100年09月21日按正替换頁 M418527 % *» 五、新型說明： 【新型所屬之技術領域】 [0001] 本創作係有關於一種散熱結構，尤指一種薄型熱管散熱 器。 【先前技術】 [0002] 隨著科技進步，桌上型電腦、電子筆記本及筆記型電腦 越來越普及，其内部晶片等電子元件在運作時會發熱而 產生熱量，當熱量累積過多時，電子元件就會因高熱而 燒毁。因此，在發熱的電子元件上裝設一散熱件，使電 子元件產生之熱量傳導至散熱件，再經由散熱件將熱量 逐漸帶離電子元件，以提高電子元件的使用壽命。 [0003] 傳統的散熱器，請參閱第一至第二圖所示，其包括一熱 管10、一固定座20及二鎖固簧片30，固定座20設有一凹 槽201，熱管10容置在凹槽201内，且各鎖固簧片30分別 結合於固定座20的兩側，最後再利用螺絲40穿過鎖固簣 片30，以將散熱器鎖固在電路板上；藉此，使熱管10熱 貼接發熱的電子元件，進而讓電子元件產生的熱量傳導 至熱管10，再經由熱管10將熱量傳導出去，以達成散熱 之功效。 [0004] 然而，上述散熱器之結構設計是無法定位熱管10的位置 ，因此熱管10係以錫膏焊接方式和凹槽201的内壁相結合 ;但此焊接方式有下列缺點：一、焊接處會累積熱量， 造成散熱器之散熱效率降低；二、焊接之加工步驟繁雜 ，導致人事及組裝成本提高；三、焊料過少時，則焊接 處無法穩固定位熱管10，使熱管10容易發生位移及傾斜 表單編號A0101 第3頁/共16頁 M418527 100年09月21日修正替換頁 之問題；四、焊料過多時，則焊接處的厚度增加，使散 熱器整體的體積也增加，而無法配合現代追求輕薄短小 的電子產品。 [0005] 有鑑於此，本創作人遂針對上述現有技術，特潛心研究 並配合學理的運用，盡力解決上述之問題點，即成為本 創作人改良之目標。 【新型内容】 [0006] 本創作之一目的，在於提供一種薄型熱管散熱器，其係 以達到本創作散熱器具有體積輕薄、成本低廉、加工簡 便及散熱效率良好之特點。 [0007] 為了達成上述之目的，本創作係提供一種薄型熱管散熱 器，包括：一固定座，具有一板體，自該板體沖設有一 開口，並在對應該開口位置成型有一凸板，該凸板和該 板體之間形成有一通道；以及一熱管，其一端穿設在該 通道並被夾掣在該板體及該凸板之間。 [0008] 本創作還具有以下功效，此薄型熱管散熱器利用無焊接 _ 方式即可固定熱管，且板體係以沖壓方式一體成型凸板 ，而達到降低製作和組裝成本及加工簡便之功效。另外 ，本創作固定熱管的固定座僅為單一元件，使本創作薄 型熱管散熱器又具有體積輕薄之優點。又，本創作薄型 熱管散熱器在傳輸熱量的過程能避免熱量累積，以維持 良好的散熱效率。 【實施方式】 [0009] 有關本創作之詳細說明及技術内容，將配合圖式說明如 表單編號A0101 第4頁/共16頁On September 21, 100, according to the replacement page M418527 % *» V. New description: [New technical field] [0001] This creation is about a heat dissipation structure, especially a thin heat pipe heat sink. [Prior Art] [0002] With the advancement of technology, desktop computers, electronic notebooks, and notebook computers are becoming more and more popular, and electronic components such as internal chips generate heat during operation, and when heat is excessively accumulated, electrons The component will burn out due to high heat. Therefore, a heat dissipating member is disposed on the heat-generating electronic component, so that the heat generated by the electronic component is transmitted to the heat dissipating member, and the heat is gradually taken away from the electronic component through the heat dissipating member to improve the service life of the electronic component. [0003] A conventional heat sink, as shown in the first to second figures, includes a heat pipe 10, a fixing base 20 and two locking springs 30. The fixing base 20 is provided with a recess 201, and the heat pipe 10 is accommodated. In the groove 201, and each of the locking springs 30 are respectively coupled to the two sides of the fixing base 20, and finally the screws 40 are passed through the locking cymbal 30 to lock the heat sink on the circuit board; The heat pipe 10 is thermally attached to the heat-generating electronic component, and the heat generated by the electronic component is transmitted to the heat pipe 10, and the heat is conducted through the heat pipe 10 to achieve the heat dissipation effect. [0004] However, the structural design of the above heat sink is such that the position of the heat pipe 10 cannot be located, so the heat pipe 10 is combined with the inner wall of the groove 201 by solder paste welding; however, the welding method has the following disadvantages: Cumulative heat causes the heat dissipation efficiency of the heat sink to decrease. Second, the processing steps of the welding are complicated, resulting in an increase in personnel and assembly costs. 