WO2020073905A1 - 制作具有印刷毛细结构的超薄热管板的方法 - Google Patents

制作具有印刷毛细结构的超薄热管板的方法 Download PDF

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Publication number
WO2020073905A1
WO2020073905A1 PCT/CN2019/110038 CN2019110038W WO2020073905A1 WO 2020073905 A1 WO2020073905 A1 WO 2020073905A1 CN 2019110038 W CN2019110038 W CN 2019110038W WO 2020073905 A1 WO2020073905 A1 WO 2020073905A1
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Prior art keywords
sheet
trench
capillary
sheet structure
capillary structure
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PCT/CN2019/110038
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English (en)
French (fr)
Inventor
陈振贤
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广州力及热管理科技有限公司
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Publication of WO2020073905A1 publication Critical patent/WO2020073905A1/zh

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the invention provides a method for manufacturing an ultra-thin heat pipe plate with a printed capillary structure, in particular a method for manufacturing an ultra-thin heat pipe plate by using a printing paste method and heating the paste to form a porous capillary structure .
  • the microprocessor is the core component of electronic and communication products. It is easy to generate heat under high-speed operation and become the main heating element of electronic devices. If the heat is not dissipated immediately, local processing hot spots (Hot Spot) will be generated. If there is no good thermal management scheme and heat dissipation system, it often causes the microprocessor to overheat and fail to perform its proper function, and even affects the life and reliability of the entire electronic device system. Therefore, electronic products need excellent heat dissipation capacity, especially ultra-thin electronic devices such as smartphones and tablet PCs need excellent heat dissipation capacity.
  • the effective way to deal with the heat and heat dissipation of hot spots (Hot Spot) of electronic and communication products is to contact one side of the flat micro heat pipe (Micro Heat Pipe) or the temperature equalizing plate (Vapor Chamber) with the heat source and the other side to the electronic device It is hoped that the high heat generated by the microprocessor will be conducted and distributed to the case in a more efficient way to radiate the heat into the air.
  • Hot Spot hot spots
  • the micro-heat pipe or temperature equalization plate is basically a closed cavity containing working fluid. Through the continuous circulation of the working fluid in the cavity, the two-phase change of liquid and gas, and the gas and liquid between the heat absorption end and the condensation end The convection of the liquid returns to achieve the purpose of rapid heat conduction or heat dissipation.
  • the micro heat pipe is in the shape of a long cylinder, the larger the inner cavity space, the faster the convection speed, and the better heat conduction and heat dissipation.
  • the current technology must reprocess the heat pipe into a flat elongated shape to be installed in the space of a highly narrow cabinet, and even need to use an ultra-thin micro-heat thickness less than 0.5mm catheter.
  • the thickness of the back cover of the mobile phone is less than 1.0 mm, and the surface of the microprocessor on the circuit board is only about 0.3 mm to 0.4 mm away from the inner surface of the back cover of the mobile phone, which can be inserted into the flat micro heat pipe.
  • the ultra-thin micro-heat pipe is made by flattening a copper pipe with a diameter of 2mm, the thickness of the upper and lower walls can be deducted, and the height of the cavity of the flat micro-heat pipe can be only about 0.2mm.
  • the inner space of the road often becomes very narrow.
  • Such a small steam convection air channel has greatly restricted the heat removal and heat dissipation effects of the micro heat pipe, and it is even more unable to cope with the growth of the heat dissipation function caused by the increasing function of the microprocessor.
  • a method of manufacturing a heat pipe plate in which a fiber or a braided copper mesh (mesh) is laid in a heat pipe plate formed by pressing two copper sheets with grooves as a drainage work
  • the capillary structure of the fluid In addition, the porosity of the fiber or braided copper mesh is low and the capillary force is poor, which results in unsatisfactory heat removal and thermal conductivity.
  • the fiber is laid and formed in a groove structure with a depth of only 100um ⁇ 200um
  • the capillary structure of the braided copper mesh often needs to be manufactured manually with the assistance of the jig, and the difficulty of automated production is high and the yield is low.
  • the object of the present invention is to provide a method for manufacturing an ultra-thin heat pipe plate with a printed capillary structure, which is different from the conventional method of printing a paste on the groove of the sheet structure by laying fibers or braiding a copper mesh In the tank, the slurry is heated again to form a porous capillary structure, and then an ultra-thin heat pipe plate is fabricated.
