DE60010484D1 - Wärmeleitende vorrichtung für eine leiterplatte - Google Patents

Wärmeleitende vorrichtung für eine leiterplatte

Info

Publication number
DE60010484D1
DE60010484D1 DE60010484T DE60010484T DE60010484D1 DE 60010484 D1 DE60010484 D1 DE 60010484D1 DE 60010484 T DE60010484 T DE 60010484T DE 60010484 T DE60010484 T DE 60010484T DE 60010484 D1 DE60010484 D1 DE 60010484D1
Authority
DE
Germany
Prior art keywords
pcb
thermal device
thermal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60010484T
Other languages
English (en)
Other versions
DE60010484T2 (de
Inventor
P Payton
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Raytheon Co
Original Assignee
Raytheon Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Raytheon Co filed Critical Raytheon Co
Publication of DE60010484D1 publication Critical patent/DE60010484D1/de
Application granted granted Critical
Publication of DE60010484T2 publication Critical patent/DE60010484T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F42—AMMUNITION; BLASTING
    • F42B—EXPLOSIVE CHARGES, e.g. FOR BLASTING, FIREWORKS, AMMUNITION
    • F42B15/00—Self-propelled projectiles or missiles, e.g. rockets; Guided missiles
    • F42B15/08—Self-propelled projectiles or missiles, e.g. rockets; Guided missiles for carrying measuring instruments; Arrangements for mounting sensitive cargo within a projectile; Arrangements for acoustic sensitive cargo within a projectile
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F42—AMMUNITION; BLASTING
    • F42B—EXPLOSIVE CHARGES, e.g. FOR BLASTING, FIREWORKS, AMMUNITION
    • F42B15/00—Self-propelled projectiles or missiles, e.g. rockets; Guided missiles
    • F42B15/34—Protection against overheating or radiation, e.g. heat shields; Additional cooling arrangements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427—Housings
    • H05K7/1434—Housings for electronics exposed to high gravitational force; Cylindrical housings
DE60010484T 1999-09-02 2000-08-25 Wärmeleitende vorrichtung für eine leiterplatte Expired - Lifetime DE60010484T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US389655 1989-08-04
US09/389,655 US6351383B1 (en) 1999-09-02 1999-09-02 Heat conducting device for a circuit board
PCT/US2000/023388 WO2001017326A1 (en) 1999-09-02 2000-08-25 Heat conducting device for a circuit board

Publications (2)

Publication Number Publication Date
DE60010484D1 true DE60010484D1 (de) 2004-06-09
DE60010484T2 DE60010484T2 (de) 2005-04-14

Family

ID=23539157

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60010484T Expired - Lifetime DE60010484T2 (de) 1999-09-02 2000-08-25 Wärmeleitende vorrichtung für eine leiterplatte

Country Status (6)

