M317606 八、新型說明： 【新型所屬之技術領域】 本創作係有關於一種散熱裝置，特別係指組裝於一電 子設備中的散熱裝置。 【先前技術】 電子設備的電路板上皆設有不同的電子元件，例如 CPU等之電子元件，但隨著電子相關產業的迅速發展，令 ^PU運算速度效率快速地提昇，卻使得其發熱量也相對地 t來愈高，甚至因機殼等的封閉因素，也使得熱量更加提 昇。因此，為了保持電子設備於運作上的穩定性，電子元 件的散熱功能就屬於相當重要的一環。 目前用於各種電子元件的散熱裝置具有許多型式，上 公^民國95(西元鳩)年.3月工日，證書號數:職咖 =散熱裝置」為例.，其揭露有一散熱模組、複數個 管、一吸熱模組、-夾具以及―固定模組。其中，散熱米 組係由複數個並排設置的散熱料組成，每—導就管;^ 模組裝配，且導熱管另—端配置於吸熱模組中 ^模:ΐ在—發熱部件（電子元件）和吸熱模組外側，i 與吸熱模牛和吸熱:莫組之間，用以將侧 組合方式騎接。料、34之吸熱模組與導熱管的 上述之散熱裝置’雖可達到提供電子元件發散熱 但吸熱模組係與導熱管相互 ； ㈡設備中時，裝配者勢必要先= 、、、且係料熱讀接後，才可裝配其它所述之構件於電^ M317606 設2中，因此，對於裝配者而言，該散熱裝置需要多了解 此知接之方式及步驟，難免組合上仍有不具便利性之處。 另外，特別值得一提的是，因焊接大多係採用錫谭之 方式但其使用之錫貧（條）内卻混合有錯的金屬成份， 在近幾年來如歐盟等之國家已明禁電子設備、產品中皆不 =有含錯之焊錫’因此’含有錯之錫焊製程已無法符合 國戶:明文規範之潮流，對於研究人Μ來說，其所研發出 之產:口口，能角符合無錫（錯）製程之潮流，即是為一‘要 之课題。 究並：L本，創作人有感上述缺失之可改善’乃特潛心研 上述缺失之本創作。改善 【新型内容】 本創作之目的，係提供一種易拆裝之散熱 1 ?供組裝於電子設備的電路板及電子元件上:整體結ς 早’且在整體結構組合過程中，不使用任何的焊接 ^可^電子元件空冷散熱之效果，從而提升組裝者^節 ’、、且衣日雜功效，且能達到符合無勸 為達上述之目的，本創作提供_種易拆 置，包括·-對固定塊，其側緣面分別形成有一二 可各形成凹洞係與該槽執連通；一或一， 於該對固t塊之間，且形成有容置槽，·至少二.係 端係裝配於所述之容置槽中；以及一 Γ官，/、一 ::::鬼之槽軌中’該固定片可形成有具彈性==該 該卡合部可雜地卡合於上叙凹洞中，㈣以片^伸 M317606 有彈性臂係彈性地抵壓該熱管或其中一該導熱塊。 上述之固定塊係可提供固設於一電路板上，而該電路 板上設有電子元件係位於該對固定塊之間，其中一 係接觸該電子元件。 本創作具有之效益：本創作所提供之散熱裝置，其整 體結構於組合過程中，不使用任何焊接的方式，即可達 電子元件空冷散熱之效果，進而提供組裝者具節省組裝日士 •間的目的，且同時達到符合無錫（鉛）製程的目的。、 為使能更進一步瞭解本創作之特徵及技術内容，請參 閱=下有關本創作之詳細說明與附圖，然而所附圖式=^ 供麥考與說明用，並非用來對本創作加以限制者。 【實施方式】 請參閱第-圖至第三圖所示，係為本創作易拆裝之散 熱裝置的第一實施例。本創作之散熱裝置1 〇 〇係可提供 …δ於电子s又備的電路板7 0 〇上，而該電路板γ 〇 〇 奉係裝設有如CPU等之運作時會產生熱能的電子元件8 〇M317606 VIII. New description: [New technical field] This creation is about a heat sink, especially the heat sink assembled in an electronic device. [Prior Art] Electronic devices are equipped with different electronic components, such as electronic components such as CPUs. However, with the rapid development of the electronics-related industry, the efficiency of the ^PU operation speed is rapidly increased, but the heat is generated. The higher the relative t is, the higher the heat is even due to the sealing factor of the casing. Therefore, in order to maintain the operational stability of the electronic device, the heat dissipation function of the electronic component is a very important part. At present, there are many types of heat sinks for various electronic components, such as the public office of the Republic of China (Eight Yuan, the year of March, the number of the certificate: the service of the coffee = heat sink), which discloses a heat dissipation module, A plurality of tubes, a heat absorbing module, a fixture, and a "fixed module." The heat-dissipating rice group is composed of a plurality of heat-dissipating materials arranged side by side, each of which is arranged in a tube; the module is assembled, and the other end of the heat-conducting tube is disposed in the heat-absorbing module; the mold is: the heat-generating component (electronic component) ) and the outside of the heat absorption module, i and the endothermic mold cattle and the heat absorption: the mo group, used to ride the side combination. The material, the heat-dissipating device of the heat-absorbing module of 34 and the above-mentioned heat-dissipating device of the heat-conducting tube can provide heat dissipation for the electronic component but the heat-absorbing module and the heat-conducting tube; (2) When the device is in use, the assembler must