  • the capillary structure formed in this way has better capillary force, and the inner cavity of the air passage has a more elastically designed space, and it is easier to make a thinner heat pipe plate. Because it is produced by printing, it greatly improves the automation of mass production and reduces the cost of production.
  • the present invention discloses a method for manufacturing an ultra-thin heat pipe plate with a printed capillary structure, which is characterized by comprising the following steps:
  • the first sheet-like structure and the second sheet-like structure are processed to form an ultra-thin heat pipe plate with heat conduction function.
  • the slurry further includes a first powder, a second powder and a solvent, the first powder is a solder alloy, and the second powder is a surface solderable powder.
  • the step of heating the first sheet structure to form the capillary structure on the inner surface of the slurry further includes the following sub-steps:
  • the first sheet-like structure is heated at a temperature higher than the melting point of the first powder and lower than the melting point of the second powder, so that the slurry forms a hydrophilic capillary structure on the inner surface.
  • the thickness of the capillary structure depends on the composition, mixing ratio and solid content of the first powder, the second powder and the solvent.
  • the method before the step of pressing and sealing the first sheet structure and the second sheet structure to form the internal cavity between the capillary structure of the first groove and the second sheet structure, the method further includes There are the following steps:
  • a second trench is formed on the second sheet structure, and the position of the second trench corresponds to the position of the first trench.
  • the duct is sealed so that the first sheet-like structure and the second sheet-like structure form the ultra-thin heat pipe plate with heat conduction function.
  • the step of forming the first trench on the first sheet structure further includes:
  • each first trench has a first end and a second end, and the first end of the first trench communicates with at least the other The first end of the first trench, and the second end of the first trench does not communicate with the second end of another first trench, and the capillary structure is formed between the first trench and the other First trench.
  • the step of forming the first trench on the first sheet structure further includes:
  • each first trench has a first end and a second end, and the first end of the first trench communicates with at least the other The first end of the first trench, and the second end of the first trench at least communicate with the second end of the other first trench.
  • the method further comprises:
  • the capillary structure is formed on the connecting portion of the second end and attached to the inner surface, and the capillary structure is not formed between the first end and the second end of the other first trench;
  • the step of pressing and sealing the first sheet structure and the second sheet structure to form the internal cavity between the capillary structure of the first groove and the second sheet structure is further as :
  • the cavity structure includes a gas-water flow channel with the capillary structure and the internal cavity, and an auxiliary air channel without the capillary structure.
  • the total thickness of the ultra-thin heat pipe plate is not less than 0.25mm, and not more than 0.4mm.
  • the method for manufacturing an ultra-thin heat pipe plate with a printed capillary structure is to process and press two sheet-like structures separately, flatten it with a conventional micro heat pipe or insert it into a heat pipe plate Woven nets and fibers are different concepts.
  • This method is conducive to the designer of the electronic device system when designing the internal component arrangement of the electronic device, to maintain greater use of heat dissipation management space and design flexibility and better heat dissipation performance.
  • the use of slurry to form a capillary structure is conducive to efficiency in mass production.
  • the ultra-thin heat pipe plate made by this method has a larger internal cavity to facilitate the flow of steam compared to the conventional technology, but it does not need to increase the thickness of the body of the overall electronic device, so as to obtain a more super Thinner electronic devices with better heat dissipation.
  • FIG. 1A A top view of a first trench of a first sheet structure in an embodiment of the invention.
  • FIG. 1B is a top view of the ultra-thin heat pipe plate made of the first sheet structure according to the embodiment of FIG. 1A.
  • FIG. 1C A cross-sectional view of the ultra-thin heat pipe plate of FIG. 1B along A-A.
  • FIG. 2A A schematic structural view showing a first sheet-like structure with a printing paste forming capillary structure in an embodiment of the invention.
  • FIG. 2B A schematic structural view of the ultra-thin heat pipe plate of the specific embodiment of FIG. 2A.
  • FIG. 2C A schematic structural view showing the ultra-thin heat pipe plate of the embodiment of FIG. 2B from another perspective.
  • FIG. 3A A schematic diagram illustrating the structure of a first sheet structure and a second sheet structure in another embodiment of the present invention.
  • FIG. 3B is a schematic structural diagram of the ultra-thin heat pipe plate of the specific embodiment of FIG. 3A.
