M254643 捌、新型說明·· 【新型所屬之技術領域】 本創作爲一種「電子元件散熱模組（二）」，尤指 一種適用於在運作時會產生高溫而影響鄰近元件之電子 =件者；其中，該電子元件係設置於電路板上，可為： 金屬氧化半導體（Metal Oxide Semiconductor，MO S ) 或互補金屬氧化半導體（Complementary Metal Oxide 一 iconductor ’ C Μ〇S );且該散熱模組係可將電子 凡件之熱能，導引至按裝電路板之機殼處，而大幅降低 對於鄰近元件之影響。 【先前技術】 按，-般在電路板上之金屬氧化半導體（M〇s) 金屬氧化半導體（CMOS)等電子元件附近， n?他：r容之電子元件’且設置之方式相當 半導體（Mos)或互補金屬氧 近A * 作所產生之㊄溫，對於鄰 近電谷荨兀件之使用哥命影響甚鉅，杏 板之機殼内部—旦散熱效果不佳上;广=路 度較高時，鄰近金屬氧化半導M 兄溫 氧化半導體（CMOS)之或互補金屬 損毀，眚古4 1 @ 4 私谷荨70件則易受其高溫而 損鲛實有未盡理想而亟待改進之必要。 【新型内容】 所以本創作之主要創作目 子元件散熱模組（二）」者·主Μ於提供—種「電 ，主要係利用一散熱模組， E-2003-P33-tw-new M254643 = =之金屬氧化半導體(M〇S)或互補 體（CM〇s)等電子元件，在 如導:;縣電路板之機殼處，而遠離其鄰 響，且明顯具備二 本創作係有效利用電路板邊緣之連接器組合上 、連接器2餘二間，設置散熱模組，不需變更電路板 02、本創作之散熱额，係由-散熱器貫穿一易就管 二tpiri所構成’且熱管之另-端並連接-導熱片 德插撒:、需裳配不同f折程度之熱管，即可配合不同 之功ί機殼及實際空間而設置，故，具有可彈性化生產 〇3、本創作可減少Mqs^m〇s對於鄰近電子 兀件（例如：電容）之使用壽命的影響，尤其 殼内部—旦散熱效果不佳，或機殼外部之環 兄溫度較局時，本創作可避免鄰近MQ S或CMO S之 電容等元件發生損毀。 本創作所採取的較佳技術手段係為一種「電子元件 月文熱拉組」’包括^莫敛Η 唾 ^ . 哭…甘： 弟一散熱器、及第二散熱 為等構成；其中： 该導熱片’係設置於電路搞上 电給伋上，且與至少一個欲散 熱之電子元件表面接觸； 該第一散熱器，係為-具有複數散熱W之散熱器 E-2003-P33-tw-new 5 M254643 ，且複數散熱鰭片上貫穿一熱管，熱管之一端連接於該 導熱片上； 該第二散熱器，係為一具有複數散熱鰭片之散熱器 ，且複數散熱鰭片上貫穿一熱管，熱管之一端連接於該 導熱片上； 且兩複數散熱鰭片，係分別固設於一機殼之壁面上 ， 藉此，可將欲散熱之電子元件在運作時所產生之高 溫，導引至供電路板按裝之機殼處，進行較大面積之散 熱，而遠離鄰近之電容元件。 本創作所採取的另一技術手段係為一種「電子元件 散熱模組」，包括一導熱片、第一散熱器、及第二散熱 器等構成；其中： 該導熱片，係設置於電路板上，且與至少一個欲散 熱之電子元件表面接觸； 該第一散熱器，係為一具有複數散熱鰭片之散熱器 ，且複數散熱鰭片上貫穿一熱管，熱管之一端連接於該 導熱片上， 該第二散熱器，係為一具有複數散熱鰭片之散熱器 ，且複數散熱鰭片上貫穿一熱管，熱管之一端連接於該 導熱片上； 且兩散熱器之前端面，係分別固設於一機殼之壁面 上； 藉此，可將欲散熱之電子元件在運作時所產生之高 E-2003-P33-tw-new 6 M254643 • » 導!1至供電路板按裝之機殼處，進行較大面積之散 …、，而返離鄰近之電容元件。 、 【實施方式】 、為能進-步瞭解本創作之特徵、技術手段以及所達 成之具體功能、目的，兹列舉本創作之較具體實施例， 繼以圖式、圖號詳細說明如後。 請參閱第1至3圖所示，在較佳實施例中，本創作 之散熱模組包括：一導熱片3〇、第一散熱器1〇、及第二 散熱器20等構成；其中： 該導熱片30，係設置於電路板4〇上，且與金屬氧化 半導體（MOS)或互補金屬氧化半導體（CM〇s) 等複數電子元件41之表面接觸； 该第一散熱器10，係為一具有複數散熱鰭片15之散 熱為（heat sink)，且複數散熱鰭片15上貫穿一熱管（ heat pipe) 11，熱管（heat pipe) 11之一端連接於導熱 片30上； 該第二散熱器20，係為一具有複數散熱鰭片26之散 熱器（heat sink)，且複數散熱鰭片26上貫穿一熱管（ heat pipe) 22，熱管（heat pipe) 24之一端連接於導熱 片30上； 且兩複數散熱鰭片15, 26，係分別固設於一機殼70之 壁面上； 藉此，即可經由導熱片30及第一、二散熱器1〇, 20， 將複數電子元件41在運作時所產生之高溫，導引至供電 E-2003-P33-tw-new 7 M254643 路板40按裝之機殼70處，進行較大面積之散熱，而遠離 鄰近複數電容元件43，以大幅降低複數電子元件41對於 鄰近元件之影響，及避免複數電容元件43發生損毀。 再者，一般電路板40之邊緣，常會密集設置有其他 不同類型功能之連接器組合42, 44, 45, 46, 47，且當電路 板40容置於機殼70内部時’會藉由一蓋板6〇覆蓋:連接 器組合42’44, 45, 46,47，因此，本創作之散熱模組，只 需裝配不同彎折程度之兩熱管11，22，即可視實際可利用 之空間，將兩散熱器10,20設置於機殼7〇壁面之不同位置 處，而位於連接器組合42上方’或位於連接器組合45,46 上方或位於連接态組合46, 47上方等，以配合不同機種 之機殼70而彈性化生產；其中： 該連接器組合42，可為DSUB連接器之組合； 。亥連接為組合4 4 口亥連接恭組合4 5 器之組合； 该連接器組合46 合； 、該連接驗合47，可為Audio連接ϋ之組合；且 2 =紐合42, 44, 45, 46, 47之設置順序及類型功能^ 糸依貫際需求而略有不同，而該蓋板 相對應之槽孔。 π夕数與之 此間應予說明者，乃在於：該導熱片3〇，進 於與金屬氧化半導體（M〇S)或互補金屬氧化半導: 可為PS2連接器之組合； 可為IEEE 1394連接器及USB連接 可為LAN連接器及USB連接器之組 E-2003-P3 3 -tw-ne w M254643 (CMOS)等複數電子元件41之表面接觸處，設有一 導熱膠布（圖未出示），或塗佈導熱黏膠，以使導熱片 30可凡全貼附於複數電子元件41之表面上，而增加固著 及接觸導熱功效。 此間應再予說明者，乃在於：該兩複數散熱鰭片 15, 26之釗端面，係可設有導熱膠布（圖未出示），或塗 佈導熱黏膠，使兩複數散熱鰭片15, 26可完全貼附於機殼 70壁面上，而增加固著及接觸導熱功效。 請參閱第4圖所示，在第二實施例中，本創作之散 熱模組包括：一導熱片30、第一散熱器10、及第二散熱 器20等構成；其中： ^ 該導熱片30，係設置於電路板4〇上，且與金屬氧化 半導體（M〇S )或互補金屬氧化半導體（CM〇s ) 等複數電子元件41之表面接觸； ^亥第政熱為1 〇，係為一具有複數散熱籍片15之散 熱為（heat sink)，且複數散熱鰭片15上貫穿一熱管（ heat pipe) 11，熱管（heat pipe) 11之一端連接於該導 熱片30上； 戎第二散熱器，係為一具有複數散熱鰭片26之散 熱器（heat sink)，且複數散熱鰭片26上貫穿一熱管（ heat pipe) 22，熱管（heat pipe) 24之一端連接於該導 熱片30上； 且兩散熱器10, 20之前端面10a，20a，係分別固設於— 機殼70之壁面上； E-2003-P33-tw-new 9 M254643 、藉此，即可經由導熱片30及第一、二散熱器1〇,2〇, 將複數電子元件41在運作時所產生之高溫，導引至供電 路板40按裝之機殼7G處，進行較大面積之散熱，此乃依 本創作之較佳實施範例所推廣，並循依本創作之精神所 延伸之適用者，故仍應包括在本案之專利範圍内。 