first =, , and After the material is hot-read, the other components can be assembled in the electric device M317606. Therefore, for the assembler, the heat sink needs to know more about the way and the steps of the connection, and it is inevitable that the combination still has no Convenience. In addition, it is particularly worth mentioning that most of the welding is made of tin tan, but the tin lean (strip) used in it is mixed with the wrong metal components. In recent years, countries such as the European Union have banned electronic equipment. In the product, there is no solder with the wrong solder. Therefore, the soldering process with the wrong soldering can no longer meet the trend of the national standard: the research and development, the research and development of the product: mouth, energy angle In line with the trend of Wuxi (wrong) process, it is a question of choice. Study and: L, the creator feels that the above-mentioned deficiency can be improved. Improvement [New Content] The purpose of this creation is to provide an easy-to-assemble heat dissipation for the assembly of electronic boards and electronic components: the overall structure is early and does not use any of the overall structural combinations. Welding ^ can ^ the effect of air-cooling and cooling of electronic components, thereby improving the assembler's ^ section, and the day-to-day effect of the clothing, and can achieve the above purpose in accordance with the non-advisance, this creation provides easy to disassemble, including · For the fixed block, the side edge faces are respectively formed with two holes, each of which can form a cavity system to communicate with the groove; one or one, between the pair of solid t blocks, and formed with a receiving groove, at least two. The end system is assembled in the accommodating groove; and a sergeant, /, a:::: ghost groove track, the fixing piece can be formed with elasticity == the engaging portion can be miscellaneously engaged In the upper hole, (4) the elastic tube is elastically pressed against the heat pipe or one of the heat conducting blocks by the sheet M317606. The above fixed block can be fixed on a circuit board, and the electronic component on the circuit board is located between the pair of fixed blocks, wherein the electronic component is contacted. The benefits of this creation: the heat dissipation device provided by the creation, the overall structure of the assembly process, without any soldering method, can achieve the effect of air cooling and cooling of the electronic components, thereby providing the assembler with a saving assembly of the Japanese and the The purpose, and at the same time, achieve the purpose of meeting the Wuxi (lead) process. In order to further understand the characteristics and technical content of this creation, please refer to the following for a detailed description of the creation and the drawings. However, the drawing =^ for the McCaw and the description is not intended to limit the creation. By. [Embodiment] Please refer to the first to third figures, which is the first embodiment of the heat dissipating device which is easy to assemble and disassemble. The heat sink 1 of the present invention can provide ... δ on the electronic board and the circuit board 70 〇, and the circuit board γ is equipped with an electronic component 8 which generates heat energy when operating, such as a CPU. 〇
