JP2004319476A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2004319476A5 JP2004319476A5 JP2004112425A JP2004112425A JP2004319476A5 JP 2004319476 A5 JP2004319476 A5 JP 2004319476A5 JP 2004112425 A JP2004112425 A JP 2004112425A JP 2004112425 A JP2004112425 A JP 2004112425A JP 2004319476 A5 JP2004319476 A5 JP 2004319476A5
- Authority
- JP
- Japan
- Prior art keywords
- switch
- liquid metal
- polymer
- channel
- switching channel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920000642 polymer Polymers 0.000 claims 22
- 229910001338 liquidmetal Inorganic materials 0.000 claims 17
- 229910000679 solder Inorganic materials 0.000 claims 12
- 239000000758 substrate Substances 0.000 claims 8
- 238000004519 manufacturing process Methods 0.000 claims 4
- 239000012530 fluid Substances 0.000 claims 2
- 238000000034 method Methods 0.000 claims 1
- 238000005459 micromachining Methods 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/413,094 US6743991B1 (en) | 2003-04-14 | 2003-04-14 | Polymeric liquid metal switch |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2004319476A JP2004319476A (ja) | 2004-11-11 |
| JP2004319476A5 true JP2004319476A5 (enExample) | 2007-04-05 |
Family
ID=32298258
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004112425A Pending JP2004319476A (ja) | 2003-04-14 | 2004-04-06 | ポリマー・スイッチおよびポリマー・スイッチの製造方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US6743991B1 (enExample) |
| JP (1) | JP2004319476A (enExample) |
| DE (1) | DE10360994A1 (enExample) |
| GB (1) | GB2400735B (enExample) |
| TW (1) | TW200425197A (enExample) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004079288A (ja) * | 2002-08-13 | 2004-03-11 | Agilent Technol Inc | 液体金属を用いた電気接点開閉装置 |
| US6888977B2 (en) * | 2003-04-14 | 2005-05-03 | Agilent Technologies, Inc. | Polymeric liquid metal optical switch |
| US6798937B1 (en) * | 2003-04-14 | 2004-09-28 | Agilent Technologies, Inc. | Pressure actuated solid slug optical latching relay |
| US7189934B2 (en) * | 2003-11-13 | 2007-03-13 | Honeywell International Inc. | Self-healing liquid contact switch |
| US6822176B1 (en) * | 2004-04-16 | 2004-11-23 | Agilent Technologies, Inc. | Liquid metal switch and method of manufacture therefor |
| US7164090B2 (en) * | 2005-02-28 | 2007-01-16 | Agilent Technologies, Inc. | Liquid metal switch employing a single volume of liquid metal |
| US20060211233A1 (en) * | 2005-03-21 | 2006-09-21 | Skyworks Solutions, Inc. | Method for fabricating a wafer level package having through wafer vias for external package connectivity and related structure |
| US7576426B2 (en) * | 2005-04-01 | 2009-08-18 | Skyworks Solutions, Inc. | Wafer level package including a device wafer integrated with a passive component |
| US20060289607A1 (en) * | 2005-06-28 | 2006-12-28 | Buchwalter Stephen L | Composite solder transfer moldplate structure and method of making same |
| US7358452B2 (en) * | 2005-06-30 | 2008-04-15 | Agilent Technlolgies, Inc. | Architecture and method of fabrication for a liquid metal microswitch (LIMMS) |
| US7211754B2 (en) * | 2005-08-01 | 2007-05-01 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Fluid-based switch, and method of making same |