此間應再予說明者，乃在於··該兩散熱器1〇,2〇之前 端面10a，20a，係可設有導熱膠布（圖未出示），或塗佈 導熱黏膠，使兩散熱器1〇,2〇之前端面1(^，2如可完全貼附 於機殼70壁面上，而增加固著及接觸導熱功效。 —綜上所述，本創作藉其特有之結構特徵，確能達原 創作目的之各項要求，且大幅改進習式產品之莫大實用 功效，更未見有相同結構特徵之產品公開販售，、顯見 案實已符合新型專利之成立要件，爰依法提出專利 請，懇請早日賜准本案專利，以彰顯專利法獎勵國 作之立法精神，是所至盼。 以上所述内容與所舉實施例之㈣，僅係本 較佳實施範例，概凡知悉此技#之人士依本創作 作成各種變化和修飾者’仍應包括在本案之專利範圍内 【圖式簡單說明】 圖式說明如下： 第1圖係爲本創作之立體分解圖； 第2圖係爲本創作實施狀態之立體示意圖； 第3圖係爲本創作實施狀態之部份剖面俯視圖； E-2003-P33-tw-new 10 M254643 第4圖係爲本創作第二實施例之部份剖面俯視圖 圖號說明如下： 第一散熱器10 電子元件41 前端面10a 連接器組合42 熱管1 Γ 電容元件43 散熱鰭片15 連接器組合44 第二散熱器20 連接器組合45 前端面20a 連接器組合46 熱管22 連接器組合47 ' 散熱鰭片26 蓋板60 導熱片30 電路板40 機殼70 E-2003-P33-tw-new 11M254643 新型, new type description ... [Technical field to which the new type belongs] This creation is an "electronic component cooling module (2)", especially one suitable for electronic components that will generate high temperature and affect neighboring components during operation; Wherein, the electronic component is disposed on the circuit board, and may be: Metal Oxide Semiconductor (MOS) or Complementary Metal Oxide (Iconductor 'C MOS); and the heat dissipation module is The thermal energy of electronic components can be guided to the housing of the installed circuit board, which greatly reduces the impact on adjacent components. [Previous technology] According to the general, near the electronic components such as metal oxide semiconductor (MOS) and metal oxide semiconductor (CMOS) on the circuit board, n? He: electronic components of r 'and the installation method is equivalent to semiconductor (Mos ) Or the complementary metal oxygen near A * operation, the temperature of the device has a great influence on the use of the neighboring parts of the electrical valley, the inside of the enclosure of the apricot board-once the heat dissipation effect is not good; wide = high degree of road At the same time, the adjacent metal oxide semiconducting semiconductor or CMOS or complementary metal is damaged, and 70 ancient 4 1 @ 4 private valley nets are easily damaged by their high temperature. There is a need for improvement that is not ideal and urgently needed. . [New content] Therefore, the main creator of this project is the component cooling module (2). The master M provides—a type of "electricity, mainly using a cooling module. E-2003-P33-tw-new M254643 = Electronic components such as metal oxide semiconductor (MOS) or complementary body (CM0s) are located at the case of the circuit board of the county, away from its neighbors, and obviously have two creative systems for effective use On the connector assembly on the edge of the circuit board, there are more than two connectors, and a heat dissipation module is installed. There is no need to change the heat dissipation amount of the circuit board 02 and this creation. The other end of the heat pipe is connected to the heat-conducting sheet. The heat pipe needs to be equipped with heat pipes of different degrees of f-folding, which can be set in accordance with different functions and the actual space. Therefore, it has flexible production. This creation can reduce the impact of Mqs ^ m0s on the service life of neighboring electronic components (such as capacitors), especially when the inside of the case has poor heat dissipation effect, or when the temperature of the ring outside the case is relatively low, this creation can Avoid