0。該散熱裝置10◦係包括有一對固定塊i、一導熱塊 2、至少一熱管3及一固定片4。 、A 該對固定塊1係為二個，且係為相對稱之結構〆可係 由金屬件或塑膠件所製成。該對固定塊1内统緣面的近上、 方處分別開設有沿X軸方向呈一水平設置的槽執丄1，及 分別沿Z軸方向形成一凹洞丄2，其分別與槽執工工 通。 口亥對固疋塊1内側緣面並分別沿Z軸方向凹設形成 有一凹槽1 3，且於内側緣面的下方處沿χ軸方向各凹設 M317606 有一呈水平設置的開口槽丄4，及 數個定位孔1 5。 。軸方向分別開設有 该導熱塊2係由高導熱0. The heat dissipating device 10 includes a pair of fixing blocks i, a heat conducting block 2, at least one heat pipe 3 and a fixing piece 4. A, the pair of fixed blocks 1 are two, and are symmetrical structures, which can be made of metal parts or plastic parts. A groove stopper 1 disposed horizontally along the X-axis direction is respectively disposed at a position near the upper side of the inner edge surface of the fixed block 1, and a cavity 丄2 is formed along the Z-axis direction, respectively Workers and workers. The inner edge of the solid block 1 is recessed and formed with a groove 13 in the Z-axis direction, and each of the inner edge faces is recessed in the direction of the x-axis. M317606 has a horizontally disposed open slot 4 , and several positioning holes 1 5 . . The axial direction is respectively opened, the heat conducting block 2 is made of high thermal conductivity
任何其它具有吸熱特性之金屬材，該導埶紹或 軸方向凹設形成有至少一容置槽2丄。…、鬼2上表面沿X 該熱管3可係為L㉟、υ型或呈設 1係可依實際需求而設，於本創作 ，冲其數 3在整b體之結構係為所屬二^ 者所自知，在此不再加以贅述。 1 沾該固以4係具有-本體4l,i設於該本體41 上開口 4 2 —由該本體41 —端斜向彎折以具有彈性 ::言部43，-對應於該開口42自該本體41内側^ 鳊b z軸而向下彈性地延伸彆曲的彈性臂4 4，及一由該 本體4 1另-沿z軸向上_折延伸的推移部4 $，其係 與该彈性臂4 4相對的設置’而與該卡合部4 3位於相同 側0 組I時，該對固定塊1係相對地可供固設於該電路板 7 0 〇上，而位於該電子元件8 〇 〇兩侧。其中，該電路 板7 〇 〇占若具有螺柱（未圖示）時，每一定位孔1 5可供 固疋元件（如螺栓）a穿過與該螺柱螺鎖結合，即可使該 對固定塊1固設於電路板7 0 0上。 另外，本創作可進一步包括一鎖固板件5，其設有複 數個結合柱5 1。其中，當該電路板7 0 0上係具有孔洞 7 1時，可將該鎖固板件5與該對固定塊1相對地設置於 電路板7 0 〇兩侧，令每一固定元件a可分別穿過相應的 M317606 定位孔1 5及電路板7 0 0的孔洞7 1，進而與鎖固板件 5的結合柱5 1螺鎖結合，藉由鎖固板件5使固定塊丄可 穩固結合於電路板7 0 0上。 其次，該對固定塊1之定位孔i 5可係為圓孔型、沉 孔型或橢圓孔型等之設計，當係為橢圓孔型時，透過固定 元件a及橢圓孔型之定位孔1 5的相互配合，以達到使該 對固定塊1可於電路板7 〇 〇上適當地調整X軸或γ輛之 固定位置。Any other metal material having endothermic properties, the guide or the axial direction is recessed to form at least one receiving groove 2丄. ..., the upper surface of the ghost 2 along the X heat pipe 3 can be L35, υ type or set 1 system can be set according to actual needs, in this creation, the number of 3 in the whole b body structure is the two I know that I will not repeat them here. 1 affixed to the solid 4, has a body 41, i is disposed on the body 41, the opening 4 2 - is bent obliquely from the end of the body 41 to have elasticity:: the word 43, - corresponding to the opening 42 from The inner side of the body 41 is 鳊bz axis and elastically extends downwardly to the elastic arm 44, and a pushing portion 4$ which is further extended by the body 4 1 along the z-axis, and the elastic arm 4 4, the opposite setting 'when the engaging portion 43 is located on the same side 0 group I, the pair of fixed blocks 1 are relatively fixed to the circuit board 70 〇, and located at the electronic component 8 〇〇 On both sides. Wherein, when the circuit board 7 has a stud (not shown), each positioning hole 15 can be used for the fixing member (such as the bolt) a to be coupled with the stud screw, so that the board The fixing block 1 is fixed on the circuit board 