JP2004319476A - ポリマー・スイッチおよびポリマー・スイッチの製造方法 - Google Patents
ポリマー・スイッチおよびポリマー・スイッチの製造方法 Download PDFInfo
- Publication number
- JP2004319476A JP2004319476A JP2004112425A JP2004112425A JP2004319476A JP 2004319476 A JP2004319476 A JP 2004319476A JP 2004112425 A JP2004112425 A JP 2004112425A JP 2004112425 A JP2004112425 A JP 2004112425A JP 2004319476 A JP2004319476 A JP 2004319476A
- Authority
- JP
- Japan
- Prior art keywords
- switch
- heater
- liquid metal
- polymer
- channel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H11/00—Apparatus or processes specially adapted for the manufacture of electric switches
- H01H11/02—Apparatus or processes specially adapted for the manufacture of electric switches for mercury switches
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H29/00—Switches having at least one liquid contact
- H01H29/28—Switches having at least one liquid contact with level of surface of contact liquid displaced by fluid pressure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/0036—Switches making use of microelectromechanical systems [MEMS]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H29/00—Switches having at least one liquid contact
- H01H2029/008—Switches having at least one liquid contact using micromechanics, e.g. micromechanical liquid contact switches or [LIMMS]
Landscapes
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Contacts (AREA)
- Micromachines (AREA)
- Mechanical Light Control Or Optical Switches (AREA)
- Push-Button Switches (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/413,094 US6743991B1 (en) | 2003-04-14 | 2003-04-14 | Polymeric liquid metal switch |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2004319476A true JP2004319476A (ja) | 2004-11-11 |
| JP2004319476A5 JP2004319476A5 (enExample) | 2007-04-05 |
Family
ID=32298258
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004112425A Pending JP2004319476A (ja) | 2003-04-14 | 2004-04-06 | ポリマー・スイッチおよびポリマー・スイッチの製造方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US6743991B1 (enExample) |
| JP (1) | JP2004319476A (enExample) |
| DE (1) | DE10360994A1 (enExample) |
| GB (1) | GB2400735B (enExample) |
| TW (1) | TW200425197A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007042636A (ja) * | 2005-08-01 | 2007-02-15 | Avago Technologies Ecbu Ip (Singapore) Pte Ltd | 流体スイッチ及びその製造方法 |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004079288A (ja) * | 2002-08-13 | 2004-03-11 | Agilent Technol Inc | 液体金属を用いた電気接点開閉装置 |
| US6798937B1 (en) * | 2003-04-14 | 2004-09-28 | Agilent Technologies, Inc. | Pressure actuated solid slug optical latching relay |
| US6888977B2 (en) * | 2003-04-14 | 2005-05-03 | Agilent Technologies, Inc. | Polymeric liquid metal optical switch |
| US7189934B2 (en) * | 2003-11-13 | 2007-03-13 | Honeywell International Inc. | Self-healing liquid contact switch |
| US6822176B1 (en) * | 2004-04-16 | 2004-11-23 | Agilent Technologies, Inc. | Liquid metal switch and method of manufacture therefor |
| US7164090B2 (en) * | 2005-02-28 | 2007-01-16 | Agilent Technologies, Inc. | Liquid metal switch employing a single volume of liquid metal |
| US20060211233A1 (en) * | 2005-03-21 | 2006-09-21 | Skyworks Solutions, Inc. | Method for fabricating a wafer level package having through wafer vias for external package connectivity and related structure |
| US7576426B2 (en) * | 2005-04-01 | 2009-08-18 | Skyworks Solutions, Inc. | Wafer level package including a device wafer integrated with a passive component |
| US20060289607A1 (en) * | 2005-06-28 | 2006-12-28 | Buchwalter Stephen L | Composite solder transfer moldplate structure and method of making same |
| US7358452B2 (en) * | 2005-06-30 | 2008-04-15 | Agilent Technlolgies, Inc. | Architecture and method of fabrication for a liquid metal microswitch (LIMMS) |
| US7358833B2 (en) * | 2006-03-14 | 2008-04-15 | Lucent Technologies Inc. | Method and apparatus for signal processing using electrowetting |
| US7449649B2 (en) * | 2006-05-23 | 2008-11-11 | Lucent Technologies Inc. | Liquid switch |
| US7635606B2 (en) * | 2006-08-02 | 2009-12-22 | Skyworks Solutions, Inc. | Wafer level package with cavities for active devices |
| US20080217708A1 (en) * | 2007-03-09 | 2008-09-11 | Skyworks Solutions, Inc. | Integrated passive cap in a system-in-package |
| US20090001576A1 (en) * | 2007-06-29 | 2009-01-01 | Surinder Tuli | Interconnect using liquid metal |
| KR20150068495A (ko) | 2007-11-30 | 2015-06-19 | 스카이워크스 솔루션즈, 인코포레이티드 | 플립 칩 실장을 이용하는 웨이퍼 레벨 패키징 |
| US8900931B2 (en) | 2007-12-26 | 2014-12-02 | Skyworks Solutions, Inc. | In-situ cavity integrated circuit package |
| US7939945B2 (en) | 2008-04-30 | 2011-05-10 | Intel Corporation | Electrically conductive fluid interconnects for integrated circuit devices |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR0174871B1 (ko) | 1995-12-13 | 1999-02-01 | 양승택 | 랫칭형 열구동 마이크로 릴레이 소자 |
| US6323447B1 (en) | 1998-12-30 | 2001-11-27 | Agilent Technologies, Inc. | Electrical contact breaker switch, integrated electrical contact breaker switch, and electrical contact switching method |
| US6373356B1 (en) | 1999-05-21 | 2002-04-16 | Interscience, Inc. | Microelectromechanical liquid metal current carrying system, apparatus and method |
| US6512322B1 (en) | 2001-10-31 | 2003-01-28 | Agilent Technologies, Inc. | Longitudinal piezoelectric latching relay |
| US6515404B1 (en) | 2002-02-14 | 2003-02-04 | Agilent Technologies, Inc. | Bending piezoelectrically actuated liquid metal switch |
-
2003
- 2003-04-14 US US10/413,094 patent/US6743991B1/en not_active Expired - Fee Related
- 2003-10-28 TW TW092129941A patent/TW200425197A/zh unknown
- 2003-12-23 DE DE10360994A patent/DE10360994A1/de not_active Withdrawn
-
2004
- 2004-03-30 GB GB0407165A patent/GB2400735B/en not_active Expired - Fee Related
- 2004-04-06 JP JP2004112425A patent/JP2004319476A/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007042636A (ja) * | 2005-08-01 | 2007-02-15 | Avago Technologies Ecbu Ip (Singapore) Pte Ltd | 流体スイッチ及びその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200425197A (en) | 2004-11-16 |
| GB0407165D0 (en) | 2004-05-05 |
| GB2400735A (en) | 2004-10-20 |
| US6743991B1 (en) | 2004-06-01 |
| GB2400735B (en) | 2006-05-24 |
| DE10360994A1 (de) | 2004-11-25 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20070216 |
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| RD04 | Notification of resignation of power of attorney |
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| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20090821 |
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| A02 | Decision of refusal |
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