damage to capacitors and other components near MQ S or CMO S. The better technical means adopted is a type of "electronic component monthly thermal pull group", which includes ^ 莫 Η Η 唾 ^. Crying: Gan: a first heat sink and a second heat sink; among them: the thermally conductive sheet 'It is arranged on the circuit to be powered on and in contact with the surface of at least one electronic component to dissipate heat; the first heat sink is a heat sink with multiple heatsinks E-2003-P33-tw-new 5 M254643, and a plurality of heat radiating fins penetrate a heat pipe, and one end of the heat pipe is connected to the heat conductive fin; the second heat sink is a heat sink having a plurality of heat radiating fins, and the heat radiating fins penetrate a heat pipe and one end of the heat pipe Connected to the heat-conducting sheet; and two or more heat-dissipating fins are respectively fixed on the wall surface of a casing, thereby guiding the high temperature generated by the electronic components to be dissipated during operation to the circuit board for pressing Installed in the case, for a large area of heat dissipation, and away from the adjacent capacitor. Another technical means adopted in this creation is an "electronic component heat sink module", which includes a heat conducting sheet, a first heat sink, and a second heat sink; among them: the heat conducting sheet is provided on a circuit board And is in contact with the surface of at least one electronic component to dissipate heat; the first heat sink is a heat sink having a plurality of heat dissipating fins, and a plurality of heat dissipating fins pass through a heat pipe, and one end of the heat pipe is connected to the heat conducting piece, The second heat sink is a heat sink having a plurality of heat dissipation fins, and a heat pipe is penetrated through the plurality of heat dissipation fins, and one end of the heat pipe is connected to the heat conduction sheet; and the front end surfaces of the two heat sinks are respectively fixed to a casing. With this, the high E-2003-P33-tw-new 6 M254643 generated by the electronic components to be dissipated during operation can be compared to the case where the circuit board is installed. Large area dispersion ..., and return to the neighboring capacitor. [Embodiment] In order to further understand the characteristics, technical means and specific functions and purposes of this creation, we will list more specific examples of this creation, followed by detailed description with drawings and numbers. Please refer to FIG. 1 to FIG. 3. In a preferred embodiment, the heat dissipation module of the present invention includes a heat conducting sheet 30, a first heat sink 10, and a second heat sink 20. The thermally conductive sheet 30 is disposed on the circuit board 40 and is in contact with the surface of a plurality of electronic components 41 such as a metal oxide semiconductor (MOS) or a complementary metal oxide semiconductor (CM0s); the first heat sink 10 is a The heat sink has a plurality of heat radiating fins 15, and a heat pipe 11 is penetrated through the plurality of heat radiating fins 15, and one end of the heat pipe 11 is connected to the heat conducting fin 30; the second heat sink 20, which is a heat sink having a plurality of heat dissipation fins 26, and a heat pipe 