700. Further, the present creation may further include a locking plate member 5 provided with a plurality of coupling posts 51. Wherein, when the circuit board 700 has a hole 7 1 , the locking plate 5 and the pair of fixed blocks 1 can be disposed on opposite sides of the circuit board 70 , so that each fixing component a can be Passing through the corresponding M317606 positioning hole 15 and the hole 7 1 of the circuit board 700, respectively, and then screwing with the coupling post 5 1 of the locking plate 5, the fixing block can be stabilized by the locking plate 5 Combined on the circuit board 700. Secondly, the positioning hole i 5 of the pair of fixing blocks 1 can be designed as a circular hole type, a counterbore type or an elliptical hole type. When the system is an elliptical hole type, the fixing hole a and the elliptical hole type positioning hole 1 are transmitted. The mutual cooperation of 5 is such that the pair of fixed blocks 1 can properly adjust the fixed position of the X-axis or the gamma vehicle on the circuit board 7 。.
當該對固定塊1結合於電路板7 〇 〇上時，電子元件 8 0 〇兩侧緣可分別位於固定塊丄之開口槽1 4中，可令 固定塊1分別抵靠電子元件8 〇 〇兩侧緣（如第三圖）。7 該導熱塊2可沿Z轴方向由上而下地自該對固定塊 1之凹槽13置放至電子元件8 〇 〇表面上，以使導埶塊 2組裝於該對取塊！之間，且令導熱塊2下表面的接 面牙貝係元全接觸電子元件8 〇 〇表面。 、播t熱！ 3之一端(吸熱端)係可裝配於導熱塊2之容 Μ曰’其中’容置槽21數量可依熱管3數量而配 後’該固定片4可沿著χ軸方向而水平地由該對固 =塊1之槽執1 1滑人（即沿槽執i i平行之方向）， 生地卡合於凹洞12中(如第二㈣，同時 使弹性臂44可彈性地抵壓熱管3，使埶 盥 : 2緊密貼合，且同時八導㈣3可與導熱塊 合（如第三圖)以熱塊2與電子元件80〇緊密貼 固定片4的推移部4 再沿著X軸方向推移 反之，欲拆告p時，使用者可按壓 5，使卡合部4 3能離開凹洞， 9 M317606 反 可拆卸固定片4，之後可再依照 2二反向捕即可拆卸本創作之散熱裝置，在 本創作不再加以贅述。 υ 任此 另外，上述之固定片4的推移部4 5，其可提供 者手指㈣此處，即可令固定片4於槽軌i i中滑移: 如第四圖所示，係為本創作 例，係可應用於上述之第—t =/—^例’此實施 门忐―^ 罘1施例中，且與第一實施例不 :處在於:該固定片4之彈性臂44可沿X軸方向而向上 隆，一呈半圓弧形狀的隆起部44ι，而該熱管^之 一知可位於該隆起部44 1中，日兮政上如y 抵壓該熱管3。 中增起部441可彈性 如第五圖所示’係為本創作之第三實施例，此實施 例’係可應用於上述之第一實施例中，且與第一及第二實 =例不同處在於：該固定片4之彈性臂44末端沿χ轴方 向開设有-適當距離之剖槽4 4 2，以使該彈性臂4 4呈 一分叉狀，該熱管3之一端可位於該剖槽4 4 2中，且令 該彈性臂44係彈性地抵壓該熱管3。 办=第六圖所示，係為本創作之第四實施例（煩請配合 麥閱第一圖），此實施例，係於上述各實施例中，可進一 步在該對固定塊丄内侧緣面上方處，可沿χ、ζ軸方向而 形成有導引斜面1 6，其係位於槽執丄丄上方處，藉由導 引斜面16以使該固定片4可沿2軸方向由上往下地喪 設入槽軌i 1 +，並同時使固定片4之卡合部43能扣入 凹洞1 2中。 進一步地細說，當固定塊1進一步形成有導引斜面1 M317606 6時，可提供裝配者有二種組宏' 係為：將固定片4沪y φ 疋片4之方式，第一種 向)，而滑入槽執沿槽執11平行之方 軌1 1垂直之方向），自導4沿z軸方向（即沿槽 自S引斜面1 β嵌# A 士接# ,When the pair of fixed blocks 1 are coupled to the circuit board 7 , the two sides of the electronic component 80 can be respectively located in the open slots 14 of the fixed block ,, so that the fixed blocks 1 respectively abut against the electronic components 8 〇〇 Both sides (as shown in the third picture). 7 The heat conducting block 2 can be placed from the recess 13 of the pair of fixed blocks 1 to the surface of the electronic component 8 沿 由 from top to bottom in the Z-axis direction, so that the guide block 2 is assembled to the pair of pick-up blocks! Between the two, the contact scallops on the lower surface of the thermal block 2 are in full contact with the electronic component 8 〇 。 