3. When the solder is too small, the welded portion cannot be stably fixed to the heat pipe 10, so that the heat pipe 10 is easily displaced and tilted. No. A0101 Page 3 of 16 M418527 The problem of the replacement page was corrected on September 21, 100. Fourth, when the amount of solder is too much, the thickness of the welded joint is increased, so that the overall volume of the heat sink is also increased, and it is impossible to match the modern pursuit of thinness. Short electronic products. [0005] In view of this, the present creator has made great efforts to solve the above problems by focusing on the above-mentioned prior art and focusing on the application of the theory, that is, the goal of the creator's improvement. [New Content] [0006] One of the aims of the present invention is to provide a thin heat pipe radiator which is characterized by being light in size, low in cost, simple in processing, and good in heat dissipation efficiency. [0007] In order to achieve the above object, the present invention provides a thin heat pipe radiator, comprising: a fixing base having a plate body, an opening is punched from the plate body, and a convex plate is formed at a corresponding opening position. A channel is formed between the convex plate and the plate body; and a heat pipe is disposed at one end of the heat pipe and sandwiched between the plate body and the convex plate. [0008] The creation also has the following effects. The thin heat pipe radiator can fix the heat pipe by using no welding method, and the plate system integrally forms the convex plate by punching, thereby achieving the effects of reducing the manufacturing and assembly cost and the processing convenience. In addition, the fixed seat of the fixed heat pipe of the present invention is only a single component, so that the thin heat pipe heat sink of the present invention has the advantages of being thin and thin. Moreover, the thin heat pipe heat sink of the present invention can avoid heat accumulation during heat transfer to maintain good heat dissipation efficiency. [Embodiment] [0009] The detailed description and technical content of this creation will be described in conjunction with the drawing. Form No. A0101 Page 4 of 16
1100年09月21曰修正替換頁I 下然而所附圖式僅作為說明用途，並非用於侷限本創 作。 [0010] 請參考第三至四圖所示，本創作係提供一種薄型熱管散 熱器，此薄型熱管散熱器主要包括一固定座丨及一熱管2 〇 [0011] 固定座1具有一板體11，自板體u沖設有一開口 12，並在 對應開口 12位置成型有一凸板13，凸板13呈一门字狀， 且凸板13的頂面至板體11的底面縱向距離為3mm以下，並 於凸板13和板體11之間形成有—通道14 ;另外，板體1對 應凸板1 3的兩側延伸有複數卡塊15，各卡塊丨5是自板韹2 彎折成型’又板體1設有複數固定孔16。 [0012] 熱管2呈一扁平狀，此熱管2 —端穿設在通道η並被夾掣 在板體11及凸板13之間’並使熱管2部分裸露於開口 12， 各卡塊15對應熱管2扣合，熱管2另一端連接有複數散熱 鰭片21。 [0013] 請參考第五至六圖所示’係本創作薄型熱管散熱器之組 合’其中’固定座1的板體11沖設開α 12，並在對應開口 12位置成型凸板13，且凸板13和板體11之間形成有通道 14 ;熱管2 —端穿設在通道14並被夾掣在板體11及凸板 13之間，再將各卡塊15對應熱管2壓折扣合，以使固定座 1穩固定位熱管2。藉此，本創作利用無焊接方式即可固 定熱管2，且板體11係以沖壓方式一體成型凸板13，而達 到降低製作和組裝成本及加工簡便之功效。另外，本創 作固定熱管2的固定座1僅為單一元件，以避免元件組合 而發生體積過大之情形，因此，本創作薄型熱管散熱器 表單编號Α0101 第5頁/共16頁 M418527 100年09月21日梭正_頁 又具有體積輕薄之優點。 [0014] 請參考第七至十圖所示，熱管2被夾掣在板體11及凸板13 之間，且熱管2又被各卡塊15卡掣固定，以使固定座1穩 固定位熱管2，又如第十圖所示，固定座1經由各固定孔 16以固置在電路板100上，且開口 12對應發熱元件200設 置，使發熱元件200熱貼接熱管2。藉此，讓發熱元件200 產生的熱量傳導至熱管2，再經由熱管2將熱量傳導至散 熱鰭片21，以達成散熱之功效；另外，習知的散熱器， 其熱管係以錫膏焊接方式和固定座結合，導致焊接處會 累積熱量，造成散熱器之散熱效率降低；相較下，本創 作利用無焊接方式即可固定熱管2,而使本創作薄型熱管 散熱器在傳輸熱量的過程能避免熱量累積，以維持良好 的散熱效率。 [0015] 綜上所述，本創作之薄型熱管散熱器，確可達到預期之 使用目的，而解決習知之缺失，並具有產業利用性、新 穎性與進步性，完全符合新型專利申請要件，爰依專利 法提出申請，敬請詳查並賜准本案專利，以保障創作人 之權利。 