  • FIG. 3C is a schematic view showing the ultra-thin heat pipe plate of the embodiment of FIG. 3B from another perspective.
  • FIG. 4A and FIG. 4B are respectively top views of the first groove and the printing paste forming capillary structure of the first sheet structure in different embodiments of the present invention.
  • FIG. 5 is a top view of the first groove and the printing paste forming capillary structure of the first sheet-like structure in yet another embodiment of the present invention.
  • FIG. 6A A top view showing the first groove and printing paste forming capillary structure of the first sheet-like structure in still another embodiment of the present invention.
  • FIG. 6B A cross-sectional view of the first sheet structure along B-B in the embodiment of FIG. 6A.
  • FIG. 6C A schematic structural view of the ultra-thin heat pipe plate in the specific embodiment of FIG. 6B.
  • FIG. 7A to 7C schematic diagrams illustrating steps of forming a first sheet-like structure having a first capillary structure in the embodiment of FIG. 6B.
  • FIG. 8A to FIG. 8C schematic diagrams of steps for forming a first sheet-like structure with a first capillary structure in the specific embodiment of FIG. 3A.
  • Figure 9A A mobile phone is shown.
  • FIG. 9B A cross-sectional view taken along C-C of a specific embodiment of the present invention applied to the mobile phone of FIG. 9A.
  • 9C A cross-sectional view taken along C-C of another embodiment of the present invention applied to the mobile phone of FIG. 9A.
  • 10A and 10B schematic diagrams of the slurry 6 and the capillary structure 4 of the present invention.
  • 11A to 11C Schematic diagrams of ultra-thin heat pipe plates in different embodiments, respectively.
  • FIG. 1A illustrates a top view of the first sheet structure 1 and the first trench 10 in an embodiment of the invention.
  • FIG. 1B illustrates a top view of the ultra-thin heat pipe plate 5 made of the first sheet structure 1 according to the embodiment of FIG. 1A.
  • FIG. 1C illustrates a cross-sectional view of the ultra-thin heat pipe plate 5 of the specific embodiment of FIG. 1B along A-A.
  • FIGS. 8A to 8C are schematic diagrams illustrating steps of forming the first sheet-like structure 1 with the first capillary structure 4 in the embodiment of FIG. 3A.
  • the present invention is a method for manufacturing an ultra-thin heat pipe plate 5 with a printing paste to form a capillary structure 4, which includes the following steps: providing a first sheet structure 1 and a second sheet structure 2; forming a first groove Groove 10 on the first sheet-like structure 1; printing a paste 6 on an inner surface of the first groove 10; heating the first sheet-like structure 1 to make the paste 6 form a capillary structure 4 on the inner surface; pressing and merging Sealing the first sheet structure 1 and the second sheet structure 2 to form an internal cavity 51 between the capillary structure 4 of the first trench 10 and the second sheet structure 2; and processing the first sheet structure 1 and The second sheet-like structure 2 is bonded to the device to form an ultra-thin heat pipe plate 5 with heat conduction function.
  • the step of forming a first trench 10 on the first sheet-like structure 1 may be to chemically etch the first sheet-like structure 1 to form a trench, or when manufacturing the first sheet-like structure 1 That is, a mold is used to form a grooved structure.
  • the method of printing a paste 6 on an inner surface of the first trench 10 may be laid on the first sheet-like structure 1 by using a steel plate 7 with holes, and the holes of the steel plate 7 correspond to the top of the first groove 10 , As shown in Figure 8A.
  • the slurry 6 is pushed from one end to the other end of the first sheet-like structure 1, the slurry 6 falls into the first groove 10, as shown in FIG. 8B.
  • the first sheet-like structure 1 carrying the slurry 6 is heated to vaporize the liquid phase material in the slurry 6, and the mixed powder in the slurry 6 collapses due to heat and adheres to the inner surface to form a capillary structure 4, as shown in FIG. 8C As shown.
  • the second sheet structure 2 is pressed onto the first sheet structure 1, and the joint edge of the first sheet structure 1 and the second sheet structure 2 is sealed, and the capillary structure 4 of the first groove 10 is An internal cavity 51 is formed between the second sheet-like structures 2 as shown in FIG. 1C.
  • further processing is performed to make the adhesive device of the first sheet structure 1 and the second sheet structure 2 form an ultra-thin heat pipe plate 5.
