201240291 、 六、發明說明： 【發明所屬之技術領域】 本發明有關於一種散熱模組，尤指一種可減少散熱模 組整體重量且降低製造材料成本之散熱模組結構及其製: 方法。 ’、^ 【先前技術】 按，由於科技時代的進步，電子元件之運作欵能越來 越同，以至於對散熱單元的功能要求也隨之增加，習知之 散熱單元為了能增加散熱功效，都已大幅採用堆疊式的散 熱鰭片組，且不斷於散熱鰭片上研發改良，因此高效能之 散熱單元已經是今天產業界最重要的研發重點之―，又或 於該電子元件上方設置有散熱單元並透過該散熱單元對所 述電子元件進行散熱，所述散熱單元通常為散熱器或散熱 鰭片對應配上一散熱風扇進行散熱工作，進一步透過熱導 官串接所述散熱單元將熱源引導至遠處進行散熱。 以電腦主機為例，其内部中央處理單元（cpu)所產生 之熱量佔大部分，此外，中央處理單元當熱量逐漸升高會 乂成執行效能降低，且當熱量累積高於其容許限度時，將 會迫使電腦當機，嚴重者更可能會造成毁損現象；並且， 為解決電磁波輻射之問題，通常係以機箱殼體來封閉該電 腦主機，以致如何將中央處理單元及其它發熱零組件（或 稱元件）之熱能快速導出，成為一重要課題。 201240291 而一般舊有之技術其散熱模組主要具有一導熱底板及 至少一熱導管’該導熱底板係以金屬材料一體成形並於侧 邊形成有複數固定孔，且該導熱底板係可固定所述熱導管 並可將其散熱模組固定於待散熱對象上，以經由所述熱導 管貼附於待散熱對象並進行導熱，又或由該導熱底板貼附 於所述待散熱對象並導熱至熱導管，俾利用散熱模組達到 散熱之功效。 然’由於現今電子裝置要求日益輕薄以利攜帶，因此 在電子裝置體積日益狹小的狀況下，用於電子零件散熱之 散熱單元亦需隨其輕薄及輕量化，但其經由金屬材料一體 成形之散熱底板所形成之重量較重，並於其製造過程中使 用金屬材料所耗冑之材料成本高，故f知技術具有下列缺 點： 1.金屬材料成形之重量重； 2·耗費之材料成本高。 是以’要如何解決上述習用之問題與缺失，即為本案 此行業之蝴脑所碰研纽善之方向 所在者。 【發明内容】 ;^發月之主要目的在提供—種可減少散熱模組整體重 量的散熱模組結構及其製造方法。 本發明之3 -目的在提供_種可降低製造材料成本的 201240291 散熱模組結構及其製造方法。 為達上述目的，本發明係提出一種散熱模組結構，係 包含：一塑料層及至少一熱導管，所述塑料層一側面具有 至少一溝槽並於兩側邊具有至少一鎖固部，該溝槽則形成 有一封閉側及一開放侧，且該溝槽内設置有所述熱導管， 該熱導官兩端分別具有一吸熱端及一散熱端，該吸熱端具 有一接觸面及一嵌入面，該嵌入面係對應結合所述封閉 側’而該接觸面對應該開放側。 為達到上述目的，本發明係提出一種散熱模組製造方 法，係包含下列步驟：首先提供至少一熱導管；並於該熱 導管上形成有一塑料層；以使該塑料層彼覆於熱導管之吸 熱端並形成有-開放側對應於吸熱端之接觸面，並於兩側 邊形成有至少一鎖固部。 藉由上述散熱模組結構及散熱模組製造方法，令該散 熱模組可經由_部_組設於欲散熱對象，触其塑料 層之形成達ϋ可減彡散熱模組整體重量與降低製造材料成 本之功效者；故本發明具有下列優點： 1.有效達到整體重量輕量化； 2·降低製造材料成本。 【實施方式】 功能上的特性，將依據 本發明之上述目的及其結構與 實蝴相說明。 201240291 請參閱第1圖、第2圖及第3圖所示，係為本發明散 熱模組結構之立體圖、剖視圖及散熱模組製造方法之方法 流程圖，在本發明之一較佳實施例中，所述散熱模組10結 構係包括：一塑料層20及至少一熱導管3〇，該塑料層2〇 一側面具有至少一溝槽21及一底面22，並於兩側邊形成 有複數鎖固部23，該溝槽21具有一封閉侧211及一開放 侧212，而該熱導管3〇係透過該開放側212設置並貼附於 所述封閉側211，且該熱導管30兩端分別具有一吸熱端31 及一散熱端（圖中未表示），該吸熱端31底部具有一接觸 面311及頂部具有一嵌入面312，該嵌入面312係對應結 合所述封閉側211 ’而該接觸面311係對應該開放側212， 於本實施例中該接觸面311係為平面，且該接觸面311係 叹置於所述開放侧212並延伸於所述底面22 ; 藉此’該散熱模組10組設於待散熱物並進行散熱時， 係以熱導官30於吸熱端31位置處之接觸面311貼附於所 述待散熱物，而後將其散細組1{)由_邊之鎖固部23 經由鎖固元件搭配彈簧（圖中未表示）鎖·待散熱物上， 進而達到由鱗管3〇傳導待散熱物之熱能 ，且同時可減少 散熱模組10魏重量與可降低製造騎成本之功效。 如上所述，本發明散滅組10之製造方法係包含下列 步驟： 步驟SP11 :提供至少一熱導管； 201240291 步驟SP12 :於該熱導管上形成有一塑料層； 步驟SP13 :使該塑料層披覆於熱導管之吸熱端並形成 有一開放侧對應於吸熱端之接觸面。 如上所述步驟’首先係提供有至少一熱導管30，該熱 導管30兩端分別具有所述吸熱端31與散熱端，該吸熱端 31具有所述接觸面311及嵌入面312,且在該吸熱端31上 以塑膠射出成形方式形成有所述塑料層20,並使塑料層20 相對應於吸熱端31位置處形成有該溝槽21與鎖固部23， 且該溝槽21形成有所述封閉側211及開放側212及底面 22，該封閉側211係對應該嵌入面312，而該開放侧212 係對應接觸面311且與所述底面22相互延伸連接，且該鎖 固部23再經由鎖固元件搭配彈簧（圖中未表示）將該散熱 模組10鎖固於待散熱物上，以達到經由熱導管3〇傳導待 政熱物之熱能’並可達到減少散熱模組1〇整體重量與可降 低製造材料成本之功效。 復請參閱第4圖、第5圖及第6圖所示，係為本發明 之另-較佳實施例整聽構及元件連結關係大致與 前-實施例相同’在此不另外贅訴相同處，在本實施例中 相較前-實關不同處為所述散熱池1G更具有一金屬 層40，該金屬層40係嵌設於所述塑料層2〇内，且該金屬 層40係設置於吸熱端31之接觸面311位置處並對應開放 側212，而該金屬層40 -側同時延伸於該塑料| 2〇之底 201240291 面22 ; 進而使該散熱模組10組設於待散熱物並進行散熱時 係以金屬層40貼附於所述待散熱物，以經由金屬層4〇吸 收待散熱物之熱能在傳導至熱導管30，且其散熱模組ι〇 由兩侧之鎖固部23鎖固於待散熱物上，進而達到由熱導管 3〇傳導待散熱物之熱能，且同時可減少散熱模組1〇整體 重量與可降低製造材料成本之功效。 如上所述’本發明散熱模組10之製造方法係包含下列 另一步驟： 步驟SP21 :提供至少一熱導管及一金屬層； 步驟SP22 :於該熱導管及金屬層上形成有一塑料層； 步驟SP23 ··使該塑料層披覆於熱導管之吸熱端與金屬 層並形成有一開放側對應於吸熱端之接觸面與金屬層。 如上所述步驟，首先係提供有至少一熱導管3〇及一金 屬層40，該熱導管30兩端分別具有所述吸熱端31與散熱 端，且在該吸熱端31及金屬層40上以塑膠射出成形形成 有所述塑料層20，並使塑料層20相對應於吸熱端31位置 處具有該溝槽21與鎖固部23，且該溝槽21形成有所述封 閉側211及開放側212及底面22 ’該封閉側211係對應該 嵌入面312，而該開放側212係對應接觸面311與金屬層 —側，且該金屬層40另一側同時延伸於該塑料層2〇之 底面22，以將該鎖固部23鎖固於待散熱物上，且由熱導 201240291 ' 管30傳導待散熱物之熱能，並可達到減少散熱模組10整 體重量與可降低製造材料成本之功效。 