M33 903 Ο 八、新型說明： 【新型所屬技術領域】M33 903 Ο VIII, new description: [New technical field]
本創作係有關於_ 品之導熱結構。 種導熱結構，尤指一 種應用於電子 【先前技術】 隨著科技的發展，電子產品及電子元件越朝㈣This creation is about the thermal conductivity of _ products. Heat-conducting structure, especially one applied to electronics [Prior Art] With the development of technology, electronic products and electronic components are moving toward (4)
之製作上發展，相對上其散熱問題格外顯得特別重::，^ 熱問題不僅會影響電子產品或電子㈣之内部的運作 會:產品或電子元件之使用壽命，因此，散熱問題 =為現今科技產業界所探討之話題，㈣科技產業界所 存在且欲解決的問題。 -般的電子產品’例如工業電腦，其内部係設有一發 $元件…散熱板及-導熱結構，該導熱結構係位於該發 以件及該散熱板之間且其底面抵接該發熱元件，而頂面 φ =抵接該散熱板，以將該發熱元件所產生之熱能，經由該 -導熱結構傳導至該散熱板而進行散熱；其中，因該工業電 .驷於,又计上可設計為具有多種不同規格之機㉟，故將造成 该發熱70件與該散熱板之間間距的改變（或因機型設計公 ^上的關係而導致該發熱元件與該散熱板之間距離的改 又），因此必須針對各式機型量身訂作出不同的該結 構。 ' '、、、 别述^亥導熱結構，主要係由銅材或銘材所製成之一導 无、鬼所、，且成，而该導熱塊一旦依照該發熱元件與該散熱板 5 M339030 之間的間距設計成成品後，即無法再適用於不同機型之工 業電腦及其間距改變的場人· 產品在製造上難免都會存在任何電子產品及 ^Λ # θ仔在有些許之公差，故該導熱塊並 二二配δ』距公差作微調，當該導熱塊之尺寸太 效='’、、法配°使用、太小時又會造成間隙而影響其熱傳 有鑑於此，本創作人係為改善並解決上述之缺失，乃 =潛心研究並配合學理之運用，終於提出—種設計合理且 有效改善上述缺失之本創作。 【新型内容】 有鑑於此，本創作之一目的係提供一種導熱結構，藉 由弟一、第二導熱塊及彈性元件的設計，以使該第一、第 =導熱塊可於發熱元件及散熱板之間作高度差之自由調 整’而使該第-、第二導熱塊可分別緊密抵接於該發熱元 =及该散熱板上，並將該發熱元件所產生之熱能有效地傳 導至該散熱板中，以提昇該導熱結構之熱傳導效率。 口此本創作係提供一種導熱結構，係裝設於一發熱 一件及放熱板之間’該導熱結構係由一座體、一第一導 =塊、一第二導熱塊以及一彈性元件所構成；該座體係貼 ，於該發熱元件上；該第一導熱塊係設置於該座體上，該 第導熱塊具有一第一斜面及一固定槽；該第二導熱塊係 抵接於邊散熱板上，該第二導熱塊具有一第二斜面及^一^^ 曰。亥苐_斜面係可滑設於该第一斜面上；該彈性元件係 • M339030 具有一固定端及形成於該固定端之一侧的一扣合端，該固 定端係固定於該固定槽内，而該扣合端則卡扣於該卡槽 内。 此外’本創作亦提供一種導熱結構，係裝設於一發熱 元件及一散熱板之間，該導熱結構係由一座體、一第一導 熱塊、一第二導熱塊、一固定元件以及一彈性體所構成； 該座體係貼設於該發熱元件上；該第一導熱塊係設置於該 _座體上，該第一導熱塊具有一第一斜面及穿設該第一斜面 _之一固定孔；該第二導熱塊係抵接於該散熱板上，該第二 導熱塊具有一第二斜面及與該固定孔對應設置的一限位 槽，該第二斜面係可滑設於該第一斜面上；該固定元件係 穿設該限位槽與該固定孔而固定於該第一導熱塊上；該彈 性體係具有一抵接端及形成於該抵接端另一端的一壓縮 端，該抵接端係抵接於該限位槽内，而該壓縮端則固定於 該固定元件上。 • 因此，藉由本創作導熱結構，可解決習知技術因發熱 -元件與散熱板之間的間距設計之公差所導致之導熱塊接觸 .不良，而影響導熱塊之熱傳導效率之種種缺失，以於提供 具有提昇熱傳導效率的效果，實具極高之產業利用價^ 【實施方式】 有以下之實施例係進一步詳細說明本創作之觀點，但 非以任何觀點限制本創作之範®壽。 7 .M339030 [第一實施例] 請參閱第一、第二及第五圖，本創作導熱結構，係裝 設於一電子產品70中，該電子產品70包含有一框架71、位 於該框架71上方之一散熱板72、設於該框架71上之一主機 板73及位於該主機板73上之一發熱元件74，該導熱結構係 由一座體10、一第一導熱塊20、一第二導熱塊30、以及一 ，彈性元件40所構成。 - 該座體10係貼設於該發熱元件74上，而該座體10包含 _有複數之穿孔11，該等穿孔11係用以供所對應之複數定位 件12之穿設，該定位件12係可為一插銷或一螺栓，且該座 體10之形狀係可為呈L字型者；其中，該座體1〇形狀之設 计，可依照该發熱元件74之數量及配置位置而予以設計為 不同之形狀，並可適用於更多該發熱元件74之導熱，以符 合導熱之經濟效益。 該第一導熱塊2〇係設置於該座體1〇上，其中，該第一 #導熱塊20係可與該座體1〇 一體成型者或可將該第一導熱塊 -2〇與該座體10分別成型，再予以組合者，該第一導熱塊2〇 .具有一第—斜面21及位於該第一斜面21之一侧的一固定槽 22 ’該第-斜面21與該座體1〇之夾角可為介於〇至卯度二 的角度於本貝化例中該第一斜面21與該座體W之炎角較 么為45度，以使相同體積之該第一導熱塊20有較大之該第 -斜面21面積，而增加其熱傳導之面積，其中，該第一導 熱塊20係可為一梯形體或三角體的導熱塊 之斷面係可呈一 ϋ字型者。 疋 8 M339030 該第二導熱塊30係抵接於該散熱板72上，該第二導熱 塊30具有一第二斜面31及位於該第二斜面31之一側的一卡 槽32，該第二斜面31係可滑設於該第一斜面21上，以使該 第一導熱塊20、該第二導熱塊30相對彼此滑動而可產生上 下移動之位移，其中，該第二導熱塊30係可為一梯形體或 三角體的導熱塊，而該卡槽32之斷面係可呈一 u字型或圓 形者。 、 • 該彈性元件40係具有一固定端41及分別形成於該固定 籲々而41兩立而之一扣合端42，該固定端41係固定於該固定槽μ 内’而該扣合端42則卡扣於該卡槽32内，另該彈性元件4〇 係可為一彈片。 惟值得注意的是，前述之該電子產品7〇係可為一工業 電腦、桌上型電腦、筆記型電腦或伺服器等，而該發熱元 件74係可為一 CPU、半導體封裝件、晶片或其他具有產生 高熱而需散熱之電子元件，再者，該散熱板72係可為一散 籲熱’片、熱官、金屬殼體或以該金屬殼體結合該熱管及該 ^ 散熱鰭片者。 .—欲裝設本創作至該電子產品70内時，請參閱第三圖至 第五圖，首先將固定有該第一導熱塊2〇之該座體1〇貼設於 忒等發熱π件74上，並藉由該等定位件12穿越該等穿孔u 及位t 4主機板73上之複數開孔75，以將該座體10固定於 该主機板73上，此時，再將該彈性元件4〇之該扣合端犯卡 扣於忒卡槽32内，並使該第一、第二導熱塊2〇、3〇之該第 第一斜面21、31相互接觸，並將該彈性元件之該固 9 M339030 定端41容設於該固定槽22内，以使該第二導熱塊3〇設置於 該第一導熱塊20上，此時，若按壓該第二導熱塊3〇上之一 頂接部33 ’可使该弟二導熱塊30於該第一導熱塊20上滑動 而產生上下之位移，以調整增加或減少該頂接部33至該座 體10間的距離，最後再將該散熱板72結合於該框架71上， 以使該散熱板72緊密抵接該第二導熱塊3〇之該頂接部33。 因此，俾藉此該第一、第二導熱塊2〇、3〇及該彈性元 -件40的設計，以使該第一、第二導熱塊2〇、30可於該發熱 #元件74及該散熱板72之間作高度差的自由調整，而使該第 一、苐二導熱塊20、30可分別緊密抵接於該發熱元件74及 該散熱板72上，並將該發熱元件74所產生之熱能有效地傳 導至該散熱板72中，以提昇本創作導熱結構之熱傳導效 率〇 [第二實施例] 晴蒼閱第六圖，本實施例與第一實施例之差別在於該 彈性元件40係為一扭力彈簧43，以提供較佳之彈力，而使 本創作導熱結構可緊密地抵接於該發熱元件74及該散熱板 72之間，以有效地將該發熱元件74所產生之熱能傳導至該 散熱板72中。 [弟二貫施例] 明芩閱第七圖，本實施例與第一實施例之差別在於該 彈性元件40係可拆為二彈性件44、44，，其中一該彈性件 10 M339030 44之該固定端41，内係形成有-螺孔，另-該彈性件44, 之該固定端4Γ上則形成有—螺牙，並以該螺牙螺合料 螺孔中，而可將其兩者再予以组合者；其可達到之效果鱼 第-實施例相同者’而為本創作之另一實施態樣。、 [第四實施例] —冑參閱第人圖’本實施例與第—實施例之差別在於該 —固定槽22’及該卡槽32，分別為穿执兮筮、酋丸 斤 引马牙叹该弟一導熱塊20、該 弟二導熱塊30之圓形穿槽，而該彈性元件仙可分段 性件44，且該彈性件44係具有一因宁砷川立/ — 啕固疋端41及形成於該固 疋端41’ t-侧的-扣合端42,，並將該固定端41，“亥 =合端42,穿設於該固定才曹22,、該卡槽％,巾，以使該 弟一導熱塊30設置於該第一導敎始州μ ^ — 乐V熟塊2〇上，其可達到之效果 亦同於弟一貫施例。 [第五實施例] 請參閱第九圖，本實施例與第四實施例之差別在於該 固疋槽22”及該卡槽32”係分別為開設於該第一導埶塊 20、該第二導熱塊3〇之u字型门 /、 例之效果者。 子支開才曰’其相同具有第-實施 [弟六實施例] 請茶閱第十圖，本實施例與第一與 罘 貝施例之差別在於可 知该彈性元件4〇前後反向設置， — Μ ΰ亥弹性兀件40之該固定 M339030 端41固定於該卡槽32内，而其該扣合端42則卡扣於該固a 槽22内，亦達同樣之固定效果者。 义 [第七實施例] 請參閱第十一圖，本創作導熱結構，係裝設於一發熱 元件74及一散熱板72之間，該導熱結構係由一座體1〇、二 -第一導熱塊2〇、一第二導熱塊30、一固定元件5〇以及一彈 性體60所構成。 • 該座體10係貼設於該發熱元件74上，而該座體1〇包含 有複數之穿孔11，該等穿孔π係用以供所對應之複數定位 件12之穿設。 该弟一導熱塊20係設置於該座體1 〇上，其中，該第— 導熱塊20係可與該座體1〇—體成型者或可將該第一導熱塊 20與該座體10分別成型，再予以組合者，該第一導熱塊加 具有一弟一斜面21及穿設該第一斜面21之一固定孔24 ;其 •中，該固定孔24係可為一螺孔。 該第二導熱塊3〇係抵接於該散熱板72上，該第二導熱 •塊30具有一第一斜面31、穿設該第二斜面31並與該固定孔 24對應設置的一穿槽34、以及穿設該第二導熱塊3〇之一侧 面並與該穿槽34及該固定孔24對應設置的一限位槽35，該 第一斜面31係可滑設於該第一斜面21上；其中，該限位槽 35及該穿槽34之形狀係可呈長條狀者。 該固定元件50係穿設該限位槽35與該固定孔24而固定 於該第一導熱塊20上；其中，該固定元件50係可為一螺 12 M339030 栓。 該彈性體6 0係具有一抵接端6丨及形成於該抵接端6丨另 一端的一壓縮端62，該抵接端61係抵接於該限位槽邪内， 而忒壓縮鳊62則固疋於該固定元件上；其中，該彈性體 60係可為一壓縮彈簧。 使用本創作時，請參閱第十二圖及第十三圖，首先使 該第一、第二導熱塊30之該第一、第二斜面31相接觸，並 调整5亥第-導熱塊20於該第二導熱塊3〇上之滑動位移，以 鲁使該第一導熱塊20上之該固定孔24對應於該第二導熱塊％ 上之該穿槽34、該限位槽35，再將該彈性體6〇套接於該固 定元件50上，並將已套接該彈性體6〇之該固定元件5〇經由 该限位槽35、該穿槽34而鎖固於該固定孔24中，以將該第 -導熱塊3015:置於該第-導熱塊2()上，並藉由該彈性體6〇 對該第二導熱塊30所提供之彈力，可使受力之該第二導熱 塊30於該第一導熱塊20上作上下滑動位移之調整；因此， 籲其可達到的效果與前述之實施例相同，而為本創作之又一 . 實施態樣。 • 綜上所述，應用本創作可達到提昇熱傳導的效率，並 解決習知技術之種種缺失，實已具備高度產業利用價值。 【圖式簡單說明】 第一圖係為本創作之立體分解示意圖。 第二圖係為本創作之立體組合示意圖。 第三圖係為本創作之使用狀態圖（一）。 13 M339030 第四圖係為本創作之使用狀態圖（二）。 第五圖係為本創作之使用狀態圖（三）。 第六圖係為本創作之第二實施例圖。 第七圖係為本創作之第三實施例圖。 第八圖係為本創作之第四實施例圖。 第九圖係為本創作之第五實施例圖。 ~ 第十圖係為本創作之第六實施例圖。 - 第十一圖係為本創作之第七實施例圖。 • 第十二圖係為第十一圖之使用狀態圖（一）。 第十三圖係為第十一圖之使用狀態圖（二）。 【主要元件符號說明】 10· ••座體 11 ·—— ••穿孔 12 •···定位件 20 · · · ••第一導熱 塊 21 · · · • •弟一斜面 22 、22, 、22” ·固定槽 24· ••固定孔 30 · · · ••第二導熱 塊 31 · · · ••第二斜面 32、 32，、 32” ·卡槽 33 · · · ••頂接4 34 · • · ·穿槽 35 ·—— ••限位槽 36 · • · ·抵接口P 40——· ••彈性元件 41、41， ••固定端 42、 42，· • · ·扣合端 43· ••扭力彈簣 44、 44， · • · ·彈性件 14 M339030 50 · · · ••固定元件 60——· ••彈性體 61 · · · ••抵接端 70 · · · ••電子產品 71 · · · ••框架 73 · · · ••主機板 75——· ••開孔 62.......壓縮端 72.......散熱板 74.......發熱元件In terms of production, the problem of heat dissipation is particularly important: :, ^ The heat problem will not only affect the internal operation of electronic products or electronics (4): the service life of products or electronic components, therefore, heat dissipation problem = current technology The topics discussed by the industry, (4) the problems that the technology industry has and want to solve. a general electronic product, such as an industrial computer, having an internal component, a heat sink and a heat conducting structure, the heat conducting structure being located between the hair emitting member and the heat radiating plate and having a bottom surface abutting the heat generating component. The top surface φ = abuts the heat dissipation plate, so that the heat energy generated by the heat generating component is transmitted to the heat dissipation plate via the heat conduction structure to dissipate heat; wherein, due to the industrial power, it is designed The machine 35 has a plurality of different specifications, so that the distance between the heat generating