  • One method of the conventional technology is to process and flatten the elongated micro heat pipe of the round tube to be placed in the electronic device.
  • the thickness and width of the flat heat conducting element produced by this process are limited.
  • the design flexibility of this method is extremely low, and the cross-sectional area of the inner cavity is small, and the thermal conductivity is low.
  • the invention uses printing paste to heat to form a capillary structure, and then superpose two structural sheets to form a heat pipe plate.
  • the appearance of the heat pipe sheet can be changed according to the design of the structural sheet, and the cross-sectional area of the inner cavity can also be designed to Maximization greatly improves the heat dissipation efficiency of the entire electronic device.
  • Another method of the conventional technology is to lay the fiber or braided copper mesh in the groove of the heat pipe plate.
  • the fiber or braided copper mesh is not easy to control the thickness and yield. It is also easy to cause gas
  • the interpenetration between the liquid and the cavity affects the heat transfer efficiency of the heat pipe plate.
  • the capillary structure of the present invention is formed by heating the printed paste, which is convenient for operation and mass production, and the paste naturally collapses and forms after heating.
  • the capillary structure does not cover the inner cavity, so that the gas and gas in the same groove cavity
  • the liquid has clear flow channels separated from top to bottom without affecting the heat conduction effect of the heat pipe plate.
  • thermal conductive elements By thus breaking through the existing concept of manufacturing thermal conductive elements, it is possible to form higher-efficiency or thinner thermal conductive elements within the limits of existing industrial technology. Moreover, the ultra-thin heat pipe plates can be quickly mass-produced, driving the miniaturization of portable electronic devices.
  • FIG. 2A is a schematic structural diagram of a first sheet-like structure 1 with a printing paste forming capillary structure 4 in an embodiment of the invention.
  • FIG. 2B is a schematic structural diagram of the ultra-thin heat pipe plate 5 of the embodiment of FIG. 2A.
  • FIG. 2C is a schematic structural view of the ultra-thin heat pipe plate 5 of the embodiment of FIG. 2B from another perspective.
  • FIG. 3A is a schematic structural diagram of a first sheet structure 1 and a second sheet structure 2 in another embodiment of the invention.
  • FIG. 3B is a schematic structural diagram of the ultra-thin heat pipe plate 5 of the embodiment of FIG. 3A.
  • FIG. 3C is a schematic structural view of the ultra-thin heat pipe plate 5 of the embodiment of FIG. 3B from another perspective.
  • the first sheet structure 1 and the second sheet structure 2 are pressed and sealed to form an internal cavity between the capillary structure 4 of the first groove 10 and the second sheet structure 2
  • a step is further included: forming a second trench 20 on the second sheet-like structure 2, and the position of the second trench 20 corresponds to the position of the first trench 10, as shown in FIG. 3A .
  • the internal cavity 51 formed by the first trench 10 and the second trench 20 is larger, as shown in FIGS. 3B and 3C.
  • the ultra-thin heat pipe plate 5 produced by the embodiments of FIGS. 3A to 3C has a larger space for gas flow and more excellent heat conduction efficiency.
  • the step of processing the first lamellar structure 1 and the second lamellar structure 2 to form an ultra-thin heat pipe plate 5 with a heat conduction function further includes the following sub-steps: making a conduit communicating with the internal cavity 51. Specifically, when pressing the first sheet structure 1 and the second sheet structure 2, a catheter is placed between the first sheet structure 1 and the second sheet structure 2, and the catheter is pressed One end communicates with the internal cavity 51, and the other end communicates with the first sheet-like structure 1 and the second sheet-like structure 2; the first sheet-like structure 1 and the second sheet-like structure 2 may also be pressed together The structure 1 or the second sheet structure 2 is drilled and inserted into the catheter to communicate with the internal cavity.
  • the air in the internal cavity 51 is drawn out through the duct to make the internal cavity 51 into a negative pressure state.
  • the working fluid is injected or sucked into the internal cavity by using the conduit communicating with the internal cavity 51.
  • the duct is sealed so that the adhesion device of the first sheet-like structure 1 and the second sheet-like structure 2 forms an ultra-thin heat pipe plate 5 with heat conduction function.
  • FIG. 10A and FIG. 10B respectively illustrate schematic diagrams of the slurry 6 and the capillary structure 4 of the present invention.