再請參閱第7圖、第8圖及第9圖所示，係為本發明 之再-較佳實施例，該其整體結構及元件連結關係大致與 前-實施例相同’在此不另外贅訴相同處，在本實施例中 相較前-實施例不同處為可經由所述金屬層4〇形成至少 -鎖固部41替代前述實施例由塑料層2Q形成之鎖固部 (請參閱第5圖所示)’該鎖固部41係外露於所述塑料層 20，且該金屬層40係、設置於吸熱端31之接觸面3ιι位^ 處並對應開放側212 ’而該金屬層4〇 一側同時延伸於該塑 料層20之底面22，且該鎖固部41再經由鎖固元件搭配彈 簧（圖中未表示）將該散熱模組1〇鎖固於待散熱物上，進 而使該散熱模組10組設於待散熱物並進行散熱時係以金 屬層40貼附於所述待散熱物，與達到由熱導管3〇傳導待 散熱物之熱能，且同時可減少散熱模組1〇整體重量與可降 低製造材料成本之功效；又如第9圖所示，所述鎖固部Μ 可為以具有角度延伸之彈片模式成型，以使該鎖固部41相 對於腿層2G_力施壓紐生有-蹲之絲，進而達 到散熱模組10組裝於待散熱物時可減少需以彈性元件組 裝之成本。 又請參閱第10圖及第u圖所示，係為本發明之又一 較佳實施例，该其整體結構及元件連結關係大致與另一實 201240291 施例相同’在此不另外贅訴相同處，在本實施例中相較另 一實施例不同處為所述金屬層4〇係設置於塑料層2〇與熱 導管30間，而其熱導管30於吸熱端31位置處之嵌入面 312係與金屬層40對應結合該封閉侧211，而該接觸面311 對應該開放侧212，並由該接觸面311與該金屬層4〇成一 水平面並與該底面22相互延伸連接，同樣可達到經由該鎖 固部23鎖固於待散熱物上，且由熱導管30傳導待散熱物 之熱能，並達到減少散熱模組10整體重量與可降低製造材 料成本之功效。 按，以上所述，僅為本發明的一最佳具體實施例，惟 本發明的特徵並不舰於此’任何麵該項鮮者在本發 明領域内’可㈣思及的變域修飾，皆應涵蓋在以下本 發明的申請專利範圍中。 【圖式簡單說明】 第1圖係為本發明之較佳實施例之立體圖； 第2圖係為本發明之較佳實施例之剖視圖； 第3圖係為本發明之較佳實施例之流程圖； 第4圖係為本發明另一較佳實施例之立體圖； 第5圖係為本發明另一較佳實施例之剖視圖； 第6圖係為本發明另一較佳實施例之流程圖； 第7圖係為本發明再一較佳實施例之立體圖； 第8圖係為本發明再一較佳實施例之剖視圖一； 第9圖係為本發明再一較佳實施例之剖視圖二； 201240291 • 第10圖係為本發明又一較佳實施例之立體圖；201240291, VI. Description of the Invention: [Technical Field] The present invention relates to a heat dissipation module, and more particularly to a heat dissipation module structure and a method thereof for reducing the overall weight of a heat dissipation module and reducing the cost of manufacturing materials. ', ^ [Previous technology] Press, due to the advancement of the technology era, the operation of electronic components can be more and more the same, so that the functional requirements of the heat sink unit will also increase, the conventional heat sink unit in order to increase the heat dissipation effect, The stacked heat sink fins have been greatly adopted, and the heat sink fins have been continuously developed and improved. Therefore, the high-efficiency heat sink unit is the most important research and development focus of the industry today, or a heat sink unit is disposed above the electronic component. And dissipating heat to the electronic component through the heat dissipating unit, wherein the heat dissipating unit is usually equipped with a heat dissipating fan for heat dissipation work, and further, the heat guiding unit is connected to the heat dissipating unit through the heat guiding unit to guide the heat source to Dissipate heat in the distance. Taking a computer mainframe as an example, the internal central processing unit (cpu) generates a large amount of heat. In addition, when the central processing unit is gradually increased in heat, the performance is reduced, and when the heat is accumulated above its allowable limit, Will force the computer to crash, in severe cases is more likely to cause damage; and, in order to solve the problem of electromagnetic radiation, usually the chassis is used to close the computer host, so that the central processing unit and other heating components (or The rapid export of the thermal energy of the component is an important issue. 