member and the heat dissipating plate is changed (or the relationship between the heating element and the heat dissipating plate is changed due to the relationship between the design and the design of the heat sink). Also), it is necessary to make different structures for each model. ' ',,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, After the distance between the products is designed into finished products, it is no longer applicable to industrial computers of different models and the people whose spacing is changed. Products are inevitably manufactured with any electronic products and ^ Λ # 仔 in a few tolerances, Therefore, the heat conducting block is finely adjusted from the tolerance of the δ". When the size of the heat conducting block is too effective = '', the method is used, and too small, it will cause a gap and affect the heat transfer. In order to improve and solve the above-mentioned shortcomings, the people are concentrating on research and using the use of academics, and finally propose a kind of design that is reasonable in design and effective in improving the above-mentioned defects. [New content] In view of this, one of the purposes of the present invention is to provide a heat-conducting structure, which is designed such that the first and second heat-conducting blocks can be used for heating elements and heat dissipation. The height adjustment of the height difference between the plates is such that the first and second heat conducting blocks can be closely abutted against the heat generating element and the heat dissipating plate, respectively, and the heat energy generated by the heating element is effectively transmitted to the In the heat sink, the heat transfer efficiency of the heat conducting structure is improved. The present invention provides a heat-conducting structure which is installed between a heat-generating piece and a heat-dissipating plate. The heat-conducting structure is composed of a body, a first guide block, a second heat-conducting block and an elastic component. The first heat conducting block is disposed on the base body, the first heat conducting block has a first inclined surface and a fixing groove; the second heat conducting block is abutting on the side heat dissipation The second heat conducting block has a second inclined surface and a second surface. The 苐 苐 slanted surface is slidably disposed on the first inclined surface; the elastic member system M339030 has a fixed end and a fastening end formed on one side of the fixed end, the fixed end is fixed in the fixing groove And the fastening end is buckled in the card slot. In addition, the present invention also provides a heat-conducting structure which is installed between a heat-generating component and a heat-dissipating plate. The heat-conducting structure is composed of a body, a first heat-conducting block, a second heat-conducting block, a fixing component and an elastic layer. The seat system is disposed on the heating element; the first heat conducting block is disposed on the body, the first heat conducting block has a first inclined surface and is fixed by the first inclined surface The second heat conducting block is abutted on the heat dissipating plate, and the second heat conducting block has a second inclined surface and a limiting slot corresponding to the fixing hole, and the second inclined surface is slidably disposed on the first sliding surface a fixing surface is fastened to the first heat