JP2005353740A - 半導体素子及び半導体装置 - Google Patents
半導体素子及び半導体装置 Download PDFInfo
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- JP2005353740A JP2005353740A JP2004171215A JP2004171215A JP2005353740A JP 2005353740 A JP2005353740 A JP 2005353740A JP 2004171215 A JP2004171215 A JP 2004171215A JP 2004171215 A JP2004171215 A JP 2004171215A JP 2005353740 A JP2005353740 A JP 2005353740A
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- semiconductor element
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- adhesive
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
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Abstract
【解決手段】実装部材の実装面に接着剤あるいは半田によって実装される接着面を備えた半導体素子であって、前記半導体素子の側面のいずれかと略平行な方向に延在する溝が前記接着面に設けられたことを特徴とする半導体素子を提供する。
【選択図】図1
Description
すなわち、前述の如く半導体素子100を接着剤109の上に載せ、実装基板107に接着する際には、余剰の接着剤(半田)109が半導体素子100の周辺に排出される。この工程によって、半導体素子100と実装基板107との密着性を向上させるとともに、半導体素子100の下の接着剤(半田)109の膜厚を低減させることができる。その結果として、半導体装置の熱抵抗を下げることができる。
本発明は、かかる課題の認識に基づいてなされたものであり、その目的は、熱抵抗の増加を最小限にとどめ、半導体基板に半導体素子を接着する際の半導体素子周辺への接着剤のしみだしを抑制できる半導体素子及びその半導体素子を搭載した半導体装置を提供することにある。
図1は、本発明の実施の形態にかかる半導体素子の断面構造を例示する模式図である。本実施形態にかかる半導体素子1は、GaAs基板2と、GaAs基板2の上に形成されHBT(ヘテロ接合バイポーラトランジスタ)素子部4と、HBT素子部4を覆うように設けられたポリイミド絶縁保護膜3と、GaAs基板2の上に形成された2つのボンディング用Auパッド5と、を有する。HBT素子部4は、GaAs基板2の上にエピタキシャル成長させることによって形成される。GaAs基板2の裏面側には、複数の溝6(6S)が例えば、格子状に設けられている。後に詳述するように、このような溝6を設けることにより半導体素子1の裏面を固定する接着剤のはみだしを抑制できる。
図3は、本実施形態の半導体素子のさらに他の具体例を表す模式断面図である。本具体具体例においても、基板富の裏面に複数の溝6が、例えば格子状に設けられている。
また、図2に表した半導体素子と、図3に表した半導体素子と、の相違点は、溝6のピッチにある。この点については、後に詳述する。
すなわち、本発明においては、複数の半導体素子1が形成されるべきウェーハ状態において、そのウェーハ2Aの裏面側から、例えばダイシングソーを用いて、複数の溝6(6S)を形成することができる。これら複数の溝6(6S)は、図4に表したように、ウェーハ2Aの裏面側に縦横格子状に形成することができる。ただし、本発明においては、溝6を必ずしも格子状に設ける必要はなく、例えば、図5に表したように、複数の溝6を縦方向に形成してもよく、図6に表したように、横方向に形成してもよい。なお、これらいずれの場合も、隣接する溝6が互いに平行となるように設けることが望ましい。
また、隣り合う半導体素子の間の境界部分にも、溝6Sが形成されている。すなわち、隣り合う半導体素子の境界は、溝6Sの中央に位置する。溝6Sの中央に、半導体素子1を分離するためのスクライブラインSが形成される。溝6、6Sは、基板2の裏面側からその厚みの途中まで形成されるが、スクライブラインSは半導体素子1を分離するために基板2を貫通するように設けられる。この場合に、スクライブラインSの幅を溝6Sの幅よりも狭くすると、スクライブラインSを形成する際に、溝6Sの開口端で生ずる「チッピング」を防ぐことができる。
または、溝6の幅Wは50μmとし、溝6Sの幅Lは100μmとしてもよい。
なお、本具体例の場合には、溝6の幅Wは、スクライブラインSの幅と同一でも、狭くても広くてもよい。例えば、溝6の幅Wは50μm、深さは75μm、隣り合う溝6の中心間距離(ピッチ)Pは175μmとすることができる。
図13は、図1及び図10に表した半導体素子の製造方法を表す工程断面図である。
まず、図13(a)に表したように、GaAs基板2(膜厚650μm)の上に、HBT素子部4と、ボンディング用Auパッド5を形成し、さらに、HBT素子部4を覆うようにポリイミド絶縁保護膜3を形成する。HBT素子部4は、例えば一辺400μmの正方形状であり、GaAs基板2の上にエピタキシャル成長させることによって形成する。半導体素子1は、例えば、一辺1mmの正方形状とすることができる。HBT素子4から基板2の裏面に至る熱抵抗率を下げるためにGaAs基板2の裏面を、厚さ150μmになるまでラッピングによって研磨する。
また、スクライブラインSを基板2に貫通させず、わずかに切り残し部を残してもよい。この場合には、切り残し部をへき開することにより、半導体素子1を分離できる。このようにすると、チッピングを低減できる場合が多い。
また、スクライブラインSは、基板2の表面側でなく、裏面側から形成してもよい。