201240291 The conventional technology has a heat-dissipating module mainly having a heat-conducting bottom plate and at least one heat pipe. The heat-conducting bottom plate is integrally formed of a metal material and has a plurality of fixing holes formed at the side, and the heat-conducting bottom plate can fix the The heat pipe can be fixed to the object to be heat-dissipated by the heat pipe to be attached to the object to be heat-dissipated and heat-conducting, or attached to the object to be heat-dissipated by the heat-conducting substrate and thermally conductive to heat. The catheter and the sputum use the heat dissipation module to achieve the heat dissipation effect. However, because today's electronic devices are increasingly thinner and lighter to carry, the heat dissipation unit for heat dissipation of electronic components needs to be light and thin, and it is heat-dissipated through a metal material. The weight formed by the bottom plate is heavier, and the material cost of using the metal material in the manufacturing process is high. Therefore, the technology has the following disadvantages: 1. The weight of the metal material is heavy; 2. The cost of the material is high. It is the question of how to solve the above-mentioned problems and lack of use, that is, the direction of the new brain of the industry in this case. SUMMARY OF THE INVENTION The main purpose of the invention is to provide a heat dissipation module structure and a manufacturing method thereof that can reduce the overall weight of the heat dissipation module. The present invention is directed to a 201240291 heat dissipation module structure and a method of manufacturing the same that can reduce the cost of manufacturing materials. In order to achieve the above object, the present invention provides a heat dissipation module structure comprising: a plastic layer and at least one heat pipe, the plastic layer having at least one groove on one side and at least one locking portion on both sides. The groove is formed with a closed side and an open side, and the heat pipe is disposed in the groove. The heat guide has a heat absorbing end and a heat radiating end, and the heat absorbing end has a contact surface and a An embedding surface that corresponds to the closed side and the contact surface should be open. In order to achieve the above object, the present invention provides a heat dissipation module manufacturing method comprising the steps of: first providing at least one heat pipe; and forming a plastic layer on the heat pipe; so that the plastic layer covers the heat pipe. The heat absorbing end is formed with a contact surface corresponding to the heat absorbing end on the open side, and at least one locking portion is formed on both sides. The heat dissipating module structure and the heat dissipating module manufacturing method enable the heat dissipating module to be disposed on the object to be cooled via the _ part _, and the plastic layer can be formed to reduce the overall weight of the heat dissipating module and reduce manufacturing. The utility of the material cost; therefore, the invention has the following advantages: 1. Effectively achieving the overall weight and weight reduction; 2. Reducing the cost of manufacturing materials. [Embodiment] Functional characteristics will be described in accordance with the above object of the present invention and its structure. 