CN100574597C - 散热器 - Google Patents

散热器 Download PDF

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Publication number
CN100574597C
CN100574597C CNB2006100617539A CN200610061753A CN100574597C CN 100574597 C CN100574597 C CN 100574597C CN B2006100617539 A CNB2006100617539 A CN B2006100617539A CN 200610061753 A CN200610061753 A CN 200610061753A CN 100574597 C CN100574597 C CN 100574597C
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radiator
radiating fin
distinguished
admirable
air intake
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Expired - Fee Related
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CNB2006100617539A
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CN101111141A (zh
Inventor
赖秀昌
吴弘毅
叶振兴
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Priority to CNB2006100617539A priority Critical patent/CN100574597C/zh
Priority to US11/309,641 priority patent/US20080017365A1/en
Publication of CN101111141A publication Critical patent/CN101111141A/zh
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Publication of CN100574597C publication Critical patent/CN100574597C/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

一种散热器，包括若干散热鳍片，所述散热器具有一进风端及一出风端，每一散热鳍片的上表面自中部向所述进风端呈流线型逐渐降低，并自所述中部向所述出风端先呈一较陡曲线降低至一定高度后再呈一平缓曲线降低。所述散热鳍片采用此流线形设计，不但可以减少风流在流入所述散热鳍片时产生的回流或涡旋，还有利于加快风流流出所述散热鳍片时的扩散速度，由此提高散热效率。

Description

散热器
技术领域
本发明涉及一种散热装置，特别涉及一种具较高散热效率的散热器。
背景技术
随着集成电路制造技术的发展，电子元件朝着更快的运算速度迈进。由于电子元件的运算速度越来越快，其高速运作过程中伴随产生的热量也越来越多。若电子元件产生的热量不被及时导出，将会导致电子元件的温度持续升高，从而影响其运行的稳定性，甚至会烧毁整个电子元件。为此，业界通常在产生热量较多的电子元件如中央处理器的顶面装设一个散热器，再通过系统风扇的协助排出热量。
请共同参照图1及图2，现有技术散热器10包括一个方形底座12及若干从所述底座12顶部向上延伸的方形散热鳍片14。当所述散热器10装设在计算机主板的某一个电子元件上时，所述电子元件即为发热源，所述发热源位于所述底座12底部的中央位置。
在所述散热器10一定距离处设置一个风扇(图未示)协助散热时，所述风扇产生的风流110进入所述散热器10的一端为进风端13；所述风流110流出所述散热器10的一端为出风端15。由于每一散热鳍片14面向所述进风端13的侧面均有一定的厚度且大致垂直于所述风流110的方向，故所述风流110在流至所述散热器10的每一散热鳍片14时均会受到较大阻力，受阻气流产生回流，或者在所述进风端13产生涡旋，从而使得气流的流动不顺畅，增加所述风流110进入所述散热器10的风阻，降低了散热效率。
发明内容
鉴于上述内容，有必要提供一种可提高散热效率的散热器。
一种散热器，包括若干散热鳍片，所述散热器具有一进风端及一出风端，每一散热鳍片的上表面自中部向所述进风端呈流线型逐渐降低，自所述中部向所述出风端先呈一较陡曲线降低至一定高度后再呈一平缓曲线降低。
相较现有技术，所述散热鳍片的上表面自所述中部向所述进风端呈流线型逐渐降低，则所述风流与所述散热鳍片位于所述进风端的侧端面不再垂直，故所述风流所受到的阻力大大降低，基本上不会产生回流或涡旋，从而降低风阻，有效提高散热效率；并且，所述散热鳍片的上表面自所述中部向所述出风端先沿所述较陡曲线降低至一定高度后再沿所述平缓曲线降低，则风流在从所述散热鳍片中流出后分成两部分扩散，由此可以降低所述风流流出所述散热鳍片后在扩散的过程的相互扰动，从而加快了扩散速度，有利于提高散热效率。
附图说明
下面参照附图结合具体实施方式对本发明作进一步的描述。
图1为现有散热器的立体图。
图2为图1的主视图。
图3为本发明散热器的较佳实施方式的立体图。
图4为图3的主视图。
具体实施方式
请参照图3及图4，本发明散热器20的较佳实施方式包括一个底座22、若干从所述底座22向上延伸的散热鳍片24。在所述散热器20一定距离处设置一个风扇(图未示)协助散热时，所述风扇产生的风流进入所述散热器20的一端为进风端222；所述风流流出所述散热器20的一端为出风端224。所述每一散热鳍片24的中部较高。每一散热鳍片24的上表面自所述中部向所述进风端222呈流线型逐渐降低直至与所述底座22的上表面相交；同时，所述每一散热鳍片24的上表面自所述中部向所述出风端224先呈一较陡曲线226降低再呈一平缓曲线228降低。
本发明散热器20的较佳实施方式在使用时固定于一个计算机主板的某一个电子元件(图未示)上，用于给所述电子元件散热。所述电子元件，即发热源位于所述底座22底部的中央位置。
所述风扇产生的风流流经所述散热器20时，由于所述散热鳍片24的上表面自所述中部向所述进风端222呈流线型逐渐降低，则所述风流与所述散热鳍片24位于所述进风端222的侧端面不再垂直，故所述风流所受到的阻力大大降低，基本上不会产生回流或涡旋，从而降低风阻，有效提高散热效率。
另外，由于所述散热鳍片24的上表面自所述中部向所述出风端224先沿所述较陡曲线226降低后再沿所述平缓曲线228降低，则所述风流中流经所述散热鳍片24上部的第一风流310自所述较陡曲线226处流出后即开始扩散，而所述风流中流经所述散热鳍片24下部的第二风流320自所述平缓曲线228靠近所述出风端224处流出后才开始扩散，即所述风流从所述散热鳍片24中流出后分成两部分扩散，这样可以降低所述风流流出所述散热鳍片24后在扩散的过程气流之间的相互扰动，从而加快了扩散速度，有利于提高散热效率。