  • the slurry 6 described in the present invention further includes a first powder 61, a second powder 62, and a solvent 63, as shown in FIG. 10A.
  • the first powder 61 is a solder alloy.
  • the second powder 62 is a powder having surface solderability, and may be metal such as copper or copper alloy.
  • the melting point of the second powder 62 is higher than the melting point of solder.
  • the first sheet-like structure 1 carrying the slurry 6 is heated, the volume of the slurry 6 decreases after the solvent 63 volatilizes.
  • the first powder 61 is melted, and a plurality of second powders 62 are welded to each other, and the second powder 62 is fixed to the inner surface of the first trench 10 to form the capillary structure 4, as shown in FIG. 10B.
  • the step of heating the first sheet-like structure 1 of the present invention to form the capillary structure 4 on the inner surface of the slurry 6 further includes the following sub-steps: heating the first sheet-like structure 1 at a temperature lower than the melting point of the first powder 61 .
  • the low-temperature heating in this step first evaporates the solvent 63.
  • the first sheet-like structure 1 is heated at a temperature higher than the melting point of the first powder 61 and lower than the melting point of the second powder 62.
  • the high-temperature heating in this step melts the first powder 61 to make it welded to Second powder 62 and the first trench 10.
  • the slurry 6 forms a capillary structure 4 on the inner surface.
  • the pores of the capillary structure 4 make it have capillary force.
  • the paste 6 When printing the paste 6 on the first sheet structure 1, in principle, the paste 6 will cover the first trench 10.
  • the thickness of the capillary structure 4 described in the present invention depends on the composition, mixing ratio, and solid content of the slurry 6 of the first powder 61, the second powder 62, and the solvent 63. When the solid content is high, the thickness of the capillary structure 4 formed after heating is large; when the solid content is low, the thickness of the capillary structure 4 formed after heating is small. In this way, the formulation and printing thickness of the paste 6 can be adjusted to control the thickness of the capillary structure 4 after heating, thereby controlling the size of the internal cavity 51 and maintaining the flexibility of the ultra-thin heat pipe plate 5 in design.
  • FIG. 4A illustrates a top view of the first trench 10 of the first sheet structure 1 in an embodiment of the invention.
  • the step of forming the first trench 10 on the first sheet structure 1 in this method is further as follows: forming a plurality of first trenches 10 on the first sheet structure 1, wherein Each first trench 10 has a first end 101 and a second end 102, the first end 101 of the first trench 10 communicates with at least the first end 101 of the other first trench 10, and the first trench The second end 102 of the groove 10 does not communicate with the second end 102 of another first trench 10, and the capillary structure is formed between the first trench and the other first trench.
  • the above-mentioned first end 101 can be used as a heat-absorbing end contacting the heat source.
  • the working fluid in the capillary structure is heated to evaporate into a gas.
  • the gas follows the internal cavity 51 formed by the first groove 10 to the second end 102 mobile.
  • the second end 102 is a vapor condensation end and a heat dissipation end, and condenses and dissipates the latent heat generated by the phase change of the heat absorption end. Therefore, in practical applications, the dispersion range of the first end 101 may be relatively small to match the high-density heat generation (Hot Spot) area, the dispersion range of the second end 102 may be relatively large to direct the thermal energy to different locations.
  • Hot Spot high-density heat generation
  • first ends 101 of the first sheet-like structures 1 are connected to each other to balance the heat flow dissipation of the internal cavity 51 of the ultra-thin heat pipe plate 5 and to prevent the heat conduction work from being concentrated on the internal voids formed by the first trenches
  • the cavity 51 wastes heat conduction efficiency.
  • FIG. 4B shows a top view of the first trench 10 and the printing paste forming capillary structure 4 of the first sheet-like structure 1 in a different embodiment from FIG. 4A.
  • FIG. 5 illustrates a top view of the first groove 10 and the printing paste forming capillary structure 4 of the first sheet-like structure 1 in yet another embodiment of the present invention.
  • FIG. 6A illustrates a top view of the first groove 10 and the printing paste forming capillary structure 4 of the first sheet-like structure 1 in yet another embodiment of the present invention.
  • FIG. 6B illustrates a cross-sectional view of the first sheet-like structure 1 along the line B-B in the embodiment of FIG. 6A.