201240291 Please refer to FIG. 1 , FIG. 2 and FIG. 3 , which are a perspective view, a cross-sectional view of a heat dissipation module structure, and a method flow diagram of a heat dissipation module manufacturing method, in a preferred embodiment of the present invention. The structure of the heat dissipation module 10 includes: a plastic layer 20 and at least one heat pipe 3〇, the plastic layer 2 has at least one groove 21 and a bottom surface 22 on one side, and a plurality of locks are formed on both sides The solid portion 23 has a closed side 211 and an open side 212, and the heat pipe 3 is disposed through the open side 212 and attached to the closed side 211, and the heat pipe 30 has two ends respectively The heat absorbing end 31 has a contact surface 311 at the bottom and a top surface 312. The insert surface 312 is associated with the closed side 211 '. The surface 311 is opposite to the open side 212. In the embodiment, the contact surface 311 is a flat surface, and the contact surface 311 is placed on the open side 212 and extends on the bottom surface 22; Group 10 is set to heat conduction when it is to be dissipated and heat is dissipated The contact surface 311 of the official 30 at the position of the heat absorbing end 31 is attached to the object to be dissipated, and then the squash 1{) is locked by the y-side locking portion 23 via the locking element (not shown) The lock and the heat sink are arranged to furtherly transfer the heat energy of the heat sink to be cooled by the scale tube 3, and at the same time, the heat weight of the heat dissipation module 10 can be reduced and the manufacturing cost can be reduced. As described above, the manufacturing method of the smashing group 10 of the present invention comprises the following steps: Step SP11: providing at least one heat pipe; 201240291 Step SP12: forming a plastic layer on the heat pipe; Step SP13: mulling the plastic layer At the end of the heat pipe, an open side corresponds to the contact surface of the heat absorbing end. The step as described above is first provided with at least one heat pipe 30 having a heat absorbing end 31 and a heat radiating end at both ends, the heat absorbing end 31 having the contact surface 311 and the inserting surface 312, and The plastic layer 20 is formed on the heat absorbing end 31 by plastic injection molding, and the plastic layer 20 is formed at the position corresponding to the heat absorbing end 31 to form the groove 21 and the locking portion 23, and the groove 21 is formed. The closed side 211 and the open side 212 and the bottom surface 22, the closed side 211 is corresponding to the embedded surface 312, and the open side 212 is corresponding to the contact surface 311 and is connected to the bottom surface 22, and the locking portion 23 is further The heat dissipation module 10 is locked to the heat sink by a spring (not shown) of the locking component to achieve the heat energy of the heat exchanger through the heat pipe 3 and can reduce the heat dissipation module. The overall weight and the effect of reducing the cost of manufacturing materials. Referring to FIG. 4, FIG. 5 and FIG. 6, it is a further preferred embodiment of the present invention that the tactile structure and the component connection relationship are substantially the same as those of the previous embodiment. In this embodiment, the heat dissipation pool 1G has a metal layer 40 which is embedded in the plastic layer 2〇, and the metal layer 40 is different from the front-to-close. The heat dissipation