Country Link
US (1) US6351383B1 (de)
EP (1) EP1212928B1 (de)
AU (1) AU7075000A (de)
DE (1) DE60010484T2 (de)
IL (2) IL148488A0 (de)
WO (1) WO2001017326A1 (de)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6735086B1 (en) 2003-05-13 2004-05-11 Raytheon Company Heat-conducting device for circuit board
US6778389B1 (en) * 2003-07-03 2004-08-17 Visteon Global Technologies, Inc. Microelectronic package with tubular housing
US7215557B2 (en) * 2003-08-27 2007-05-08 Visteon Global Technologies, Inc. Assembly comprising multiple microelectronic modules
DE102006022497B4 (de) * 2006-05-05 2008-02-28 Danfoss Drives A/S Zylinderförmige Baugruppe mit mindestens einem elektronischen Bauteil
US8879254B2 (en) * 2007-06-08 2014-11-04 Raytheon Company Methods and apparatus for compact active cooling
US8189345B2 (en) * 2008-06-18 2012-05-29 Lockheed Martin Corporation Electronics module, enclosure assembly housing same, and related systems and methods
US8773864B2 (en) * 2008-06-18 2014-07-08 Lockheed Martin Corporation Enclosure assembly housing at least one electronic board assembly and systems using same
US8942005B2 (en) * 2009-05-21 2015-01-27 Raytheon Company Low cost, high strength electronics module for airborne object
US8023267B2 (en) * 2009-06-19 2011-09-20 General Electric Company Avionics chassis
US8222541B2 (en) * 2009-06-19 2012-07-17 General Electric Company Avionics chassis
US8059409B2 (en) * 2009-06-19 2011-11-15 General Electric Company Avionics chassis
US7911796B2 (en) * 2009-06-19 2011-03-22 General Electric Company Avionics chassis
DE202014101560U1 (de) * 2014-04-02 2014-05-27 Bürkert Werke GmbH Elektronikeinheit eines Fluidsensors oder -ventils sowie Fluidsensor- oder Fluidventileinheit
DE102014011036A1 (de) * 2014-07-23 2016-01-28 Diehl Bgt Defence Gmbh & Co. Kg Sensorkopf für einen Flugkörper
KR101493755B1 (ko) * 2014-07-24 2015-02-16 주식회사 풍산 적층식 단위케이스와 단면 마운트 구조의 회로기판을 구비한 내충격형 포탄비행제어장치
US10327357B2 (en) * 2014-09-18 2019-06-18 Artesyn Embedded Computing, Inc. Thermal conduction to a cylindrical shaft
GB2533150A (en) * 2014-12-12 2016-06-15 Ge Oil & Gas Uk Ltd Locking mechanism
US9851187B2 (en) * 2015-03-12 2017-12-26 Raytheon Company Shock mitigation assembly for a penetrating weapon
US10267578B2 (en) 2015-08-04 2019-04-23 Raytheon Company Shape memory material based thermal coupler/decoupler and method
US10488167B2 (en) * 2017-01-30 2019-11-26 Raytheon Company Wedge-based heat switch using temperature activated phase transition material
KR102522375B1 (ko) * 2017-10-16 2023-04-18 삼성전자주식회사 모듈 착탈식 전자 장치
US11483942B2 (en) * 2019-12-18 2022-10-25 SpinLaunch Inc. Ruggedized avionics for use on kinetically launched vehicles
US11284522B2 (en) * 2020-02-07 2022-03-22 Polaris Industries Inc. Electronic assembly for a vehicle display
US10866036B1 (en) 2020-05-18 2020-12-15 Envertic Thermal Systems, Llc Thermal switch
US11457546B2 (en) * 2020-10-08 2022-09-27 Raytheon Company System and method for high voltage isolation with thermal conductivity
US20220344970A1 (en) * 2021-04-23 2022-10-27 Bae Systems Information And Electronic Systems Integration Inc. Pre-launch energy harvesting on aerodynamic systems

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3013745A (en) * 1958-02-25 1961-12-19 Short Brothers & Harland Ltd Method for cooling missile electronic packages
US3796254A (en) * 1972-05-25 1974-03-12 Us Army Temperature control conductive device
US4304294A (en) 1978-08-17 1981-12-08 Ford Aerospace & Communications Corp. Thermal energy switch
US4442475A (en) * 1982-07-06 1984-04-10 The United States Of America As Represented By The Secretary Of The Navy Tapered seal for flow-through module
FR2596231B1 (fr) * 1986-03-21 1993-01-29 Cit Alcatel Boitier pour circuits electroniques
US4903603A (en) * 1986-03-25 1990-02-27 Hughes Aircraft Company Stacked circuit cards and guided vehicle configurations
FR2656763A1 (fr) * 1989-12-29 1991-07-05 Cit Alcatel Boitier pour circuits electroniques immerges.
US5060115A (en) 1990-09-28 1991-10-22 The United States Of America As Represented By The Secretary Of The Navy Heat sink device for electronics modules packaged in cylindrical casings
FR2673354B1 (fr) 1991-02-27 1994-01-28 Telecommunications Sa Enceinte de reception de composants electroniques, embarquee sur un missile.
US5251099A (en) * 1992-08-14 1993-10-05 Hughes Aircraft Company High density electronics package having stacked circuit boards
US5621617A (en) * 1995-06-07 1997-04-15 Hughes Missile Systems Company Circuit card mounting system having a cylindrical housing and circular card locks
US6119573A (en) * 1997-01-27 2000-09-19 Raytheon Company Carbon fiber flocking for thermal management of compact missile electronics

Also Published As

Publication number Publication date
EP1212928B1 (de) 2004-05-06
US6351383B1 (en) 2002-02-26
EP1212928A1 (de) 2002-06-12
WO2001017326A1 (en) 2001-03-08
DE60010484T2 (de) 2005-04-14
IL148488A (en) 2010-05-17
AU7075000A (en) 2001-03-26
IL148488A0 (en) 2002-09-12

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Legal Events

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