surface. , broadcast t hot! The one end (the heat absorbing end) can be assembled to the heat conducting block 2, wherein the number of the receiving grooves 21 can be matched according to the number of the heat pipes 3, and the fixing piece 4 can be horizontally arranged along the z-axis direction. Holding the slider 1 in the slot of the solid block 1 (ie, in the direction parallel to the slot ii), the ground is engaged in the recess 12 (such as the second (four), while the elastic arm 44 elastically presses the heat pipe 3, The 埶盥: 2 is closely attached, and at the same time, the eight-way (four) 3 can be combined with the heat-conducting block (as shown in the third figure), and the heat-transfer 2 and the electronic component 80 〇 are closely attached to the urging portion 4 of the fixed piece 4 and then moved along the X-axis direction. On the contrary, when the p is to be dismantled, the user can press 5 to make the engaging portion 4 3 clear the recess, and the 9 M317606 can be detachably attached to the fixing piece 4, and then the heat can be disassembled according to the 2nd reverse catching. The device will not be described in detail in the present application. 任 In addition, the pushing portion 45 of the above-mentioned fixing piece 4 can provide a finger (four) here, so that the fixing piece 4 can slide in the groove track ii: The fourth figure is a creation example, which can be applied to the above-mentioned -t = / - ^ example 'this implementation threshold ^ ^ 施 1 example, and with the first real For example, the elastic arm 44 of the fixing piece 4 can be upwardly extended along the X-axis direction, and a ridge portion 44 ι having a semi-circular arc shape, and one of the heat pipes can be located in the ridge portion 44 1 . In the Japanese government, the heat pipe 3 is pressed against the heat pipe 3. The intermediate portion 441 can be elastic as shown in the fifth figure, which is the third embodiment of the creation, and this embodiment can be applied to the first embodiment described above. The difference between the first and second embodiments is that the end of the elastic arm 44 of the fixing piece 4 is provided with a proper distance of the slot 4 4 2 in the direction of the x-axis so that the elastic arm 4 4 is In a bifurcated manner, one end of the heat pipe 3 can be located in the dissection groove 442, and the elastic arm 44 elastically presses the heat pipe 3. The sixth figure shows that it is the fourth of the creation. Embodiments (please cooperate with the first drawing of the wheat), in this embodiment, in the above embodiments, the guide can be further formed along the χ and ζ axis directions at the upper edge of the pair of fixed blocks The inclined surface 16 is located above the groove holder, and the inclined surface 16 is guided to make the fixing piece 4 fall into the groove track from the top to the bottom in the 2-axis direction. 1 +, and at the same time, the engaging portion 43 of the fixing piece 4 can be buckled into the recess 1 2. Further, when the fixing block 1 is further formed with the guiding inclined surface 1 M317606 6, two types of assemblers can be provided. The group macro ' is: the way to fix the piece 4 y φ 疋 4 4, the first type), and slide into the slot to hold the 11 parallel square track 1 1 vertical direction), the self-guide 4 along the z Axis direction (ie, along the slot from the S-slope 1 β embedded # A士接#,