end 31 is disposed at the position of the contact surface 311 and corresponds to the open side 212, and the metal layer 40 - side extends simultaneously to the bottom surface of the plastic | 2, 201240291 surface 22; When the heat is dissipated, the metal layer 40 is attached to the heat sink to absorb the heat energy of the heat sink through the metal layer 4, and the heat dissipation module is blocked by the two sides. The solid portion 23 is locked to the heat dissipating material, thereby achieving the heat energy of the heat dissipating material to be radiated by the heat pipe 3, and at the same time, the overall weight of the heat dissipating module 1 and the cost of manufacturing the material can be reduced. As described above, the manufacturing method of the heat dissipation module 10 of the present invention includes the following further steps: Step SP21: providing at least one heat pipe and a metal layer; Step SP22: forming a plastic layer on the heat pipe and the metal layer; SP23 · The plastic layer is coated on the heat absorbing end of the heat pipe and the metal layer and forms an open side corresponding to the contact surface and the metal layer of the heat absorbing end. The first step is to provide at least one heat pipe 3〇 and a metal layer 40. The heat pipe 30 has the heat absorption end 31 and the heat dissipation end respectively, and the heat absorption end 31 and the metal layer 40 are respectively The plastic layer 20 is formed by plastic injection molding, and the plastic layer 20 has the groove 21 and the locking portion 23 corresponding to the position of the heat absorption end 31, and the groove 21 is formed with the closed side 211 and the open side. 212 and the bottom surface 22' of the closed side 211 are corresponding to the surface 312, and the open side 212 corresponds to the contact surface 311 and the metal layer-side, and the other side of the metal layer 40 extends simultaneously to the bottom surface of the plastic layer 2 22, to lock the locking portion 23 to the heat sink, and the heat conduction of the heat sink 1230291' tube 30 is conducted, and the overall weight of the heat dissipation module 10 can be reduced and the cost of manufacturing materials can be reduced. . Please refer to FIG. 7, FIG. 8 and FIG. 9 for the re-best embodiment of the present invention. The overall structure and component connection relationship are substantially the same as those of the previous embodiment. In the present embodiment, in the present embodiment, the difference from the pre-embodiment is that the at least the locking portion 41 can be formed via the metal layer 4 to replace the locking portion formed by the plastic layer 2Q in the foregoing embodiment (see the 5 shows that the locking portion 41 is exposed to the plastic layer 20, and the metal layer 40 is disposed at the contact surface 3 ιι of the heat absorbing end 31 and corresponds to the open side 212 ′ and the metal layer 4 The side of the crucible extends to the bottom surface 22 of the plastic layer 20, and the locking portion 41 is further locked to the heat sink by the spring (not shown) of the locking component. The heat dissipating module 10 is disposed on the heat dissipating material and is cooled by the metal layer 40 to be