  • FIG. 6C is a schematic structural diagram of the ultra-thin heat pipe plate 5 in the specific embodiment of FIG. 6B.
  • the step of forming the first trench 10 on the first sheet-like structure 1 in the method further includes: forming a plurality of first trenches 10 on the first sheet-like structure 1, Each first trench 10 has a first end 101 and a second end 102 respectively, the first end 101 of the first trench 10 communicates with at least the first end 101 of the other first trench 10, and the first The second end 102 of the trench 10 communicates with at least the second end 102 of the other first trench 10.
  • FIG. 1 The structure and function of FIG.
  • FIGS. 7A to 7C are schematic diagrams illustrating steps of forming the first sheet-like structure 1 having the first capillary structure 4 in the embodiment of FIG. 6B.
  • the step may be to print the paste 6 to the first sheet-like structure 1, using the barrier of the steel plate 7, and only printing the paste 6 to In some of the first trenches, as shown in FIGS. 7A and 7B.
  • the step of heating the first sheet-like structure 1 so that the slurry 6 forms the capillary structure 4 on the inner surface it is further performed by heating the first sheet-like structure 1 so that the slurry 6 is placed in the first groove 10
  • the capillary structure 4 is formed between the one end 101 and the second end 102 and the connection between the second end 102 of the first trench 10 and the second end 102 of the other first trench 10 is attached to the inner surface, and the other A capillary structure 4 is not formed between the first end 101 and the second end 102 of a first trench 10, as shown in FIG. 4B, FIG. 5 or FIG. 6A.
  • the method further comprises: pressing and sealing The first lamellar structure 1 and the second lamellar structure 2 make the first lamellar structure 1 and the second lamellar structure 2 form a cavity structure as a whole, and the first trench 10 and the second lamellar structure 2 form an interior
  • the cavity structure includes a gas-water flow channel 511 with the capillary structure 4 and the internal cavity 51 and an auxiliary air channel 510 without the capillary structure 4, as shown in FIG. 6C.
  • the auxiliary air passage 510 lacks a capillary structure, and serves only as a vapor flowing air passage.
  • the condensed working fluid in the capillary structure of the second end 102 will tend to flow from the gas water channel 511 to the first end 101.
  • the hot vapor at the first end 101 can reach the second end 102 via the auxiliary air passage 510 and the gas-water flow passage 511 at the same time.
  • the auxiliary air channel 510 With the formation of the auxiliary air channel 510, the latent heat generated by the phase change in the heat absorption area can be transmitted and circulated more. This is necessary to maintain the internal cavity height when the thickness of the cavity of the ultra-thin heat pipe plate is limited.
  • the large heat dissipation and heat dissipation capabilities have good operability.
  • the size of the cross-sectional area of the auxiliary air passage 510 is not limited to be greater than, equal to, or smaller than the air-water flow passage 511.
  • FIG. 11A to FIG. 11C are schematic diagrams of ultra-thin heat pipe plates in different embodiments, respectively.
  • the total thickness of the ultra-thin heat pipe plate 5 is not less than 0.25 mm, and may not be greater than 0.4 mm. The following describes the corresponding height design for various thickness requirements.
  • the maximum thickness a of the first sheet structure is 0.25mm; the maximum thickness b of the second sheet structure is 0.15mm; the minimum thickness c of the first sheet structure (thickness at the first groove) is 0.1mm; the second sheet structure The minimum thickness d of the structure (thickness at the second groove) is 0.1 mm; the height e between the first groove and the second groove is 0.2 mm.
  • the thickness of the capillary structure 4 is 0.1 mm, leaving a space height of 0.1 mm for airflow to pass through.
  • FIG. 11A or FIG. 11B When the total thickness of the ultra-thin heat pipe plate 5 is 0.35 mm, the design of FIG. 11A or FIG. 11B may be used.
  • the maximum thickness a of the first sheet structure is 0.2 mm; the maximum thickness b of the second sheet structure is 0.15 mm; the minimum thickness c of the first sheet structure (thickness at the first groove) is 0.1 mm; The minimum thickness d (thickness at the second groove) of the second sheet structure is 0.1 mm; the height e between the first groove and the second groove is 0.15 mm.
  • the thickness of the capillary structure 4 is 0.075 mm, and the remaining space height of 0.075 mm is available for airflow.
