TW200425197A - Polymeric liquid metal switch - Google Patents
Polymeric liquid metal switch Download PDFInfo
- Publication number
- TW200425197A TW200425197A TW092129941A TW92129941A TW200425197A TW 200425197 A TW200425197 A TW 200425197A TW 092129941 A TW092129941 A TW 092129941A TW 92129941 A TW92129941 A TW 92129941A TW 200425197 A TW200425197 A TW 200425197A
- Authority
- TW
- Taiwan
- Prior art keywords
- converter
- polymer
- heater
- channel
- liquid metal
- Prior art date
Links
- 229910001338 liquidmetal Inorganic materials 0.000 title claims abstract description 65
- 229920000642 polymer Polymers 0.000 claims abstract description 82
- 239000000758 substrate Substances 0.000 claims abstract description 60
- 229910000679 solder Inorganic materials 0.000 claims abstract description 41
- 238000000034 method Methods 0.000 claims abstract description 29
- 239000010410 layer Substances 0.000 claims description 56
- 239000007788 liquid Substances 0.000 claims description 32
- 230000008859 change Effects 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 239000004642 Polyimide Substances 0.000 claims description 7
- 239000012790 adhesive layer Substances 0.000 claims description 7
- 229920001721 polyimide Polymers 0.000 claims description 7
- 238000002844 melting Methods 0.000 claims description 6
- 230000008018 melting Effects 0.000 claims description 6
- 239000000919 ceramic Substances 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 238000011161 development Methods 0.000 claims description 2
- 238000005538 encapsulation Methods 0.000 claims 1
- 230000000422 nocturnal effect Effects 0.000 claims 1
- 239000002861 polymer material Substances 0.000 claims 1
- 230000007246 mechanism Effects 0.000 abstract description 3
- 238000003384 imaging method Methods 0.000 abstract description 2
- 238000000608 laser ablation Methods 0.000 abstract 1
- 238000005459 micromachining Methods 0.000 abstract 1
- 230000003287 optical effect Effects 0.000 description 14
- 230000001070 adhesive effect Effects 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 238000005452 bending Methods 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 241000199698 Limacodidae Species 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000004891 communication Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 150000002466 imines Chemical class 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 2
- 229920006254 polymer film Polymers 0.000 description 2
- 238000005488 sandblasting Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- -1 Fluorene imine Chemical class 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910004205 SiNX Inorganic materials 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 229910052743 krypton Inorganic materials 0.000 description 1
- DNNSSWSSYDEUBZ-UHFFFAOYSA-N krypton atom Chemical compound [Kr] DNNSSWSSYDEUBZ-UHFFFAOYSA-N 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N o-biphenylenemethane Natural products C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 239000012925 reference material Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 229920006259 thermoplastic polyimide Polymers 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H11/00—Apparatus or processes specially adapted for the manufacture of electric switches
- H01H11/02—Apparatus or processes specially adapted for the manufacture of electric switches for mercury switches
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H29/00—Switches having at least one liquid contact
- H01H29/28—Switches having at least one liquid contact with level of surface of contact liquid displaced by fluid pressure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/0036—Switches making use of microelectromechanical systems [MEMS]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H29/00—Switches having at least one liquid contact
- H01H2029/008—Switches having at least one liquid contact using micromechanics, e.g. micromechanical liquid contact switches or [LIMMS]
Landscapes
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Contacts (AREA)
- Micromachines (AREA)
- Mechanical Light Control Or Optical Switches (AREA)
- Push-Button Switches (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/413,094 US6743991B1 (en) | 2003-04-14 | 2003-04-14 | Polymeric liquid metal switch |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW200425197A true TW200425197A (en) | 2004-11-16 |
Family
ID=32298258
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW092129941A TW200425197A (en) | 2003-04-14 | 2003-10-28 | Polymeric liquid metal switch |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US6743991B1 (enExample) |
| JP (1) | JP2004319476A (enExample) |
| DE (1) | DE10360994A1 (enExample) |
| GB (1) | GB2400735B (enExample) |
| TW (1) | TW200425197A (enExample) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004079288A (ja) * | 2002-08-13 | 2004-03-11 | Agilent Technol Inc | 液体金属を用いた電気接点開閉装置 |
| US6798937B1 (en) * | 2003-04-14 | 2004-09-28 | Agilent Technologies, Inc. | Pressure actuated solid slug optical latching relay |
| US6888977B2 (en) * | 2003-04-14 | 2005-05-03 | Agilent Technologies, Inc. | Polymeric liquid metal optical switch |
