DE60124996D1 - Haltevorrichtung für eine leiterplatte - Google Patents

Haltevorrichtung für eine leiterplatte

Info

Publication number
DE60124996D1
DE60124996D1 DE60124996T DE60124996T DE60124996D1 DE 60124996 D1 DE60124996 D1 DE 60124996D1 DE 60124996 T DE60124996 T DE 60124996T DE 60124996 T DE60124996 T DE 60124996T DE 60124996 D1 DE60124996 D1 DE 60124996D1
Authority
DE
Germany
Prior art keywords
pcb
holding device
holding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60124996T
Other languages
English (en)
Other versions
DE60124996T2 (de
Inventor
Koji Kuchiishi
Toshihiro Higuchi
Hideo Haga
Yasunobu Ikeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Application granted granted Critical
Publication of DE60124996D1 publication Critical patent/DE60124996D1/de
Publication of DE60124996T2 publication Critical patent/DE60124996T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0277—Details of the structure or mounting of specific components for a printed circuit board assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Telephone Set Structure (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Casings For Electric Apparatus (AREA)
DE60124996T 2000-04-04 2001-04-03 Haltevorrichtung für eine leiterplatte Expired - Lifetime DE60124996T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000102564A JP2001291978A (ja) 2000-04-04 2000-04-04 プリント基板保持構造
JP2000102564 2000-04-04
PCT/JP2001/002893 WO2001076339A2 (en) 2000-04-04 2001-04-03 Printed circuit board holding structure

Publications (2)

Publication Number Publication Date
DE60124996D1 true DE60124996D1 (de) 2007-01-18
DE60124996T2 DE60124996T2 (de) 2007-03-15

Family

ID=18616420

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60124996T Expired - Lifetime DE60124996T2 (de) 2000-04-04 2001-04-03 Haltevorrichtung für eine leiterplatte

Country Status (6)

Country Link
US (1) US6809933B2 (de)
EP (1) EP1183918B1 (de)
JP (1) JP2001291978A (de)
CN (1) CN1233209C (de)
DE (1) DE60124996T2 (de)
WO (1) WO2001076339A2 (de)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100652751B1 (ko) * 2005-08-06 2006-12-01 엘지전자 주식회사 카메라 및 기판 지지용 지지부재를 구비한 휴대용 단말기
TWM290364U (en) * 2005-11-23 2006-05-01 Inventec Corp Fixing structure of circuit board
JP4220522B2 (ja) * 2006-01-13 2009-02-04 株式会社東芝 電子機器
TWI387411B (zh) * 2007-02-28 2013-02-21 Finisar Corp 印刷電路板及捲帶系統
JP4974977B2 (ja) 2007-08-07 2012-07-11 パナソニック株式会社 基板の付属板取付構造
US8101706B2 (en) 2008-01-11 2012-01-24 Serina Therapeutics, Inc. Multifunctional forms of polyoxazoline copolymers and drug compositions comprising the same
JP2009171452A (ja) * 2008-01-18 2009-07-30 Hitachi Ltd 情報記録再生装置
JP4751469B2 (ja) 2009-12-04 2011-08-17 株式会社東芝 電子機器
EP2400578B1 (de) * 2010-06-25 2013-04-03 Samsung SDI Co., Ltd. Sekundärbatterie
CN202019374U (zh) * 2010-10-13 2011-10-26 中兴通讯股份有限公司 一种手机中用于断板结构主板的支撑板
JP2012151380A (ja) * 2011-01-21 2012-08-09 Sony Corp 表示装置および電子機器
JP6338821B2 (ja) * 2013-03-28 2018-06-06 住友建機株式会社 建設機械
JP2015223021A (ja) * 2014-05-22 2015-12-10 富士電機株式会社 電力変換装置
CN104185400B (zh) * 2014-06-17 2018-09-18 株洲南车时代电气股份有限公司 车载印制电路板的固定装置及机载设备
US20190304017A1 (en) * 2015-08-13 2019-10-03 Molbase (Shanghai) Biotechnology Co., Ltd. Compound-price calculating system and method thereof
JP7441938B2 (ja) * 2020-01-31 2024-03-01 ハンオン システムズ 電動圧縮機、インバーター組立用治具、及びインバーターの製造方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE7526707U (de) * 1975-08-22 1975-12-11 Siemens Ag Vorrichtung zur Aufnahme von Leiterplatten
US4688149A (en) * 1982-04-15 1987-08-18 Tokai Electric Wire Company, Ltd. Electrical junction box
US4821149A (en) * 1987-09-28 1989-04-11 Gte Communication Systems Corporation Substrate mounting device
JPH0316058U (de) * 1989-06-28 1991-02-18
JP2663917B2 (ja) * 1990-07-18 1997-10-15 ソニー株式会社 被取付体の取付機構
US5229923A (en) * 1990-07-30 1993-07-20 Motorola, Inc. Circuit supporting substrate mounting and retaining arrangement
US5144533A (en) 1991-06-27 1992-09-01 Motorola, Inc. Self-locking housing assembly
US5154631A (en) * 1991-12-30 1992-10-13 Ag Communication Systems Corporation Substrate mounting device
JP2557270Y2 (ja) * 1992-06-12 1997-12-10 アイワ株式会社 基板等の取付機構
US5581446A (en) * 1992-09-28 1996-12-03 Hitachi Telecom Technologies Ltd. Housing structure of electric appliance and disassembling method thereof
JP2833408B2 (ja) * 1993-03-25 1998-12-09 住友電装株式会社 筺体の基板固定構造
US5415573A (en) * 1993-07-08 1995-05-16 Molex Incorporated Edge mounted circuit board electrical connector
US5755585A (en) * 1995-02-24 1998-05-26 Hon Hai Precision Ind. Co., Ltd. Duplex profile connector assembly
US5961338A (en) * 1996-01-04 1999-10-05 Hon Hai Precision Ind. Co., Ltd. IC card connector
US5704489A (en) * 1996-02-14 1998-01-06 Smith; Paul E. SIMM/DIMM board handler
US5689405A (en) * 1996-09-25 1997-11-18 Itt Corporation IC card rear board support
US6324076B1 (en) * 1997-05-22 2001-11-27 Fci Americas Technology, Inc. Electronic card with shield cover having tabs where each tab engages with recess of corresponding shield cover
FR2803110B1 (fr) 1999-12-22 2002-05-17 Framatome Connectors Int Connecteur pour carte a microcircuit et procede de montage d'une telle carte dans ce connecteur

Also Published As

Publication number Publication date
US6809933B2 (en) 2004-10-26
DE60124996T2 (de) 2007-03-15
EP1183918B1 (de) 2006-12-06
EP1183918A1 (de) 2002-03-06
WO2001076339A2 (en) 2001-10-11
CN1365598A (zh) 2002-08-21
WO2001076339A3 (en) 2002-02-07
US20030007333A1 (en) 2003-01-09
JP2001291978A (ja) 2001-10-19
CN1233209C (zh) 2005-12-21

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: PANASONIC CORP., KADOMA, OSAKA, JP

8320 Willingness to grant licences declared (paragraph 23)