CN101242732B - 散热装置组合 - Google Patents

散热装置组合 Download PDF

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CN101242732B
CN101242732B CN2007102001723A CN200710200172A CN101242732B CN 101242732 B CN101242732 B CN 101242732B CN 2007102001723 A CN2007102001723 A CN 2007102001723A CN 200710200172 A CN200710200172 A CN 200710200172A CN 101242732 B CN101242732 B CN 101242732B
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radiator
plate
moving plate
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CN101242732A (zh
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吴弘毅
孙珂
叶振兴
陈明科
陈晓竹
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • H01L23/3672Foil-like cooling fins or heat sinks
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Domestic Hot-Water Supply Systems And Details Of Heating Systems (AREA)

Abstract

一种散热装置组合,包括一第一散热器及一第二散热器,所述第二散热器可活动地装设于所述第一散热器。本发明散热装置组合,其第二散热器可相对于第一散热器移动,从而可将所述第二散热器置于需要的位置来充分发挥所述散热器装置组合的散热作用。

Description

散热装置组合
技术领域
本发明涉及一种散热装置组合,尤指一种电脑主板的中央处理器散热装置组合。
背景技术
随着电脑的日益普及和其性能的不断提高,散热问题也越来越受到人们的重视。电脑主板上的中央处理器是电脑最主要的发热源,解决中央处理器散热问题是解决电脑散热问题的重中之重。通常用于中央处理器散热的散热装置和机箱的系统风扇是分开的,它们之间缺乏有效的联系,而使得系统风扇不能被充分有效的利用来帮助中央处理器散热。
发明内容
鉴于以上内容,有必要提供一种可以更加有效地利用系统风扇来帮助中央处理器散热的散热装置组合。
一种散热装置组合,包括一第一散热器及一第二散热器,所述散热装置组合进一步包括一动板,所述动板包括相互垂直连接的横折片及纵折片,所述第一散热器包括一定板,所述动板的横折片设有长滑槽,所述定板对应所述动板横折片的长滑槽设有安装孔,所述动板通过穿过其横折片的长滑槽及所述定板的安装孔的螺钉连接于所述定板,使所述动板可滑动地装设于所述定板,所述第二散热器包括一热管及一与所述热管相连的散热部,所述散热部包括一支架,所述支架上设有一安装孔,所述第一散热器上设有一插孔,所述热管可滑动且可转动地装插在所述插孔内,所述动板的纵折片通过螺钉与所述第二散热器的散热部相连接,所述动板的纵折片上设有一以所述第一散热器的插孔为圆心的圆弧形滑槽,一螺钉穿过所述第二散热器的支架的安装孔及所述动板的纵折片的滑槽将所述第二散热器可转动地安装于所述动板。
本发明散热装置组合,其第二散热器可相对于第一散热器移动,从而可将第二散热器置于机箱的系统风扇附近,利用系统风扇将第一散热器传导至第二散热器的热量带走。本发明散热装置组合有效利用系统风扇帮助所述第一散热器进行散热,从而可充分发挥所述散热器装置组合的散热作用。
附图说明
下面参考附图结合具体实施方式对本发明作进一步的说明。
图1为本发明散热装置组合较佳实施方式的立体分解图。
图2为本发明散热装置组合较佳实施方式的散热器的另一方向立体图。
图3为本发明散热装置组合较佳实施方式的散热器的立体组合图。
图4为本发明散热装置组合较佳实施方式于另一状态下的立体图。
图5为本发明散热装置组合较佳实施方式的使用状态图。
具体实施方式
请参考图1,本发明散热装置组合的较佳实施方式包括一风扇装置90、一第一散热器10、一第二散热器80、一定板50、一动板70、一扣具40及一背板60。
风扇装置90包括一风扇92及一装设风扇92的风扇架94,风扇架94的四个角分别设有安装孔96。
请结合图2,第一散热器10包括一底座20及一连接于底座20上的散热鳍片组30。底座20包括一用于承载连接散热鳍片组30的方板形承载部22和一与承载部22一体的呈扁圆柱体状的扣合部24,承载部22与扣合部24之间形成一圆环形凹槽26。散热鳍片组30概呈长方体状,其包括平行排列并垂直于底座20的承载部22的若干散热鳍片,散热鳍片组30在与所述若干散热鳍片垂直的侧面上于靠近第一散热器10顶面处各形成一卡槽34。第一散热器10装插两呈“C”形的热管36,其中,热管36的上段装插在散热鳍片组30内,所述热管36的下段装插在散热鳍片组30与底座20之间,以此来提高散热鳍片组30与底座20的热交换效率。第一散热器10于两热管36之间设有一插孔38。
第二散热器80包括一散热部和一导热部,所述散热部包括一支架84及一散热鳍片组86,所述导热部为一热管82。支架84概呈叉状,其叉柄上设有一安装孔88。热管82呈“L”形,其一个折段安装在支架84上并处于支架84的两个叉之间。散热鳍片组86包括平行排列的若干鳍片,所述若干鳍片垂直装插在热管82的所述一个折段上并固定于叉状支架84的两个叉上。
定板50概呈“凸”字形,其较宽部分的两端分别向下延伸出若干卡钩58,所述较宽部分中心对应风扇装置90的风扇92设一孔,所述较宽部分的四个角分别对应风扇装置90的安装孔96设有螺孔56;定板50的较窄部分形成一动板安装部52,动板安装部52靠近其自由端设有两个安装孔54。
动板70包括相互垂直连接的一横折片72和一纵折片74,横折片72和纵折片74均为矩形。横折片72对应于定板50的动板安装部52的两个安装孔54设有两个长滑槽73,两个长滑槽73垂直于纵折片74。纵折片74上从左到右设一圆弧形滑槽75。
扣具40包括一圆形扣环42及于扣环42外侧对称延伸出的四个凸舌44,扣环42对应卡入第一散热器10的底座20的凹槽26内,每个凸舌44上设有一孔46,每一孔46内装设有一螺钉48,螺钉48由上至下套设有弹簧49和卡环47,弹簧49位于凸舌44上方,卡环47位于凸舌44下方而使螺钉不脱离凸舌44。
背板60为“十”字形,其中心设一圆孔并在四个末端处各设有一螺孔62。
请继续参考图3及图4,装配时,四个螺钉98穿过对应的安装孔96和螺孔56将风扇装置90和定板50连接在一起,定板50上的卡钩58对应卡扣于第一散热器10的散热鳍片组30的卡槽34内,利用两螺钉76穿过动板70的横折片72的长滑槽73及定板50的动板安装部52的对应安装孔54将动板70可滑动地安装于定板50上,此时第一散热器10的插孔38处于动板70的圆弧形滑槽75的圆心位置,将第二散热器80的热管82的未装插热鳍片组86的一个折段可滑动地装插入第一散热器10的散热鳍片组30的插孔38内,利用一螺钉89穿过第二散热器80的支架84的安装孔88及动板70的纵折片74的滑槽75将第二散热器80可转动地安装于动板70上,扣具40的扣环42卡扣入第一散热器10底座20的凹槽26内。将上述过程装配组成的部分置于电脑主板(图未示)的中央处理器(图未示)上方,将背板60对应置于所述电脑主板的中央处理器下方,并将散热装置组合的扣具40通过螺钉48锁固在背板60上。
请继续参考图5,在使用散热装置组合时,可根据机箱2的系统风扇4的位置,伸缩或/和转动散热装置组合的第二散热器80,以将第二散热器80置于系统风扇4附近,从而有效地利用系统风扇4帮助所述中央处理器散热。伸缩第二散热器80时,将两螺钉76略微松释并推拉动板70,使动板70在螺钉76的约束下沿长滑槽73滑动,从而带动连接于动板70的第二散热器80伸缩滑动至适当位置,重新锁紧两螺钉76即可将动板70定位;转动第二散热器80时,将螺钉89略微松释而使其可沿滑槽75滑动,从而使得第二散热器80可以以其热管82的插入第一散热器10的插孔38内的折段为轴在动板70的滑槽7 5的约束下转动至适当位置,重新锁紧螺钉89即可将第二散热器80定位。通过移动动板70和第二散热器80,可将第二散热器80置于机箱2的系统风扇4附近,利用系统风扇4将第一散热器10传导至第二散热器80的热量带走,从而可充分发挥所述散热装置组合的散热作用。