中，即可將固定片4組裝於該對固定塊^；^軌U 組裝時’二散熱塊6之容置槽61係可同時容置該熱 官3之另一端（冷凝端），且二散熱塊6的通孔6 2可供如 螺絲、螺栓等之固定件（未圖示）穿過，進而使散熱塊6可 鎖固於容置該電路板7 〇 〇的機殼（未圖示）内部或外 部，當然散熱塊6也可提供結合於任何其它裝置上，在此 不再加以贅述。 另，於上述各實施例中，係可進一步包括至+ 一 =，其可為與導熱塊2相同之材質，而具有散㈣^ ^屬材。散熱塊6之數量可依實際需求設有—個或二個， ^圖式中係以二個為例’二散熱塊6分別相凹 有一對應之容置槽61，及開設有數個通孔62。又开4 經由上述之說明，當電子元件8 〇 〇運作時所產生之 熱能，其可經由導熱塊2快速地傳導至熱管3，而藉由熱 管3能將熱能快速散熱，即可達到空冷散熱的目的，且再 藉由散熱塊6可鎖固於機殼，令熱管3吸熱端與冷凝端之 間此達到快速的熱交換，更可達到使電子元件8 Q Q快速 散熱之功效。其次，本創作之導熱塊2平整度佳，其可達 到與電子元件8 0 0完全地接觸，以達成良好導熱效果。 再者’本創作之散熱裝置1 0 0，其整體結構設計簡單 11 M317606 化，且在整體結構組合過程中，不需任何的焊接，藉由上 述之組裝方式，即可達到電子元件8 0 0空冷散埶之效 果，進而提供組裝者具節省組裝時間的目的，同時能 到，錫（錯）製程的目的，以符合世界各國所明定之條文 規範。 請參閱第七圖及第八圖所示，係為本創作之第五實施 例，其與前述之各實施例不同處在於：係進一步地呈有一 對導熱塊2、2’（即增設有另一導熱塊2’），而該對導 熱塊2、2’相對地皆凹設形成有容置槽2丄、2丄，。 組裝該對導熱塊2、時’可先將其中—導敎塊2 裝配於該對固定塊i之間，令該導熱塊2下表面完全接觸 電子7L件8 0 0表面。接著，可將熱管3配設於執塊 2_21中，之後，將另-導熱塊2,再裝配；該 對固疋塊1之間，使該導熱塊2，之容置槽21，容置孰 管3。最後，將固定片4組裝於該對固定塊工之栌軌 中，即可使彈性臂4 4彈性地抵壓該導熱塊2，^面。藉 ^，可達到與前述各實施例所述之相同功效，且可應用於 前述各實施例中；並且，在此實施例中，也係 一式 二個散熱塊β，以進一步地結合於熱管3另二端、。 ' 如第九圖所示，係為本創作之第六實施例，在此實施 例，係於上述之第五實施例中，進—步地在該對導孰塊 2、2，一側緣面可分別開設有一插置孔2 2、2 2， 及，別形成有-傾斜面23、23,；或可於二側緣面各 開设有一插置孔2 ?、？ 9， , η - * . 直札△乙 及—表面分別形成一傾斜 面2 3、2 3，，在此圖式中，係各以一插置孔2 2、2 12 M317606 2，及各一傾斜面23、23，為例。其中，二插置孔2 2、2 2 ;中可同時供一彈性件b插設，以彈性地連結該 對導熱塊2、2 。該彈性件b大致可呈ϋ型體或门型 體，其可由彈線或板件所製&，而彈性件乜㈣地兩側係 略呈傾斜狀。 藉由彈性件b之效用，可使該對導熱塊2相對應之二 傾斜面23、23相互接觸，使該對導熱塊2、2’可 呈開口狀，裝配者可將熱管3裝配於該對導熱塊2、2, ^間。當固^片4之彈性臂44抵壓其中-導熱塊2，時 (睛配合㈣第人圖所示），即可使該對導熱塊2、2，封 閉而扣合夾持住該熱管3。 ，外，前述之第六實施例，當然係可進一步應用於上 =貫施例之二散熱塊6中，係於該二散熱塊卜侧緣面 :Γ面有一插置孔6 3，及表面分別形成-相對應之 1面6 4 ;或可於二側緣面各開設有一插置孔6 3，及 傾斜面“（未圖示)。其中，二散熱 同時供另一彈性件b插設，以使該二 放…塊6可達到與該對導熱塊2、2，相同之功效。 2之2 —提@是’在上述各實施例中，該導熱塊 之备置42 1、該對導熱塊2、2，之容置槽2丄、2 ’二:散熱塊6之容置槽61中皆可進一步塗佈有散 月C未圖不），可加速散熱之功效。 拘限述㈣本㈣讀心行實㈣，非因此即 内容所Ο 圍，故舉凡壤用本創作說明書及圖式 ，、、、之專效結構變化，均同理皆包含於本創作之範圍 13 M317606 内，合予陳明。 【圖式簡單說明】 第一圖為本創作第一實施例之立體分解圖。 第二圖為本創作第一實施例之立體組合圖。 第一A圖為第二圖之a部份的局部詳圖。 =三圖為本創作第一實施例之前視組合圖。 第四圖為本創作第二實施例之立體分解圖。 φ *五圖為本創作第三實施例之立體分解圖。 =六圖為本創作第四實施例之前視組合圓。 第七圖為本創作第五實施例之立體分解圖。 第八圖為本創作第五實施例之立體組合圖。 第九圖為本創作第六實施例之局部立體分解圖。 【主要元件符號說明】 散熱裝置 1 0 0 固定塊 1 槽執 1 .1 凹洞 1 2 凹槽 1 .3 開口槽 1 4 定位孔 15 導引斜面 16 導熱塊 2 ί、2， 容置槽 2 1、2 1 ’ 插置槽 2 2、2 2 傾斜面 2 3、2 3 ’ 熱管 3 固定片 4 14 r < M317606 本體 4 1 開口 4 2 卡合部 4 3 彈性臂 4 4 隆起部 4 41 剖槽 4 4 2 推移部 4 5 鎖固板件 5 結合柱 5 1 散熱塊 6 容置槽 6 1 通孔 6 2 插置孔 63 傾斜面 6 4 電路板 700 孔洞 7 1 電子元件 8 0 0 固定元件 a 彈性件 bIn the assembly, the fixing piece 4 can be assembled to the pair of fixing blocks. When the rail U is assembled, the receiving groove 61 of the two heat dissipating blocks 6 can simultaneously accommodate the other end of the heat official 3 (condensing end), and The through hole 62 of the heat sink block 6 can be passed through a fixing member (not shown) such as a screw or a bolt, so that the heat sink block 6 can be locked to the casing accommodating the circuit board 7 (not shown). Internal or external, of course, the heat sink block 6 can also be provided in combination with any other device, and will not be described again here. In addition, in the above embodiments, the system may further include a +=, which may be the same material as the heat conducting block 2, and has a scatter (four) 属 genitive material. The number of the heat dissipating blocks 6 can be set to one or two according to actual needs. In the figure, two of the two heat dissipating blocks 6 are respectively recessed into a corresponding receiving groove 61, and a plurality of through holes 62 are opened. . Further, by the above description, when the thermal energy generated by the operation of the electronic component 8 is rapidly transmitted to the heat pipe 3 via the heat conducting block 