Claims (3)

1.一种散热器，包括若干散热鳍片，所述散热器具有一进风端及一出风端，其特征在于：每一散热鳍片的上表面自中部向所述进风端呈流线型逐渐降低，所述每一散热鳍片的上表面自中部向所述出风端先呈一较陡曲线降低至一定高度后再呈一平缓曲线降低。
2.如权利要求1所述的散热器，其特征在于：所述散热器还包括一底座，所述散热鳍片自所述底座延伸。
3.如权利要求2所述的散热器，其特征在于：所述散热鳍片的上表面自中部向所述进风端呈流线型逐渐降低直至与所述底座的上表面相交。
CNB2006100617539A 2006-07-21 2006-07-21 散热器 Expired - Fee Related CN100574597C (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CNB2006100617539A CN100574597C (zh) 2006-07-21 2006-07-21 散热器
US11/309,641 US20080017365A1 (en) 2006-07-21 2006-09-01 Heat sink

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Application Number Priority Date Filing Date Title
CNB2006100617539A CN100574597C (zh) 2006-07-21 2006-07-21 散热器

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CN101111141A CN101111141A (zh) 2008-01-23
CN100574597C true CN100574597C (zh) 2009-12-23

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101155501B (zh) * 2006-09-27 2011-11-09 鸿富锦精密工业（深圳）有限公司 散热器
CN201230437Y (zh) * 2008-07-03 2009-04-29 鸿富锦精密工业（深圳）有限公司 散热器
US20130032323A1 (en) * 2011-08-02 2013-02-07 Hsu Takeho Heat sink structure
TWI454334B (zh) * 2012-03-16 2014-10-01 Inventec Corp 熱交換器及其製造方法
CN104471799B (zh) * 2012-06-12 2017-10-17 安费诺富加宜（亚洲）私人有限公司 连接器组件
CN103874395A (zh) * 2012-12-17 2014-06-18 西门子（上海）电气传动设备有限公司 散热器及采用该散热器的变频器
CN106304773A (zh) * 2015-06-11 2017-01-04 鸿富锦精密工业(武汉)有限公司 散热装置及散热组件

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CN101111141A (zh) 2008-01-23

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