  • the maximum thickness a of the first sheet structure is 0.25mm; the maximum thickness b of the second sheet structure is 0.1mm; the minimum thickness c of the first sheet structure (thickness at the first groove) is 0.1mm ; The minimum thickness d of the second sheet structure (without the second groove) is 0.1mm; the height e between the first groove and the second sheet structure is 0.15mm.
  • the thickness of the capillary structure 4 is 0.075 mm, and the remaining space height of 0.075 mm is available for airflow.
  • the maximum thickness a of the first sheet structure is 0.2mm; the maximum thickness b of the second sheet structure is 0.1mm; the minimum thickness c of the first sheet structure (thickness at the first groove) is 0.1mm; the second sheet structure The minimum thickness d of the structure (without the second groove) is 0.1 mm; the height e between the first groove and the second sheet structure is 0.1 mm.
  • the thickness of the capillary structure 4 at the air-water flow channel 511 is 0.05 mm, leaving a space height of 0.05 mm for airflow to pass through. There is no capillary structure at the auxiliary air passage 510, leaving 0.1 space height for air flow to pass through.
  • the thickness or height of the above-mentioned individual components can be achieved with existing industrial skills.
  • the present invention to break through the existing concept of making a capillary structure by a thermally conductive element, the thickness of the formed capillary structure and the height of the cavity inside the airway can be controlled by paste printing and controlling the solid content. At the time of production, it achieves high thermal conductivity characteristics.
  • the ultra-thin heat pipe plate made by the present invention can be mass-produced and used in electronic products such as smart phones.
  • FIG. 9A shows a mobile phone.
  • 9B illustrates a cross-sectional view taken along C-C of an embodiment of the present invention applied to the mobile phone of FIG. 9A.
  • 9C illustrates a cross-sectional view along C-C of another embodiment of the present invention applied to the mobile phone of FIG. 9A.
  • the components in the mobile phone 9 include at least a back cover 90, a screen 91, a circuit board 93, a central processing unit 931, a middle frame 94, a bezel 96, and a battery 98.
  • the heat source central processing unit
  • the central processing unit 931 faces the back cover 90, as shown in FIG. 9B, the ultra-thin heat pipe plate 5 made by the present invention can be placed between the back cover 90 and the central processing unit 931, and the thermal energy can be approached from the central processing unit. The area of 931 is quickly guided to the back cover 90 or other places of the bezel 96. Furthermore, an ultra-thin heat insulation sheet 7 may be added between the ultra-thin heat pipe plate 5 and the back cover 90 to avoid heat energy being concentrated on the area of the surface of the back cover 90 close to the central processor 931, which may cause burns. If the central processing unit 931 faces the screen 91, as shown in FIG. 9C, the ultra-thin heat pipe plate 5 made by the present invention can be placed on the middle frame 94 or between the middle frame 94 and the central processing unit 931 to transfer heat energy The area 96 near the central processor 931 is quickly guided to the frame 96.
  • the method of the present invention for making an ultra-thin heat pipe plate with a printing paste forming capillary structure is to process and press two sheet-like structures separately, and lay a woven copper mesh and fibers to form a capillary structure in the conventional art Process is a different concept.
  • This method is conducive to the designer of the electronic device system when designing the internal component arrangement of the electronic device, to maintain greater use of heat dissipation management space and design flexibility and better heat dissipation performance.
  • the use of printing paste to form a capillary structure is conducive to mass production efficiency and reduces production costs.
  • the ultra-thin heat pipe plate made by this method has a larger internal cavity to facilitate the flow of steam compared to the conventional technology, but it does not need to increase the thickness of the body of the overall electronic device, so as to obtain a more super Thinner electronic devices with better heat dissipation.