| US7189934B2 (en) * | 2003-11-13 | 2007-03-13 | Honeywell International Inc. | Self-healing liquid contact switch |
| US6822176B1 (en) * | 2004-04-16 | 2004-11-23 | Agilent Technologies, Inc. | Liquid metal switch and method of manufacture therefor |
| US7164090B2 (en) * | 2005-02-28 | 2007-01-16 | Agilent Technologies, Inc. | Liquid metal switch employing a single volume of liquid metal |
| US20060211233A1 (en) * | 2005-03-21 | 2006-09-21 | Skyworks Solutions, Inc. | Method for fabricating a wafer level package having through wafer vias for external package connectivity and related structure |
| US7576426B2 (en) * | 2005-04-01 | 2009-08-18 | Skyworks Solutions, Inc. | Wafer level package including a device wafer integrated with a passive component |
| US20060289607A1 (en) * | 2005-06-28 | 2006-12-28 | Buchwalter Stephen L | Composite solder transfer moldplate structure and method of making same |
| US7358452B2 (en) * | 2005-06-30 | 2008-04-15 | Agilent Technlolgies, Inc. | Architecture and method of fabrication for a liquid metal microswitch (LIMMS) |
| US7211754B2 (en) * | 2005-08-01 | 2007-05-01 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Fluid-based switch, and method of making same |
| US7358833B2 (en) * | 2006-03-14 | 2008-04-15 | Lucent Technologies Inc. | Method and apparatus for signal processing using electrowetting |
| US7449649B2 (en) * | 2006-05-23 | 2008-11-11 | Lucent Technologies Inc. | Liquid switch |
| US7635606B2 (en) * | 2006-08-02 | 2009-12-22 | Skyworks Solutions, Inc. | Wafer level package with cavities for active devices |
| US20080217708A1 (en) * | 2007-03-09 | 2008-09-11 | Skyworks Solutions, Inc. | Integrated passive cap in a system-in-package |
| US20090001576A1 (en) * | 2007-06-29 | 2009-01-01 | Surinder Tuli | Interconnect using liquid metal |
| KR20150068495A (ko) | 2007-11-30 | 2015-06-19 | 스카이워크스 솔루션즈, 인코포레이티드 | 플립 칩 실장을 이용하는 웨이퍼 레벨 패키징 |
| US8900931B2 (en) | 2007-12-26 | 2014-12-02 | Skyworks Solutions, Inc. | In-situ cavity integrated circuit package |
| US7939945B2 (en) | 2008-04-30 | 2011-05-10 | Intel Corporation | Electrically conductive fluid interconnects for integrated circuit devices |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR0174871B1 (ko) | 1995-12-13 | 1999-02-01 | 양승택 | 랫칭형 열구동 마이크로 릴레이 소자 |
| US6323447B1 (en) | 1998-12-30 | 2001-11-27 | Agilent Technologies, Inc. | Electrical contact breaker switch, integrated electrical contact breaker switch, and electrical contact switching method |
| US6373356B1 (en) | 1999-05-21 | 2002-04-16 | Interscience, Inc. | Microelectromechanical liquid metal current carrying system, apparatus and method |
| US6512322B1 (en) | 2001-10-31 | 2003-01-28 | Agilent Technologies, Inc. | Longitudinal piezoelectric latching relay |
| US6515404B1 (en) | 2002-02-14 | 2003-02-04 | Agilent Technologies, Inc. | Bending piezoelectrically actuated liquid metal switch |
-
2003
- 2003-04-14 US US10/413,094 patent/US6743991B1/en not_active Expired - Fee Related
- 2003-10-28 TW TW092129941A patent/TW200425197A/zh unknown
- 2003-12-23 DE DE10360994A patent/DE10360994A1/de not_active Withdrawn
-
2004
- 2004-03-30 GB GB0407165A patent/GB2400735B/en not_active Expired - Fee Related
- 2004-04-06 JP JP2004112425A patent/JP2004319476A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JP2004319476A (ja) | 2004-11-11 |
| GB0407165D0 (en) | 2004-05-05 |
| GB2400735A (en) | 2004-10-20 |
| US6743991B1 (en) | 2004-06-01 |
| GB2400735B (en) | 2006-05-24 |
| DE10360994A1 (de) | 2004-11-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TW200425197A (en) | Polymeric liquid metal switch | |
| US6548895B1 (en) | Packaging of electro-microfluidic devices | |
| US6443179B1 (en) | Packaging of electro-microfluidic devices | |
| TW591255B (en) | Device and method for coupling optical fiber and optical component | |
| JP5220004B2 (ja) | フリップチップ素子及びその製造方法 | |
| CN102407669B (zh) | 喷射管 | |
| JP4480939B2 (ja) | ガラス系材料からなるフラット基板を構造化する方法 | |
| US9625336B2 (en) | Pressure sensor and method for producing a pressure sensor | |
| US6124631A (en) | Micro sensor and method for making same | |
| US6806431B2 (en) | Liquid metal micro-relay with suspended heaters and multilayer wiring | |
| TW201205728A (en) | Method of manufacturing package, and method of manufacturing piezoelectric vibrator | |
| US7531897B2 (en) | Process for sealing and connecting parts of electromechanical, fluid and optical microsystems and device obtained thereby | |
| JP2003115658A (ja) | 配線基板の製造方法、充填物挿入方法、配線基板、及び素子パッケージ | |
| JP2003158440A (ja) | 接合部材および当該接合部材を用いた圧電振動デバイスおよび圧電振動デバイスの製造方法 | |
| US20060029338A1 (en) | Package sealing means and photonic device packages so formed | |
| JP2005285864A (ja) | デバイス装置 | |
| US6884951B1 (en) | Fluid-based switches and methods for manufacturing and sealing fluid-based switches | |
| US6888977B2 (en) | Polymeric liquid metal optical switch | |
| CN102216201A (zh) | 密封方法 | |
| JPWO2004024618A1 (ja) | マイクロデバイス及び製造方法 | |
| US20040245078A1 (en) | Surface joined multi-substrate liquid metal switching device | |
| US6732905B2 (en) | Vented cavity, hermetic solder seal | |
| US6759611B1 (en) | Fluid-based switches and methods for producing the same | |
| JP2005227039A (ja) | 圧力センサ装置及びその製造方法 | |
| US8020490B1 (en) | Method of fabricating MEMS-based micro detonators |