conducting block by the fixing slot and the fixing hole; the elastic system has an abutting end and a compression end formed at the other end of the abutting end, The abutting end is abutted in the limiting slot, and the compression end is fixed to the fixing component. • Therefore, the heat-conducting structure of the present invention can solve the problem of the thermal conduction efficiency of the heat-conducting block caused by the poor contact of the heat-conducting block caused by the tolerance of the design of the gap between the heat-component and the heat sink. Providing an effect of improving heat transfer efficiency, and achieving an extremely high industrial utilization price. [Embodiment] The following examples are intended to further explain the viewpoint of the present invention, but do not limit the scope of the creation by any viewpoint. 7. M339030 [First Embodiment] Please refer to the first, second and fifth figures. The heat conductive structure of the present invention is installed in an electronic product 70. The electronic product 70 includes a frame 71 located above the frame 71. a heat dissipating plate 72, a main board 73 disposed on the frame 71, and a heating element 74 on the main board 73. The heat conducting structure is composed of a body 10, a first heat conducting block 20, and a second heat conducting portion. Block 30, and one, is constructed of elastic elements 40. The seat body 10 is attached to the heating element 74, and the base body 10 includes a plurality of perforations 11 for the insertion of the corresponding plurality of positioning members 12, the positioning member The 12-series can be a pin or a bolt, and the shape of the base 10 can be an L-shaped shape; wherein the shape of the seat body 1 can be designed according to the number and arrangement position of the heating element 74. It is designed to have different shapes and can be applied to more heat conduction of the heating element 74 to meet the economic benefits of heat conduction. The first heat conducting block 2 is disposed on the base body 1 , wherein the first heat conducting block 20 can be integrally formed with the seat body 1 or the first heat conducting block 2 can be The base body 10 is separately formed and combined. The first heat conducting block 2 has a first inclined surface 21 and a fixing groove 22 ′ on one side of the first inclined surface 21. The first inclined surface 21 and the seat The angle between the body 1〇 can be from 〇 to 卯度2. In the present embodiment, the first slope 21 and the ridge angle of the seat W are 45 degrees, so that the first heat of the same volume The block 20 has a larger area of the first bevel 21 and an area of heat conduction thereof, wherein the first heat conducting block 20 can be a trapezoidal or triangular heat conducting block. By. The second heat-conducting block 30 has a second inclined surface 31 and a card slot 32 on one side of the second inclined surface 31. The second heat-conducting block 30 is abutted on the heat-dissipating plate 72. The slanting surface 31 is slidably disposed on the first slanting surface 21, so that the first heat conducting block 20 and the second heat conducting block 30 are slid relative to each other to generate displacement of the up and down movement, wherein the second heat conducting block 30 is It is a trapezoidal or triangular heat conducting block, and the cross section of the card slot 32 can be a U-shaped or a circular shape. The