CN101155501B - 散热器 - Google Patents

散热器 Download PDF

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Publication number
CN101155501B
CN101155501B CN200610200928XA CN200610200928A CN101155501B CN 101155501 B CN101155501 B CN 101155501B CN 200610200928X A CN200610200928X A CN 200610200928XA CN 200610200928 A CN200610200928 A CN 200610200928A CN 101155501 B CN101155501 B CN 101155501B
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radiator
radiating
aircurrent
outlet section
stream interface
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Expired - Fee Related
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CN101155501A (zh
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孙珂
陈晓竹
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Priority to CN200610200928XA priority Critical patent/CN101155501B/zh
Priority to US11/778,074 priority patent/US7532468B2/en
Publication of CN101155501A publication Critical patent/CN101155501A/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

一种散热器，包括一基座及自所述基座延伸形成的若干散热鳍片，这些散热鳍片于一侧端向另一侧端的方向倾斜形成一逸流面，所述散热器还包括设于所述逸流面的导流部。所述散热器由于具有所述逸流面，可减小对流经所述散热器的空气流的阻碍作用，热空气流可快速流出所述散热器，从而使流经所述散热器的空气流量相对增加，提高了所述散热器的散热效率。而且，由于所述导流部对流出所述散热器的热空气流的导引作用，大部分的热空气流可以被导引并排放到系统外，改善了系统内部的热环境，有利于系统散热。另外，由于减小了这些散热鳍片的材料耗费，制造成本也得以降低。