22 is penetrated through the plurality of heat dissipation fins 26, and one end of the heat pipe 24 is connected to the heat conduction sheet 30; The two or more heat dissipation fins 15, 26 are respectively fixed on the wall surface of a casing 70; thereby, the plurality of electronic components 41 can be placed on the heat conductive sheet 30 and the first and second heat sinks 10 and 20. The high temperature generated during operation leads to power supply E-2003-P33-tw-new 7 M254643 Plate 40 by means of the housing 70, a larger area of heat dissipation, away from the adjacent plurality of capacitive elements 43, a plurality of electronic components to substantially reduce the occurrence of damage to the adjacent impact element 41, the capacitor element 43 and to avoid the complex. In addition, the edges of the general circuit board 40 are often densely provided with connector combinations 42, 44, 45, 46, 47 of different types of functions, and when the circuit board 40 is housed inside the casing 70, the The cover 60 covers: the connector combination 42'44, 45, 46, 47. Therefore, the heat dissipation module of this creation only needs to be equipped with two heat pipes 11, 22 with different bending degrees, depending on the actual available space. The two radiators 10, 20 are arranged at different positions on the wall surface of the casing 70, and are located above the connector combination 42 ', or above the connector combination 45, 46, or above the connection state combination 46, 47, etc. to match different The shell 70 of the model is elastically produced; of which: the connector combination 42 can be a combination of DSUB connectors; Hai connection is a combination of 4 4 port Hai connection connection 4 5 combination; the connector combination 46 combination;, the connection check 47, can be the combination of Audio connection ；; and 2 = New Link 42, 44, 45, 46, 47 setting sequence and type functions ^ 糸 Slightly different depending on the needs of the world, and the slot corresponding to the cover. The number of π and the number to be explained here is that the thermally conductive sheet 30 is inserted with a metal oxide semiconductor (MOS) or a complementary metal oxide semiconductor: it can be a combination of PS2 connectors; it can be IEEE 1394 The connector and the USB connection may be a LAN connector and a USB connector group E-2003-P3 3 -tw-ne w M254643 (CMOS) and a plurality of electronic components 41 are provided with a thermally conductive adhesive tape at the surface contact (not shown) Or, apply thermal conductive adhesive, so that the thermal conductive sheet 30 can be fully attached to the surface of the plurality of electronic components 41 to increase the effect of fixing and contacting thermal conductivity. What should be explained here is that the end faces of the two or more heat dissipation fins 15, 26 can be provided with thermally conductive tape (not shown), or coated with thermally conductive adhesive to make the two or more heat dissipation fins 15, 26 can be fully affixed to the wall of the case 70 to increase the effectiveness of fixing and contacting heat conduction. Please refer to FIG. 4. In the second embodiment, the heat dissipation module of the present invention includes a heat conducting sheet 30, a first heat sink 10, and a second heat