 Hewlett-Packard Development Company, L.P. Heat sink with angled heat pipe
US7140422B2 (en) * 2002-09-17 2006-11-28 Hewlett-Packard Development Company, L.P. Heat sink with heat pipe in direct contact with component
US6712129B1 (en) * 2002-10-29 2004-03-30 Taiwan Trigem Information Co., Ltd. Heat dissipation device comprised of multiple heat sinks
US6861422B2 (en) * 2003-02-26 2005-03-01 Boehringer Ingelheim Pharma Gmbh & Co. Kg Dihydropteridinones, processes for preparing them and their use as pharmaceutical compositions
TWM240615U (en) * 2003-03-17 2004-08-11 Shuttle Inc Combination structure of CPU heat dissipating device and power supply
TWM240775U (en) * 2003-03-17 2004-08-11 Shuttle Inc Improved computer host frame
US20040252455A1 (en) * 2003-03-20 2004-12-16 Kuo Yi-Lung Computer cooling system with fan
US7167364B2 (en) * 2003-03-27 2007-01-23 Rotys Inc. Cooler with blower between two heatsinks
US7111667B2 (en) * 2003-03-31 2006-09-26 Micro-Star Int'l Co., Ltd. Heat dissipating device
US20040200608A1 (en) * 2003-04-11 2004-10-14 Baldassarre Gregg J. Plate fins with vanes for redirecting airflow
DE20309965U1 (de) * 2003-06-27 2003-09-04 Fujitsu Siemens Computers Gmbh Kühlung eines Computerbauteils
JP3521332B1 (ja) * 2003-08-06 2004-04-19 マイルストーン株式会社 撮像レンズ
US6779595B1 (en) * 2003-09-16 2004-08-24 Cpumate Inc. Integrated heat dissipation apparatus
TWM242770U (en) * 2003-10-03 2004-09-01 Molex Inc Heat sink module having dual fans
US6958915B2 (en) * 2003-10-07 2005-10-25 Hon Hai Precision Ind. Co., Ltd. Heat dissipating device for electronic component
US6918429B2 (en) * 2003-11-05 2005-07-19 Cpumate Inc. Dual-layer heat dissipating structure
US6967845B2 (en) * 2003-11-05 2005-11-22 Cpumate Inc. Integrated heat dissipating device with curved fins
US7169560B2 (en) 2003-11-12 2007-01-30 Helicos Biosciences Corporation Short cycle methods for sequencing polynucleotides
TWM249411U (en) * 2003-12-26 2004-11-01 Hon Hai Prec Ind Co Ltd Heat dissipation assembly
US7981604B2 (en) 2004-02-19 2011-07-19 California Institute Of Technology Methods and kits for analyzing polynucleotide sequences
US20050183849A1 (en) * 2004-02-19 2005-08-25 Ki-Tak Ko Heat radiating apparatus
US7011144B2 (en) * 2004-03-31 2006-03-14 Hewlett-Packard Development Company, L.P. System and method for cooling electronic assemblies
US20060032616A1 (en) * 2004-08-11 2006-02-16 Giga-Byte Technology Co., Ltd. Compound heat-dissipating device
KR100766109B1 (ko) 2004-10-20 2007-10-11 엘지전자 주식회사 방열장치
KR100683412B1 (ko) * 2005-06-11 2007-02-20 삼성전자주식회사 컴퓨터
CN100368756C (zh) * 2005-07-25 2008-02-13 苏州金美家具有限公司 热管座及其制造方法
US7666593B2 (en) 2005-08-26 2010-02-23 Helicos Biosciences Corporation Single molecule sequencing of captured nucleic acids
CN100464279C (zh) * 2005-11-17 2009-02-25 富准精密工业(深圳)有限公司 散热装置
US7447027B2 (en) * 2005-12-19 2008-11-04 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Hybrid heat dissipation device
US7542290B2 (en) * 2006-09-26 2009-06-02 Hewlett-Packard Development Company, L.P. Computer device cooling system
CA2573941A1 (en) 2007-01-15 2008-07-15 Coolit Systems Inc. Computer cooling system
CN101242732B (zh) * 2007-02-08 2011-01-05 鸿富锦精密工业（深圳）有限公司 散热装置组合
TWM334959U (en) * 2008-01-07 2008-06-21 Cooler Master Co Ltd Lateral extension radiator of heat-pipe
US20100079950A1 (en) * 2008-10-01 2010-04-01 Asia Vital Components (Shen Zhen) Co., Ltd. Radiating Fin and Thermal Module Formed Therefrom
US20100129140A1 (en) * 2008-11-26 2010-05-27 Coolit Systems Inc. Connector for a liquid cooling system in a computer
TWI445490B (zh) * 2010-09-27 2014-07-11 Asus Global Pte Ltd 散熱裝置
USD806646S1 (en) * 2015-02-27 2018-01-02 Johnson Controls Technology Company Battery module cooling fins and footings
CN105224054B (zh) * 2015-11-13 2018-11-02 屠雪祥 散热模组
US11592145B2 (en) 2019-01-10 2023-02-28 Hisense Laser Display Co., Ltd. Laser light source and laser projection device
US11570411B2 (en) * 2019-01-10 2023-01-31 Hisense Laser Display Co., Ltd. Laser light source and laser projection device

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US5285347A (en) * 1990-07-02 1994-02-08 Digital Equipment Corporation Hybird cooling system for electronic components
US5339214A (en) * 1993-02-12 1994-08-16 Intel Corporation Multiple-fan microprocessor cooling through a finned heat pipe
US5598320A (en) * 1995-03-06 1997-01-28 Ast Research, Inc. Rotable and slideble heat pipe apparatus for reducing heat build up in electronic devices
US5706169A (en) * 1996-05-15 1998-01-06 Yeh; Robin Cooling apparatus for a computer central processing unit

Also Published As

Publication number Publication date
US5959837A (en) 1999-09-28

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Legal Events

Date Code Title Description
R207 Utility model specification

Effective date: 19980730

R156 Lapse of ip right after 3 years

Effective date: 20020201