2, the heat pipe 3 can quickly dissipate heat energy to achieve air cooling. The purpose of the heat dissipating block 6 can be locked to the casing, so that the heat exchange between the heat absorbing end and the condensing end of the heat pipe 3 can achieve rapid heat exchange, and the effect of rapidly dissipating the electronic component 8 QQ can be achieved. Secondly, the heat-conducting block 2 of the present invention has a good flatness, which can reach full contact with the electronic component 800 to achieve a good heat conduction effect. Furthermore, the heat sink of the present invention is 100, the overall structure design is simple 11 M317606, and in the process of the overall structure combination, no welding is required, and the above-mentioned assembly method can reach the electronic component 800. The effect of air-cooling and dimming provides the assembler with the goal of saving assembly time, and at the same time, the purpose of the tin (wrong) process is to comply with the provisions of the world. Please refer to the seventh embodiment and the eighth embodiment, which is a fifth embodiment of the present invention, which is different from the foregoing embodiments in that: a pair of heat conducting blocks 2, 2' are further formed (ie, another one is added A heat conducting block 2'), and the pair of heat conducting blocks 2, 2' are oppositely recessed to form receiving grooves 2, 2, . When the pair of heat conducting blocks 2 are assembled, the guiding block 2 can be assembled between the pair of fixing blocks i such that the lower surface of the heat conducting block 2 completely contacts the surface of the electron 7L member 80. Then, the heat pipe 3 can be disposed in the block 2_21, and then the other heat-conducting block 2 is reassembled; between the pair of solid blocks 1, the heat-conducting block 2, the receiving groove 21, is accommodated. Tube 3. Finally, the fixing piece 4 is assembled in the pair of fixed block rails, so that the elastic arm 44 elastically presses the heat conducting block 2, the surface. The same effects as those described in the foregoing embodiments can be achieved, and can be applied to the foregoing embodiments; and, in this embodiment, two heat dissipating blocks β are also used to further couple to the heat pipe 3 The other two ends. As shown in the ninth figure, it is a sixth embodiment of the present invention. In this embodiment, in the fifth embodiment described above, the pair of guide blocks 2, 2, one side edge The insertion holes 2 2 and 2 2 may be respectively formed in the surface, and the inclined surfaces 23 and 23 may be formed, or an insertion hole 2 may be formed in each of the two side edges. 9, η - * . Straight △ B and - surface form an inclined surface 2 3, 2 3, respectively, in this figure, each with an insertion hole 2 2, 2 12 M317606 2, and each The inclined faces 23 and 23 are exemplified. Wherein, the two insertion holes 2 2, 2 2 are simultaneously inserted into an elastic member b to elastically connect the pair of heat conduction blocks 2, 2. The elastic member b may be substantially a ϋ-shaped body or a door-shaped body which may be made of a spring wire or a plate member, and the elastic members 四 (four) are slightly inclined on both sides. By the