elastic member 40 has a fixed end 41 and a plurality of fastening ends 42 respectively formed on the fixed portion 41. The fixed end 41 is fixed in the fixing groove μ and the fastening end is 42 is buckled in the card slot 32, and the elastic member 4 can be a spring piece. However, it should be noted that the electronic device 7 can be an industrial computer, a desktop computer, a notebook computer or a server, etc., and the heating element 74 can be a CPU, a semiconductor package, a wafer or Others have electronic components that generate high heat and require heat dissipation. Further, the heat sink 72 can be a heat-dissipating sheet, a heat official, a metal shell, or a metal shell that combines the heat pipe and the heat sink fins. . When the present invention is to be installed in the electronic product 70, please refer to the third to fifth figures. First, the seat body 1 to which the first heat conducting block 2 is fixed is attached to the heat generating π piece. 74, and the plurality of openings 75 on the motherboard 73 are traversed by the positioning members 12 to fix the base 10 to the motherboard 73. The fastening end of the elastic member 4 is snapped into the card slot 32, and the first slopes 21, 31 of the first and second heat conducting blocks 2, 3 are in contact with each other, and the elasticity is The fixed end of the component is disposed in the fixing slot 22, so that the second heat conducting block 3 is disposed on the first heat conducting block 20, and at this time, if the second heat conducting block 3 is pressed One of the abutting portions 33' can slide the second heat conducting block 30 on the first heat conducting block 20 to generate an up and down displacement to adjust to increase or decrease the distance between the top portion 33 and the seat body 10. Finally, The heat sink 72 is coupled to the frame 71 such that the heat sink 72 abuts against the top portion 33 of the second heat conducting block 3 . Therefore, the first and second heat conducting blocks 2, 3 and the elastic element 40 are designed such that the first and second heat conducting blocks 2, 30 are available to the heat generating element 74 and The height difference between the heat dissipation plates 72 is freely adjusted, so that the first and second heat conduction blocks 20 and 30 can be closely abutted on the heat generating component 74 and the heat dissipation plate 72 respectively, and the heat generating component 74 is The generated heat energy is effectively conducted into the heat dissipation plate 72 to improve the heat conduction efficiency of the heat-conducting structure of the present invention. [Second Embodiment] The sixth embodiment is different from the first embodiment in that the elastic member is different from the first embodiment. The 40 series is a torsion spring 43 to provide a better elastic force, so that the heat-conducting structure of the present invention can be closely abutted between the heating element 74 and the heat dissipation plate 72 to effectively heat the heat generated by the heat-generating element 74. Conducted into the heat sink 72. [Second embodiment] The seventh embodiment is different from the first embodiment in that the elastic member 40 is detachable into two elastic members 44, 44, and one of the elastic members 10 M339030 44 The fixed end 41 is formed with a screw hole, and the elastic member 44 is formed with a screw thread on the fixed end 4, and the screw is screwed