JP5295146B2 - 電力用半導体装置およびその製造方法 - Google Patents
電力用半導体装置およびその製造方法 Download PDFInfo
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- JP5295146B2 JP5295146B2 JP2010022749A JP2010022749A JP5295146B2 JP 5295146 B2 JP5295146 B2 JP 5295146B2 JP 2010022749 A JP2010022749 A JP 2010022749A JP 2010022749 A JP2010022749 A JP 2010022749A JP 5295146 B2 JP5295146 B2 JP 5295146B2
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Description
図1は、全体が100で表される、本発明の実施の形態1にかかる電力用半導体装置(パワーモジュール)の側面図である。なお、図1では、回路基板11に搭載される電力用半導体素子6以外の部品や、電力用半導体素子6を制御する制御基板等は、図面の簡略化のために記載していない。
図4A〜図4Cは、本発明の実施の形態2にかかる電力用半導体装置において、電力用半導体素子6と配線パターン5との間を2本の金属リボンを積み重ねて接続する場合のボンディング工程の概略図である。図1と同一符号は、同一または相当箇所を示す。金属リボン516、517、617は、例えばアルミニウムからなり、断面は矩形断面形状となっている。
Claims (6)
- 回路基板の上に電力用半導体素子が設けられ、それぞれが矩形断面を有する第1金属リボンおよび第2金属リボンが、該電力用半導体素子の上に積み重ねて接合された電力用半導体装置であって、
該第1金属リボンは、該電力用半導体素子に、第1接合領域と、第1接合領域よりテール部の端部側に該第1接合領域から離れて設けられた第2接合領域とで接合され、
該第2金属リボンは、該第1接合領域の上方には接合されずに、該第2接合領域の上方でのみ、該第1金属リボンと接合されたことを特徴とする電力用半導体装置。 - 上記第2金属リボンのテール部の端部は、上記第1金属リボンのテール部の端部より上記第2接合領域側にあることを特徴とする請求項1に記載の電力用半導体装置。
- 回路基板上に設けられた電力用半導体素子の上に、それぞれが矩形断面を有する第1金属リボンおよび第2金属リボンを積み重ねて接合する電力用半導体装置の製造方法であって、
該電力用半導体素子の上に該第1金属リボンを超音波接合して第1接合領域を形成する第1接合工程と、
該電力用半導体素子の上に延在する該第1金属リボンの、該第1接合領域とは異なるテール部の上に、該第2金属リボンを超音波接合して、該第1金属リボンに該第2金属リボンを接合するとともに、該第1金属リボンを、該第1接合領域と離れた第2接合領域で該電力用半導体素子に接合する第2接合工程と、を含むことを特徴とする電力用半導体装置の製造方法。 - 上記第1接合工程の後に、上記第1金属リボンの上記テール部と反対側の他端を、上記回路基板に設けられた回路パターンに超音波接合する工程を含み、
上記第2接合工程は、該回路パターン上の該第1金属リボンの該テール部上に上記第2金属リボンの一端を超音波接合した後に、該第2金属リボンを該電力用半導体素子上の該第1金属リボンのテール部上に接合する工程を含むことを特徴とする請求項3に記載の製造方法。 - 更に、上記電力用半導体素子上の上記第1金属リボンのテール部の上に切断面が位置するようにして、上記第2金属リボンをカッティングする工程を含むことを特徴とする請求項3または4に記載の製造方法。
- 上記第1金属リボンに上記第2金属リボンを接合する工程と、該第1金属リボンを、上記第2接合領域で上記電力用半導体素子に接合する工程は、一つの超音波接合工程で行われることを特徴とする請求項3に記載の製造方法。
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