| US7358833B2 (en) * | 2006-03-14 | 2008-04-15 | Lucent Technologies Inc. | Method and apparatus for signal processing using electrowetting |
| US7449649B2 (en) * | 2006-05-23 | 2008-11-11 | Lucent Technologies Inc. | Liquid switch |
| US7635606B2 (en) * | 2006-08-02 | 2009-12-22 | Skyworks Solutions, Inc. | Wafer level package with cavities for active devices |
| US20080217708A1 (en) * | 2007-03-09 | 2008-09-11 | Skyworks Solutions, Inc. | Integrated passive cap in a system-in-package |
| US20090001576A1 (en) * | 2007-06-29 | 2009-01-01 | Surinder Tuli | Interconnect using liquid metal |
| CN101878527B (zh) * | 2007-11-30 | 2012-09-26 | 斯盖沃克斯瑟路申斯公司 | 使用倒装芯片安装的晶片级封装 |
| US8900931B2 (en) | 2007-12-26 | 2014-12-02 | Skyworks Solutions, Inc. | In-situ cavity integrated circuit package |
| US7939945B2 (en) | 2008-04-30 | 2011-05-10 | Intel Corporation | Electrically conductive fluid interconnects for integrated circuit devices |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR0174871B1 (ko) | 1995-12-13 | 1999-02-01 | 양승택 | 랫칭형 열구동 마이크로 릴레이 소자 |
| US6323447B1 (en) | 1998-12-30 | 2001-11-27 | Agilent Technologies, Inc. | Electrical contact breaker switch, integrated electrical contact breaker switch, and electrical contact switching method |
| US6373356B1 (en) | 1999-05-21 | 2002-04-16 | Interscience, Inc. | Microelectromechanical liquid metal current carrying system, apparatus and method |
| US6512322B1 (en) | 2001-10-31 | 2003-01-28 | Agilent Technologies, Inc. | Longitudinal piezoelectric latching relay |
| US6515404B1 (en) | 2002-02-14 | 2003-02-04 | Agilent Technologies, Inc. | Bending piezoelectrically actuated liquid metal switch |
-
2003
- 2003-04-14 US US10/413,094 patent/US6743991B1/en not_active Expired - Fee Related
- 2003-10-28 TW TW092129941A patent/TW200425197A/zh unknown
- 2003-12-23 DE DE10360994A patent/DE10360994A1/de not_active Withdrawn
-
2004
- 2004-03-30 GB GB0407165A patent/GB2400735B/en not_active Expired - Fee Related
- 2004-04-06 JP JP2004112425A patent/JP2004319476A/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2004319476A5 (enExample) | ||
| JP5427462B2 (ja) | 熱電変換モジュール | |
| JP5445344B2 (ja) | 電力用半導体装置 | |
| CN102171378A (zh) | 用于光学和电子器件的热管理的键合金属和陶瓷板 | |
| US20100307730A1 (en) | Liquid-cooled heat dissipating device and method of making the same | |
| TW201201641A (en) | Micro sensor | |
| CN101986424A (zh) | 将电路基台直接扩散接合到蒸气室 | |
| TW201624779A (zh) | 熱電轉換裝置及其應用系統 | |
| TWI688741B (zh) | 製作具有印刷毛細結構之超薄熱管板的方法 | |
| JP2008283067A (ja) | Al−AlN複合材料及びその製造方法並びに熱交換器 | |
| CN105537793A (zh) | 一种功率模块焊接用焊片 | |
| JP2004319476A (ja) | ポリマー・スイッチおよびポリマー・スイッチの製造方法 | |
| JP3920977B2 (ja) | ヒートシンクおよびその製造方法 | |
| CN105472879A (zh) | 一种alc pcb板的辅助焊接结构及其制备工艺 | |
| CN113242641B (zh) | 一种单层印制电路板及一种芯片封装电子设备 | |
| CN101001501A (zh) | 混合式复合材料基板 | |
| TWM451518U (zh) | 散熱裝置 | |
| KR101638569B1 (ko) | 고온 베이킹 장치용 히팅 플레이트 | |
| WO2020073905A1 (zh) | 制作具有印刷毛细结构的超薄热管板的方法 | |
| JP2004318136A5 (enExample) | ||
| CN101552212B (zh) | 半导体元件与热管的接合方法 | |
| CN110137141A (zh) | 一种具有毛细微槽结构的去金属化陶瓷基板及其焊接方法 | |
| US20080079109A1 (en) | Thermoelectric device and method for making the same | |
| CN103181732B (zh) | 一种电煎烤盘 | |
| JP2001007265A (ja) | 冷却装置付基板及びその製法 |