into the screw hole, and the two can be screwed into the screw hole. The combination is further exemplified; the achievable effect of the fish-first embodiment is the other embodiment of the present invention. [Fourth Embodiment] - 胄 Refer to the figure of the person' The difference between the present embodiment and the first embodiment is that the fixing groove 22' and the card slot 32 are respectively worn by the scorpion Sighing the heat conduction block 20 of the brother, the circular passage of the second heat conduction block 30, and the elastic member is a segmentable member 44, and the elastic member 44 has a arsenic arsenic / 啕 啕 疋The end 41 and the fastening end 42 formed on the t-side of the fixed end 41, and the fixed end 41, the "sea = the end 42", is disposed in the fixed slot 22, the card slot % , the towel, so that the heat-dissipating block 30 of the younger brother is disposed on the first guiding state of the first state, the V-cooking block 2〇, and the achievable effect is the same as that of the brother. [Fifth Embodiment] Referring to the ninth embodiment, the difference between the embodiment and the fourth embodiment is that the fixing groove 22" and the card slot 32" are respectively opened in the first guiding block 20 and the second heat conducting block 3 U-shaped door /, the effect of the example. Sub-opening 曰 'The same has the first - implementation [Sixth embodiment] Please read the tenth figure, the difference between this embodiment and the first and the mube example Know the elasticity The component 4 is disposed in the reverse direction of the front and rear, and the fixed M339030 end 41 of the elastic member 40 is fixed in the slot 32, and the fastening end 42 is buckled in the fixed slot 22. The same effect is fixed. [Seventh Embodiment] Referring to the eleventh figure, the heat conduction structure of the present invention is installed between a heating element 74 and a heat dissipation plate 72. The heat conduction structure is composed of a body 1 And a second heat conducting block 2〇, a second heat conducting block 30, a fixing member 5〇, and an elastic body 60. The base 10 is attached to the heating element 74, and the base 1 is The plurality of perforations 11 are provided for the corresponding plurality of positioning members 12. The thermal block 20 is disposed on the base 1 , wherein the first thermal block The 20 series can be formed with the body 1 or the first heat conducting block 20 and the base 10 can be separately formed and combined, and the first heat conducting block is provided with a younger inclined surface 21 and pierced. One of the first slopes 21 is fixed to the hole 24; wherein, the fixing hole 24 can be a screw hole. The second heat conduction block 3 is abutted on the hole On the heat sink 72, the second heat conducting block 30 has a first inclined surface 31, a through slot 34 extending through the second inclined surface 31 and corresponding to the fixing hole 24, and the second heat conducting block 3 is disposed. a limiting groove 35 corresponding to the through hole 34 and the fixing hole 24, the first inclined surface 31 is slidably disposed on the first inclined surface 21; wherein the limiting groove 35 and the wearing portion The fixing member 50 is fixed to the first heat conducting block 20 by the fixing slot 50 and the fixing hole 24; wherein the fixing component 50 can be a The snail 12 M 339 030. The elastic body 60 has an abutting end 6 丨 and a