【圖式簡單說明】 [0016] 第一圖係習知的散熱器之組合示意圖。 [0017] 第二圖係習知的散熱器之分解示意圖。 [0018] 第三圖係本創作薄型熱管散熱器之立體組合圖。 [0019] 第四圖係本創作薄型熱管散熱器之立體分解圖。 [0020] 第五圖係本創作薄型熱管散熱器之組合示意圖。 表單編號A0101 第6頁/共16頁 M418527 [0021] [0022] [0023] [0024] [0025] [0021] 100年09月21日核正替換頁September 21, 1100, Amendment Replacement Page I. However, the drawings are for illustrative purposes only and are not intended to limit the creation. [0010] Please refer to the third to fourth figures, the present invention provides a thin heat pipe radiator, which mainly comprises a fixed seat and a heat pipe 2 [0011] The fixed seat 1 has a plate 11 An opening 12 is formed from the plate body u, and a convex plate 13 is formed at the position corresponding to the opening 12. The convex plate 13 has a gate shape, and the longitudinal distance from the top surface of the convex plate 13 to the bottom surface of the plate body 11 is 3 mm or less. And a channel 14 is formed between the convex plate 13 and the plate body 11; further, the plate body 1 has a plurality of card blocks 15 extending from opposite sides of the convex plate 13 , and each of the block blocks 5 is bent from the plate 韹 2 The forming plate 1 is provided with a plurality of fixing holes 16. [0012] The heat pipe 2 has a flat shape, and the end of the heat pipe 2 is pierced in the channel η and is sandwiched between the plate body 11 and the convex plate 13 and the heat pipe 2 is partially exposed to the opening 12, and each of the blocks 15 corresponds to each other. The heat pipe 2 is fastened, and the other end of the heat pipe 2 is connected with a plurality of heat dissipation fins 21. [0013] Please refer to the combination of the thin heat pipe heat sink shown in the fifth to sixth figures, wherein the plate body 11 of the fixed seat 1 is punched open by α 12, and the convex plate 13 is formed at the position corresponding to the opening 12, and A channel 14 is formed between the convex plate 13 and the plate body 11; the end of the heat pipe 2 is pierced in the channel 14 and sandwiched between the plate body 11 and the convex plate 13, and the corresponding blocks 15 are correspondingly pressed against the heat pipe 2 So that the fixing seat 1 is stably fixed to the heat pipe 2. Therefore, the present invention can fix the heat pipe 2 by means of no welding, and the plate body 11 integrally forms the convex plate 13 by punching, thereby achieving the effects of reducing the manufacturing and assembly costs and the ease of processing. In addition, the fixing seat 1 of the fixed heat pipe 2 of the present invention is only a single component to avoid excessive volume of the component combination. Therefore, the thin heat pipe radiator form number is Α0101, page 5/16 pages M418527 100 years 09 On the 21st of the month, the shuttle is _ page and has the advantage of being light and thin. [0014] Referring to the seventh to tenth drawings, the heat pipe 2 is clamped between the plate body 11 and the convex plate 13, and the heat pipe 2 is further clamped by each of the blocks 15, so that the fixing seat 1 is stably fixed to the heat pipe. 2. As shown in FIG. 10, the fixing base 1 is fixed to the circuit board 100 via the fixing holes 16, and the opening 12 is disposed corresponding to the heat generating