Description

散热器
技术领域
本发明涉及一种散热器。
背景技术
近年来随着科技的日益进步，尤其是半导体技术的飞速发展，集成电路芯片的集成度越来越高，相应地，其运算速度越来越快，这样，集成电路芯片在运行中所产生的热量也越来越多。为了能够迅速将集成电路芯片于高速运行时所产生的热量驱走，业界多于集成电路芯片上表面安置一由具有良好导热性能的材料制成的散热器。
如图3及图4所示的一种散热器40，包括一方形底座42及自所述底座42上表面延伸形成且呈规则排列的若干方形散热鳍片44，使用中，所述散热器40的下表面紧贴于一集成电路芯片(图未示)的上表面，当自一风源(图未示)吹来的冷空气流到达所述散热器40的一端部时，冷空气流便顺着形成于这些散热鳍片44之间的空气流道46流经这些散热鳍片44，带走由所述集成电路芯片所产生的被传导至这些散热鳍片44上的热量，继而，吸收热量后的空气流从所述散热器40的另一端部流出，从而为所述集成电路芯片进行散热，使所述集成电路芯片的温度保持在正常的工作温度范围内。
然而，在冷空气流自所述散热器40的一端部流向另一端部时，由于受所述散热器40的各散热鳍片44及原存在于空气流道46中的空气阻碍，空气流的流速越来越小而无法迅速通过所述散热器40，导致流经所述散热器40的冷空气流量减小，不利于所述集成电路芯片的散热。再者，由于自所述散热器40的另一端部流出的吸收热量后的空气除一部分被导引出所述集成电路芯片所处的系统外，还有部分空气自由扩散至所述集成电路芯片所处的系统内，这样会影响所述集成电路芯片所处的系统的运行。
发明内容
鉴于以上内容，有必要提供一种具有较高散热效率且利于整个系统散热的散热器。
一种散热器，包括一基座及自所述基座延伸形成的若干散热鳍片，至少部分散热鳍片于一侧端向另一侧端的方向倾斜形成逸流面，所述散热器还包括设于所述逸流面的导流部。
与现有技术相比较，所述散热器借助所述逸流面，可减小对流经所述散热器的空气流的阻碍作用，热空气流可快速流出所述散热器，从而使流经所述散热器的空气流量相对增加，提高了所述散热器的散热效率；而且，由于所述导流部对流出所述散热器的热空气流的导引作用，大部分的热空气流可以被导引并排放到系统外，改善了系统内部的热环境，有利于系统散热。
附图说明
图1是本发明散热器的较佳实施方式的立体图。
图2是图1的主视图。
图3是现有散热器的立体图。
图4是图3的主视图。
具体实施方式
请参考图1，本发明散热器的较佳实施方式包括一基座10、自所述基座10的上表面向上延伸形成的若干散热鳍片20及设于这些散热鳍片20所共同形成的一侧端的导流部30。
请继续参考图2，所述基座10为一具一定厚度的方形板体，一般多由具有较高热传导系数的材料制成，如金属铜等，所述基座10于适当位置处开设两固定孔12。这些散热鳍片20规则排列于所述基座10的上表面，且每一散热鳍片20与相邻的散热鳍片20相隔一定间距，形成横贯所述散热器的两侧端的空气流道22。这些散热鳍片20于一侧端形成一出风部26，于另一侧端形成一与所述出风部26相对的进风部24，所述出风部26向所述进风部24的方向倾斜形成一逸流面，在本较佳实施方式中，所述逸流面为一斜平面28。
在本较佳实施方式中，所述导流部30是水平设于所述出风部26的中上部位置的导流板，用于导引流出所述出风部26的斜平面28后的空气。
使用时，借助两固定件(图未示)经由所述基座10的固定孔12固定于一电路板(图未示)的相应孔内，并使所述基座10的下表面紧密贴接于所述电路板上需要散热的芯片上，从而将所述散热器固定于所述电路板为所述芯片散热。如图2所示，当自一风源(图未示)，一般为设于所述电路板所在系统的送风风扇，吹来的冷空气流到达所述散热器的进风部24时，这些冷空气流便顺着这些散热鳍片20之间的空气流道22流动，并吸收由所述芯片传导至这些散热鳍片20上的热量。当这些空气流流到这些散热鳍片20的出风部26时，尽管其流速已越来越小，但由于所述斜平面28的设置，使这些散热鳍片20的出风部26对这些空气流的阻碍作用得以减小，这样，这些吸收热量后的空气流还是可以较快地自所述出风部26流出。而后，大部分的热空气流在所述导流板的导引下，由系统风扇(图未示)吸出系统外。这样，所述散热器由于具有所述斜平面28，可减小对流经所述散热器的空气流的阻碍作用，热空气流可快速流出所述散热器的出风部26，从而使流经所述散热器的空气流量相对增加，提高了所述散热器的散热效率。而且，由于所述导流板对流出所述出风部26的热空气流的导引作用，大部分的热空气流可以被吸出系统外，从而改善了系统内部的热环境，有利于系统散热。另外，由于减小了这些散热鳍片20的材料耗费，制造成本也得以降低。
此外，所述逸流面也可是向所述进风部24的方向倾斜形成的曲面。所述呈平面或曲面的逸流面也可是由部分散热鳍片20于所述出风部26一侧向所述进风部24的方向倾斜形成。

Claims (5)

1.一种散热器，包括一基座及自所述基座延伸形成的若干散热鳍片，其特征在于：这些散热鳍片于一侧端形成一出风部，于另一侧端形成一与所述出风部相对的进风部，至少部分散热鳍片于所述一侧端向所述另一侧端的方向倾斜形成逸流面，所述散热器还包括设于所述逸流面的导流部，所述导流部是水平设于所述出风部的中上部位置的导流板。
2.如权利要求1所述的散热器，其特征在于：所述逸流面是平面。
3.如权利要求1所述的散热器，其特征在于：所述逸流面是曲面。
4.如权利要求1所述的散热器，其特征在于：每一散热鳍片与相邻的散热鳍片之间形成空气流道。
5.如权利要求1所述的散热器，其特征在于：所述基座上开设固定孔。
CN200610200928XA 2006-09-27 2006-09-27 散热器 Expired - Fee Related CN101155501B (zh)

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CN200610200928XA CN101155501B (zh) 2006-09-27 2006-09-27 散热器
US11/778,074 US7532468B2 (en) 2006-09-27 2007-07-16 Heat sink having high heat dissipation efficiency

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US7532468B2 (en) 2009-05-12
US20080074845A1 (en) 2008-03-27

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