compression end 62 formed at the other end of the abutting end 6 , the abutting end 61 abutting the limit groove The 忒 compression 鳊 62 is fixed to the fixing member; wherein the elastic body 60 can be a compression spring. When using the present invention, referring to the twelfth and thirteenth drawings, the first and second inclined surfaces 31 of the first and second heat conducting blocks 30 are first brought into contact, and the 5th heat conducting block 20 is adjusted. The sliding displacement of the second heat conducting block 3 is such that the fixing hole 24 on the first heat conducting block 20 corresponds to the through slot 34 and the limiting slot 35 on the second heat conducting block %, and then The elastic member 6 is sleeved on the fixing member 50, and the fixing member 5 that has been sleeved with the elastic member 6 is locked in the fixing hole 24 via the limiting groove 35 and the through groove 34. The second heat conducting block 3015 is placed on the first heat conducting block 2 (), and the elastic force provided by the elastic body 6 〇 to the second heat conducting block 30 can be used to apply the second force. The heat conducting block 30 is adjusted for the up and down sliding displacement on the first heat conducting block 20; therefore, the achievable effect is the same as that of the foregoing embodiment, and is another embodiment of the present invention. • In summary, the application of this creation can achieve the efficiency of improving heat transfer, and solve the various shortcomings of the prior art, which has already achieved high industrial utilization value. [Simple description of the diagram] The first diagram is a three-dimensional decomposition diagram of the creation. The second picture is a three-dimensional combination diagram of the creation. The third picture is the use state diagram (1) of this creation. 13 M339030 The fourth picture is the use state diagram (2) of this creation. The fifth picture is the use state diagram of the creation (3). The sixth figure is a diagram of the second embodiment of the present creation. The seventh figure is a diagram of the third embodiment of the present creation. The eighth figure is a diagram of the fourth embodiment of the present creation. The ninth figure is a diagram of the fifth embodiment of the present creation. ~ The tenth figure is a diagram of the sixth embodiment of the present creation. - The eleventh figure is a diagram of the seventh embodiment of the present creation. • The twelfth figure is the use state diagram (1) of the eleventh figure. The thirteenth figure is the use state diagram (II) of the eleventh figure. [Description of main component symbols] 10·•• Seat 11 ·——••Perforation 12 •···Positioning member 20 · · · ••The first thermal block 21 · · · • • The younger slope 22 , 22 , , 22" ·Fixed groove 24 · ••Fixed hole 30 · · · •• Second heat transfer block 31 · · · •• Second slope 32, 32, 32′′ • Card slot 33 · · · •• Top connection 4 34 · • · · Through slot 35 · - • • Limiting groove 36 · • · · Abutment interface P 40 ·· •• Elastic elements 41, 41, •• Fixed end 42, 42 · · · · · · Closed end 43· •• Torque magazine 44, 44, · • · • Elastic member 14 M339030 50 · · · ••Fixed element 60——· •• Elastomer 61 · · · •• Abutment end 70 · · · •• Electronics 71 · · · ••Frame 73 · · · •• Motherboard 75—·•• Opening 62.... Compression end 72....... Heat sink 74.... Heating element
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