component 200, so that the heat generating component 200 is thermally attached to the heat pipe 2. Thereby, the heat generated by the heating element 200 is transmitted to the heat pipe 2, and then the heat is transmitted to the heat dissipation fins 21 through the heat pipe 2 to achieve the heat dissipation effect; in addition, the conventional heat pipe is soldered by solder paste. Combined with the fixing seat, the heat is accumulated in the welding place, which causes the heat dissipation efficiency of the heat sink to decrease. In contrast, the creation can fix the heat pipe 2 by means of no welding, so that the thin heat pipe radiator can heat the heat transfer process. Avoid heat buildup to maintain good heat dissipation efficiency. [0015] In summary, the thin heat pipe radiator of the present invention can achieve the intended use purpose, and solve the lack of conventional knowledge, and has industrial utilization, novelty and progress, and fully meets the requirements of the new patent application. To file an application in accordance with the Patent Law, please check and grant the patent in this case to protect the rights of the creator. BRIEF DESCRIPTION OF THE DRAWINGS [0016] The first figure is a schematic diagram of a combination of conventional heat sinks. [0017] The second figure is a schematic exploded view of a conventional heat sink. [0018] The third figure is a three-dimensional combination diagram of the thin heat pipe radiator of the present invention. [0019] The fourth figure is an exploded perspective view of the thin heat pipe heat sink of the present invention. [0020] The fifth figure is a schematic diagram of the combination of the thin heat pipe radiator of the present invention. Form No. A0101 Page 6 of 16 M418527 [0022] [0024] [0025] [0021] September 21, 100 nuclear replacement page
[0026] [0027] [0028] [0029] [0030] 第六圖係本創作薄型熱管散熱器之另一組合示意圖。 第七圖係本創作薄型熱管散熱器之剖面示意圖。 第八圖係本創作薄型熱管散熱器之另一剖面示意圖。 第九圖係本創作薄型熱管散熱器之再一剖面示意圖。 第十圖係本創作薄型熱管散熱器之使用狀態示意圖。 【主要元件符號說明】 〈習知〉 10…熱管 20···固定座 201…凹槽 30…鎖固簧片 [0031] 40···螺絲[0030] [0030] The sixth figure is another combination diagram of the thin heat pipe heat sink of the present invention. The seventh picture is a schematic cross-sectional view of the thin heat pipe radiator. The eighth figure is another schematic cross-sectional view of the thin heat pipe radiator. The ninth figure is a schematic cross-sectional view of the thin heat pipe radiator of the present invention. The tenth figure is a schematic diagram of the use state of the thin heat pipe radiator. [Explanation of main component symbols] <Introduction> 10... Heat pipe 20···Fixed seat 201... Groove 30...Locking reed [0031] 40···screw
[0032] 〈本創作〉 [0033] 1…固定座 [0034] 11…板體 [0035] 12...開口 [0036] 13···凸板 [0037] 14…通道 [0038] 15…卡塊 [0039] 16···固定孔 表單編號A0101 第7頁/共16頁 M418527 [0040] 2…熱管 [0041] 21…散熱鰭片 [0042] 100…電路板 [0043] 200…發熱元件 表單編號A0101 第8頁/共16頁 100年09月21日梭正替換頁[Creation] [0033] 1...fixed seat [0034] 11...plate body [0035] 12...opening [0036] 13··· convex plate [0037] 14...channel [0038] 15... card Block [0039] 16···Fixed hole form number A0101 Page 7/16 pages M418527 [0040] 2... Heat pipe [0041] 21... Heat sink fin [0042] 100... Circuit board [0043] 200... Heating element form No. A0101 Page 8 of 16 Page 100 September 21st Shuttle Replacement Page