utility of the elastic member b, the two inclined faces 23, 23 corresponding to the pair of heat conducting blocks 2 can be brought into contact with each other, so that the pair of heat conducting blocks 2, 2' can be opened, and the assembler can assemble the heat pipe 3 thereto. For the thermal block 2, 2, ^. When the elastic arm 44 of the fixing piece 4 is pressed against the heat-conducting block 2, the pair of heat-conducting blocks 2, 2 are closed and the holding and holding the heat-conducting tube 3 are closed. . In addition, the foregoing sixth embodiment can be further applied to the heat dissipation block 6 of the upper embodiment, and is disposed on the side surface of the two heat dissipation blocks: the insertion surface 6 3 and the surface of the surface Forming a corresponding one surface 6 4 respectively; or inserting an insertion hole 63 3 and an inclined surface "(not shown)) on the two side edge surfaces, wherein the two heat dissipations are simultaneously inserted into the other elastic member b So that the two blocks 6 can achieve the same effect as the pair of thermally conductive blocks 2, 2. 2 of 2 - mention @ is 'in the above embodiments, the thermal block is prepared 42 1 , the pair The heat conducting blocks 2, 2, the receiving grooves 2丄, 2' 2: the receiving grooves 61 of the heat dissipating block 6 can be further coated with the scattered moon C (not shown), which can accelerate the heat dissipation effect. This (4) reading the truth (4), is not the content of the content, so the use of this creation manual and the schema, the structure of the special effects are all included in the scope of this creation 13 M317606, [Comprehensive description of the drawings] The first figure is an exploded perspective view of the first embodiment of the creation. The second figure is a three-dimensional group of the first embodiment of the creation. Fig. A is a partial detail view of a part of the second figure. Fig. 3 is a front view combination diagram of the first embodiment of the creation. The fourth figure is an exploded perspective view of the second embodiment of the creation. *The fifth figure is an exploded perspective view of the third embodiment of the creation. The six figures are the front view combination circle of the fourth embodiment of the creation. The seventh figure is an exploded perspective view of the fifth embodiment of the creation. A three-dimensional combination diagram of the fifth embodiment is created. The ninth diagram is a partial exploded perspective view of the sixth embodiment of the creation. [Description of main component symbols] Heat sink 1 0 0 Fixing block 1 Slot holder 1. 1 Ditch 1 2 Concave Slot 1 .3 Open slot 1 4 Positioning hole 15 Guide bevel 16 Heat transfer block 2 ί, 2, accommodating groove 2 1 , 2 1 ' Insert groove 2 2, 2 2 Inclined surface 2 3, 2 3 ' Heat pipe 3 fixed Sheet 4 14 r < M317606 Main body 4 1 Opening 4 2 Engagement part 4 3 Elastic arm 4 4 Protruding part 4 41 Groove 4 4 2 Pushing part 4 5 Locking plate 5 Bonding post 5 1 Heat sink 6 accommodating groove 6 1 through hole 6 2 insertion hole 63 inclined surface 6 4 circuit board 700 hole 7 1 electronic component 8 0 0 fixing element a elastic part b
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