次に、図14(b)に表したように、基板2の裏面側から溝6を格子状に形成する。その方法としては、ダイシングでもよく、ウェットエッチングやドライエッチングなどでもよい。溝6の深さは75μm、カーフ幅50μmで所定のピッチで形成することができる。ただし、半導体素子1の境界部分に溝6が形成されないように、ピッチを適宜決定する。
以上の工程を経て、図14(d)に表したように半導体素子1が完成する。
次に、図15(b)に表したように、基板2の裏面側から溝6を格子状に形成する。その方法としては、ダイシングでもよく、ウェットエッチングやドライエッチングなどでもよい。溝6の深さは75μm、カーフ幅100μm、ピッチ175μmとすることができる。なお、半導体素子1の境界部分には溝6を形成しない。
以上の工程を経て、図15(d)に表したように半導体素子1が完成する。
前述したように、半導体素子1としてパワー素子などを搭載した場合、数ミリ角の面積に対して数ワットの消費電力があるため、良好な放熱性を持ち合わせていることも必要である。自己発熱量の大きなパワー素子にとって、熱抵抗はその半導体素子の性能あるいは信頼性を決める重要なパラメータである。
また、格子状の溝6を浅く形成すると、接着剤9が溝6の一部を塞ぐ可能性がある。この場合、溝6の中に、両端が接着剤9により塞がれた密閉空間が形成される場合がある。このような密閉空間が形成されると、製造工程中、特に半導体素子1の実装後の接着剤9のベーキング工程中、あるいは半導体素子1の動作などに際して加熱された時に密閉空間に封印されたガス圧が上昇し、半導体素子1が実装基板7からはがれるおそれがある。
すなわち、厚さZmmのGaAs基板2の上に、面積W×Wmm2のHBT素子部4が形成されている。GaAs基板2の裏面には、幅Lmm、深さhmmの溝6が形成されている。発明者は、発熱部(HBT素子部4)面積と、その下の半導体基板2の底面に形成された溝6の面積が、半導体素子の熱抵抗比に及ぼす影響について調べた。
ここで、発熱部(HBT素子部4)の面積をW×Wmm2、溝6の底面積をL×Lmm2、溝6の深さをhmm、GaAs基板2の厚さをZmmとした。図17の縦軸は、半導体素子1の熱抵抗比を表し、横軸は、相対パラメータR=溝(削除部)の底面積/発熱部面積=(L/W)2を表す。溝6の深さを表すパラメータとして、H=溝の深さ/GaAs基板の厚さ=h/Zを定義し、4種類のHについて、熱抵抗比を計算した。計算は有限要素法を用いて行った。
図17から、発熱部の面積に対して溝6の面積が増加するに従って熱抵抗比が上昇することが分かる。また、パラメータHについてみると、溝6の深さが相対的に大きくなるに従って、熱抵抗比が上昇することが分かる。
図18は、本発明者が実施した評価のモデルを表す模式図である。
すなわち、同図(a)に表したように、実装基板7の上に、接着剤9を滴下する。この時、接着剤9の平面的なサイズXを半導体素子1のサイズXとほぼ同一とし、厚みをt0とした。
このように、本発明によれば、熱抵抗の増加をわずかな範囲に抑えつつ、接着剤9のはみ出し量を大幅に低減することが可能である。その結果として、半導体装置のサイズを縮小でき、同時に寄生容量や寄生インダクタンスの低減によって高周波特性を向上できる。
図20は、本実施形態の半導体素子の変型例を表す模式断面図である。
また、図21は、本変型例の半導体素子における溝の配置を例示する模式平面図である。 これらの図面については、図1乃至図19に関して前述したものと同一の要素には同一の符号を付して詳細な説明は省略する。
本変型例においては、溝6は、発熱部(HBT素子部4)の下には形成されていない。発明者の検討の結果によれば、発熱部直下における半導体素子1と実装基板7との接触底面積が発熱部の面積に等しい場合には、熱抵抗の実質的上昇は認められなかった。つまり、発熱部の下に溝6を設けない場合には、熱抵抗の実質的な上昇はみられなかった。したがって、この半導体素子1では、熱抵抗を上昇させずに接着剤9のはみだしを抑制することができる。格子状の溝6の深さと幅は、例えば、それぞれ75μm、50μmとすることができる。
本変型例においては、溝6、6Sの断面形状が、略三角形状とされている。すなわち、図1乃至図21に関して前述した半導体素子のGaAs基板2の裏面に形成されている溝6の断面形状は、ほぼ四角形である。これは、例えば、先端が鈍角な刃形のダイシングソーでダンシングすることにより形成できる。
これに対して、本変型例においては、例えば、先端が鋭角なダイシングソーでダイシングすることにより、略三角形状の溝6を形成できる。このような溝6を形成しても、接着剤9のはみだしを抑制できる。
2 基板
2A ウェーハ
3 保護膜
4 素子部
5 パッド
6、6S 溝
7 実装基板
8 ボンディングパッド
9 接着剤
10 ボンディングワイヤ
100 半導体素子
102 基板
103 ポリイミド絶縁保護膜
104 素子部
105 ボンディングパッド
107 実装基板
108 ボンディングパッド
109 半田(接着剤)
110 ボンディングワイヤ
S スクライブライン
Claims (5)
- 実装部材の実装面に接着剤あるいは半田によって実装される接着面を備えた半導体素子であって、
前記半導体素子の側面のいずれかと略平行な方向に延在する溝が前記接着面に設けられたことを特徴とする半導体素子。 - 前記溝は、前記接着面に格子状に設けられたことを特徴とする請求項1記載の半導体素子。
- 前記溝は、前記接着面の端部にも設けられたことを特徴とする請求項1または2に記載の半導体素子。
- 前記半導体素子は、発熱部を有し、
前記溝は、前記発熱部の下においては実質的に設けられていないことを特徴とする請求項1〜3のいずれか1つに記載の半導体素子。 - 実装面を有する実装部材と、
前記実装面に対して接着剤あるいは半田によって実装された半導体素子であって、前記半導体素子の側面のいずれかと略平行な方向に延在する溝が前記接着面に設けられた半導体素子と、
を備えたことを特徴とする半導体装置。