attached to the heat dissipating material, and the heat energy of the heat dissipating material is transmitted from the heat pipe 3, and the heat dissipating module can be reduced at the same time. 1〇 overall weight and the effect of reducing the cost of manufacturing materials; as shown in Figure 9, the lock The Μ Μ can be formed in an elastically stretched elastic piece mode, so that the locking portion 41 is pressed against the leg layer 2G_ force to have a wire, so that the heat dissipation module 10 can be assembled when the heat dissipation module 10 is assembled. Reduce the cost of assembly with elastic components. Please refer to FIG. 10 and FIG. 5 again, which are still further preferred embodiments of the present invention. The overall structure and component connection relationship are substantially the same as the other embodiment of 201240291. The difference between the embodiment is that the metal layer 4 is disposed between the plastic layer 2 and the heat pipe 30, and the heat pipe 30 is at the position of the heat absorbing end 31. Correspondingly, the closed side 211 is combined with the metal layer 40, and the contact surface 311 corresponds to the open side 212, and the contact surface 311 is formed into a horizontal plane with the metal layer 4 and extends to and from the bottom surface 22, and the same can be achieved. The locking portion 23 is locked to the heat sink, and the heat energy of the heat sink is transmitted by the heat pipe 30, and the overall weight of the heat dissipation module 10 is reduced, and the cost of manufacturing materials can be reduced. According to the above description, it is only a preferred embodiment of the present invention, but the features of the present invention are not modified in the field of the present invention. All of them should be covered by the following patent application scope of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a preferred embodiment of the present invention; FIG. 2 is a cross-sectional view of a preferred embodiment of the present invention; FIG. 3 is a flow chart of a preferred embodiment of the present invention Figure 4 is a perspective view of another preferred embodiment of the present invention; Figure 5 is a cross-sectional view of another preferred embodiment of the present invention; and Figure 6 is a flow chart of another preferred embodiment of the present invention FIG. 7 is a perspective view of still another preferred embodiment of the present invention; FIG. 8 is a cross-sectional view of still another preferred embodiment of the present invention; FIG. 9 is a cross-sectional view of still another preferred embodiment of the present invention. 201240291 • Fig. 10 is a perspective view of still another preferred embodiment of the present invention;
•U 第11圖係為本發明又一較佳實施例之剖視圖。 【主要元件符號說明】 散熱模組10 塑料層20 溝槽21 封閉側211 開放側212 底面22 鎖固部23 熱導管30 吸熱端31 接觸面311 後入面312 金屬層40 鎖固部41U Fig. 11 is a cross-sectional view showing still another preferred embodiment of the present invention. [Main component symbol description] Heat dissipation module 10 Plastic layer 20 Groove 21 Closed side 211 Open side 212 Bottom surface 22 Locking portion 23 Heat pipe 30 Heat absorbing end 31 Contact surface 311 Back surface 312 Metal layer 40 Locking portion 41