JP4094505B2 - 熱起動自己整合ヒートシンク - Google Patents

熱起動自己整合ヒートシンク Download PDF

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Publication number
JP4094505B2
JP4094505B2 JP2003276764A JP2003276764A JP4094505B2 JP 4094505 B2 JP4094505 B2 JP 4094505B2 JP 2003276764 A JP2003276764 A JP 2003276764A JP 2003276764 A JP2003276764 A JP 2003276764A JP 4094505 B2 JP4094505 B2 JP 4094505B2
Authority
JP
Japan
Prior art keywords
heat sink
sink body
heat
cavity
thermal material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2003276764A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004072101A (ja
JP2004072101A5 (enExample
Inventor
ブレント・エイ・ブードレックス
ステイシー・フレイカー
ロイ・エム・ジーハミ
エリック・シー・ペターソン
クリスチャン・エル・ベラディ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hewlett Packard Development Co LP
Original Assignee
Hewlett Packard Development Co LP
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Development Co LP filed Critical Hewlett Packard Development Co LP
Publication of JP2004072101A publication Critical patent/JP2004072101A/ja
Publication of JP2004072101A5 publication Critical patent/JP2004072101A5/ja
Application granted granted Critical
Publication of JP4094505B2 publication Critical patent/JP4094505B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4882—Assembly of heatsink parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F2013/005—Thermal joints
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2003276764A 2002-07-31 2003-07-18 熱起動自己整合ヒートシンク Expired - Fee Related JP4094505B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/210,000 US6625026B1 (en) 2002-07-31 2002-07-31 Heat-activated self-aligning heat sink

Publications (3)

Publication Number Publication Date
JP2004072101A JP2004072101A (ja) 2004-03-04
JP2004072101A5 JP2004072101A5 (enExample) 2005-05-26
JP4094505B2 true JP4094505B2 (ja) 2008-06-04

Family

ID=28041360

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003276764A Expired - Fee Related JP4094505B2 (ja) 2002-07-31 2003-07-18 熱起動自己整合ヒートシンク

Country Status (2)

Country Link
US (1) US6625026B1 (enExample)
JP (1) JP4094505B2 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6878573B2 (en) * 2001-06-19 2005-04-12 Koninklijke Philips Electronics N.V. Method of manufacturing a semiconductor device and semiconductor device
US6868899B1 (en) * 2003-08-25 2005-03-22 Hewlett-Packard Development Company, L.P. Variable height thermal interface
TWM302874U (en) * 2006-07-06 2006-12-11 Cooler Master Co Ltd Combinative structure of heat radiator
US20080173427A1 (en) * 2007-01-23 2008-07-24 Richard Schumacher Electronic component cooling
GB2479491B (en) * 2008-12-29 2014-08-13 Hewlett Packard Development Co Systems and method of a carrier device for placement of thermal interface materials
US20110162828A1 (en) * 2010-01-06 2011-07-07 Graham Charles Kirk Thermal plug for use with a heat sink and method of assembling same
CN103096678B (zh) * 2011-10-27 2017-09-15 全亿大科技（佛山）有限公司 散热装置
EP3107735B1 (de) * 2014-02-20 2018-05-02 Gallus Ferd. Rüesch AG Siebdruckschablone und verfahren zu deren bebilderung
US9913412B2 (en) 2014-03-18 2018-03-06 Apple Inc. Shielding structures for system-in-package assemblies in portable electronic devices
US9949359B2 (en) 2014-03-18 2018-04-17 Apple Inc. Multi-layer thin-film coatings for system-in-package assemblies in portable electronic devices
US9820373B2 (en) * 2014-06-26 2017-11-14 Apple Inc. Thermal solutions for system-in-package assemblies in portable electronic devices

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4897764A (en) * 1988-10-31 1990-01-30 Control Data Corporation Conductive cooling cup module
JP3241639B2 (ja) * 1997-06-30 2001-12-25 日本電気株式会社 マルチチップモジュールの冷却構造およびその製造方法
US6292362B1 (en) * 1999-12-22 2001-09-18 Dell Usa, L.P. Self-contained flowable thermal interface material module
JP3690729B2 (ja) * 2000-09-11 2005-08-31 インターナショナル・ビジネス・マシーンズ・コーポレーション 電気回路装置及びコンピュータ

Also Published As

Publication number Publication date
JP2004072101A (ja) 2004-03-04
US6625026B1 (en) 2003-09-23

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