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US10/975,385 US7215013B2 (en) | 2004-06-09 | 2004-10-29 | Semiconductor device and semiconductor apparatus |
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Cited By (3)
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JP2007114126A (ja) * | 2005-10-21 | 2007-05-10 | Fujitsu Ltd | 半導体装置及びその製造方法 |
JP2011187518A (ja) * | 2010-03-05 | 2011-09-22 | Nippon Telegr & Teleph Corp <Ntt> | 半導体装置およびその製造方法 |
JPWO2021038712A1 (ja) * | 2019-08-27 | 2021-03-04 |
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DE102009028360B3 (de) * | 2009-08-07 | 2010-12-09 | Infineon Technologies Ag | Verfahren zur Herstellung einer Schaltungsträgeranordnung und eines Leistungselektronikmoduls mit einer Verankerungsstruktur zur Herstellung einer temperaturwechselstabilen Lötverbindung |
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JPH06177178A (ja) | 1992-12-01 | 1994-06-24 | Nissan Motor Co Ltd | 半導体チップの構造 |
ATE211586T1 (de) | 1995-10-16 | 2002-01-15 | Siemens Nv | Polymeres höcker-matrix-gehäuse für mikrowellen- schaltungsanordnungen |
JP3526376B2 (ja) * | 1996-08-21 | 2004-05-10 | 株式会社東芝 | 半導体装置及びその製造方法 |
WO1999012207A1 (fr) * | 1997-09-01 | 1999-03-11 | Fanuc Ltd | Procede d'assemblage de petites pieces et ensemble de petites pieces |
KR100426044B1 (ko) | 1999-05-20 | 2004-04-06 | 지멘스 악티엔게젤샤프트 | 배선 납땜 접속부용 폴리머 스터드를 적어도 두 개 이상갖는 기판 |
US6406636B1 (en) * | 1999-06-02 | 2002-06-18 | Megasense, Inc. | Methods for wafer to wafer bonding using microstructures |
DE10045249A1 (de) * | 2000-09-13 | 2002-04-04 | Siemens Ag | Photovoltaisches Bauelement und Verfahren zum Herstellen des Bauelements |
US7001798B2 (en) * | 2001-11-14 | 2006-02-21 | Oki Electric Industry Co., Ltd. | Method of manufacturing semiconductor device |
JPWO2004085321A1 (ja) * | 2003-03-25 | 2006-06-29 | 旭硝子株式会社 | 溝部を有するガラス基板及びその製造方法及びガラス基板作製用プレス型 |
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JP2007114126A (ja) * | 2005-10-21 | 2007-05-10 | Fujitsu Ltd | 半導体装置及びその製造方法 |
JP2011187518A (ja) * | 2010-03-05 | 2011-09-22 | Nippon Telegr & Teleph Corp <Ntt> | 半導体装置およびその製造方法 |
JPWO2021038712A1 (ja) * | 2019-08-27 | 2021-03-04 | ||
WO2021038712A1 (ja) * | 2019-08-27 | 2021-03-04 | 三菱電機株式会社 | 半導体装置および半導体チップ |
KR20220006598A (ko) * | 2019-08-27 | 2022-01-17 | 미쓰비시덴키 가부시키가이샤 | 반도체 장치 |
TWI760771B (zh) * | 2019-08-27 | 2022-04-11 | 日商三菱電機股份有限公司 | 半導體裝置 |
JP7173361B2 (ja) | 2019-08-27 | 2022-11-16 | 三菱電機株式会社 | 半導体装置 |
KR102556121B1 (ko) | 2019-08-27 | 2023-07-14 | 미쓰비시덴키 가부시키가이샤 | 반도체 장치 |
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US20050275114A1 (en) | 2005-12-15 |
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