sink 20. Among them: ^ The heat conducting sheet 30 Is located on the circuit board 40 and is in contact with the surface of a plurality of electronic components 41 such as a metal oxide semiconductor (MOS) or a complementary metal oxide semiconductor (CM0s); ^ Hai Di political heat is 1 〇, is A heat sink having a plurality of heat dissipation fins 15 is provided, and a heat pipe 11 is penetrated through the plurality of heat dissipation fins 15, one end of the heat pipe 11 is connected to the heat conduction sheet 30; The heat sink is a heat sink having a plurality of heat radiating fins 26, and a heat pipe 22 is penetrated through the plurality of heat radiating fins 26. One end of the heat pipe 24 is connected to the heat conducting fin 30. And the front end surfaces 10a and 20a of the two radiators 10 and 20 are respectively fixed on the wall surface of the case 70; E-2003-P33-tw-new 9 M254643, so that the heat transfer sheet 30 and The first and second heat sinks 10,20, will generate a high temperature during the operation of the plurality of electronic components 41, Lead to the 7G housing of the circuit board 40 for heat dissipation in a larger area. This is promoted in accordance with the best implementation example of this creation and applies to the extension of the spirit of this creation, so it should still include Within the scope of the patent in this case. What should be explained here is that the end faces 10a, 20a before the two radiators 10, 20 can be provided with thermal conductive tape (not shown), or coated with thermal adhesive to make the two radiators 1 〇, 2〇 Before the end surface 1 (^, 2 can be fully attached to the wall of the case 70, and increase the effectiveness of fixation and contact thermal conductivity.-In summary, this creation can indeed achieve The requirements of the original creation purpose, and greatly improved the great practical effect of traditional products, but also no public sale of products with the same structural characteristics, it is obvious that the case has met the requirements for the establishment of a new type of patent. I urge you to grant the patent in this case at an early date, so as to highlight the spirit of the patent law rewarding the country's legislative spirit. It is highly anticipated. The content of the above and the examples mentioned are only examples of this preferred embodiment. Various changes and modifications made by people based on this creation should still be included in the patent scope of this case. [Schematic description of the drawings] The illustration of the drawings is as follows: Figure 1 is a three-dimensional exploded view of the creation; Figure 2 is a creation Three-dimensional display of implementation status Figure 3 is a partial cross-sectional top view of the state of implementation of the creation; E-2003-P33-tw-new 10 M254643 Figure 4 is a partial cross-sectional top view of the second embodiment of the creation. A heat sink 10 electronic components 41 front end 10a connector combination 42 heat pipe 1 Γ capacitive element 43 heat radiation fin 15 connector combination 44 second heat sink 20 connector combination 45 front end 20a connector combination 46 heat pipe 22 connector combination 47 '' Cooling fins 26 Cover 60 Thermally conductive sheet 30 Circuit board 40 Case 70 E-2003-P33-tw-new 11