Claims (6)

1.一种散热装置组合,包括一第一散热器及一第二散热器,其特征在于:所述散热装置组合进一步包括一动板,所述动板包括相互垂直连接的横折片及纵折片,所述第一散热器包括一定板,所述动板的横折片设有长滑槽,所述定板对应所述动板横折片的长滑槽设有安装孔,所述动板通过穿过其横折片的长滑槽及所述定板上的安装孔的螺钉连接于所述定板,使所述动板可滑动地装设于所述定板,所述第二散热器包括一热管及一与所述热管相连的散热部,所述散热部包括一支架,所述支架上设有一安装孔,所述第一散热器上设有一插孔,所述热管可滑动且可转动地装插在所述插孔内,所述动板的纵折片通过螺钉与所述第二散热器的散热部相连接,所述动板的纵折片上设有一以所述第一散热器的插孔为圆心的圆弧形滑槽,一螺钉穿过所述第二散热器的支架的安装孔及所述动板的纵折片的滑槽将所述第二散热器可转动地安装于所述动板。
2.如权利要求1所述的散热装置组合,其特征在于:所述第二散热器的热管呈“L”形,其一个折段装插在所述第一散热器的插孔内,另一个折段装设所述第二散热器的散热部。
3.如权利要求2所述的散热装置组合,其特征在于:所述横折片装设于所述第一散热器,所述纵折片与所述第二散热器的散热部相连。
4.如权利要求1或3所述的散热装置组合,其特征在于:所述动板的长滑槽开设于所述横折片,所述长滑槽垂直于所述纵折片,所述定板设于所述第一散热器顶部,所述定板沿所述第一散热器的插孔方向凸伸出一个动板安装部,所述定板的安装孔设于所述安装部。
5.如权利要求4所述的散热装置组合,其特征在于:所述第二散热器的散热部还包括一个散热鳍片组,所述散热鳍片组包括若干平行排列的鳍片,所述鳍片装插在所述热管上未装插入所述第一散热器的插孔内的一折段上。
6.如权利要求4所述的散热装置组合,其特征在于:所述散热装置组合还进一步包括一安装于所述定板的风扇及一卡合于所述第一散热器底部的扣具。
CN2007102001723A 2007-02-08 2007-02-08 散热装置组合 Expired - Fee Related CN101242732B (zh)

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US11/861,301 US7701708B2 (en) 2007-02-08 2007-09-26 Heat dissipation assembly

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