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Abstract

一种制作具有印刷毛细结构的超薄热管板的方法，包含有以下步骤：提供一第一片状结构以及一第二片状结构；形成一第一沟槽于第一片状结构上；印刷一浆料于第一沟槽的一内表面；加热第一片状结构以使该浆料于内表面形成一毛细结构；压合并密封第一片状结构与第二片状结构，使第一沟槽毛细结构与第二片状结构之间形成一内部空腔；以及加工第一片状结构与第二片状结构的密合器件以形成具导热功能的一超薄热管板。由此，本发明公开的方法制成的毛细结构方便操作且有利量产，可应用于智慧型手机等微型化电子产品中的导热元件制作。

Description

制作具有印刷毛细结构的超薄热管板的方法 技术领域
本发明提供一种制作具有印刷毛细结构的超薄热管板的方法，特别是一种利用印刷浆料方式并加热该浆料以形成一种具多孔性毛细结构的方式制作超薄热管板的方法。
背景技术
电子及手持通讯装置产品的发展趋势不断地朝向薄型化与高功能化，人们对装置内微处理器(Microprocessor)运算速度及功能的要求也越来越高。微处理器是电子及通讯产品的核心元件，在高速运算下容易产生热而成为电子装置的主要发热元件，如果没能即时将热散去，将产生局部性的处理热点(Hot Spot)。倘若没有良好热管理方案及散热系统，往往造成微处理器过热而无法发挥出应有的功能，甚至影响到整个电子装置系统的寿命及可靠度。因此，电子产品需要优良的散热能力，尤其像智能手机(Smartphone)及平板电脑(Tablet PC)这种超薄的电子装置更需要有优良的散热能力。目前电子及通讯产品处理热点(Hot Spot)的解热及散热的有效方式是将扁平微热导管(Micro Heat Pipe)或均温板(Vapor Chamber)的一面接触发热源而另一面接触该电子装置的机殻，希望能以较有效的方式将微处理器所产生的高热传导并分布至机壳藉此将热辐射至空气中。
微热导管或均温板基本上是一内含工作流体的封闭腔体，藉由腔体内工作流体持续循环的液气二相变化，及汽体及液体于吸热端及冷凝端间气往液返的对流，而达到快速导热或散热的目的。一般而言，微热导管呈长条圆柱状，内腔空间越大，对流的速度越快，导热与散热较佳。然而，为了符合电子产品薄型化的需求，目前的技艺须将热导管再加工成扁长形，以设置在高度狭窄的机壳内空间，甚至需要用到厚度小于0.5mm的超薄形微热导管。
目前，市场上已经出现机体厚度不到5mm的智慧手机。通常手机背盖厚度仅有不到1.0mm的厚度，其电路板上微处理器表面距离手机背盖内表面仅剩下大约只有0.3mm～0.4mm的空间可塞入扁平微热导管。若以管径2mm的铜管打扁制作此超薄的微热导管，扣除上下两壁的厚度，此扁平微热导管空腔的高度也能仅有约0.2mm，扣除毛细结构的厚度，气道的内部空间往往变得非常狭窄。如此小的蒸气对流气道导致微热导管的解热及散热效果受到很大的限制，更无法应付日益增长微处理器功能所带来散热功能的增长。
此外，目前已有一种热管板的制造方式，是将纤维(fiber)或编织铜网(mesh)铺置在由两片具有沟槽的铜片压合而成的热管板中，以作为引流工作流体的毛细结构。然而，纤维或编织铜网的孔隙率较低毛细力差，进而造成解热及导热效率不甚理想，加上在一平板上仅有100um～200um深的沟槽结构中铺置及成形纤维或编织铜网的毛细结构往往需用人工在治具的协助下制作，自动化生产难度高良率低。面对智能手机应用市场的供应链特性，电子零组件供应商住往需要在很短的期间内大量生产并供货。因此以纤维或编织铜网铺置来制作毛细结构的方式已成为量产超薄热管板的瓶颈制程。
发明内容
有鉴于此，本发明的目的在于,提供一种制作具有印刷毛细结构的超薄热管板的方法，不同于习知以铺置纤维或编织铜网方式，印刷一浆料于片状结构的沟槽中，再加热该浆料以形成多孔性的毛细结构后再制作成超薄的热管板。如此一来形成的毛细结构的毛细力更佳，且气道的内部空腔的更具有设计弹性的空间，也较容易制作成更薄的热管板。由于是以印刷的方式制作，因此大大的提升产品量产自动化及降低生产成本的程度。
为实现上述目的，本发明公开了一种制作具有印刷毛细结构的超薄热管板的方法，其特征在于包含以下步骤：
提供一第一片状结构以及一第二片状结构；
形成一第一沟槽于该第一片状结构上；
印刷一浆料于该第一沟槽的一内表面；
加热该第一片状结构以使该浆料于该内表面形成一毛细结构；
压合并密封该第一片状结构与该第二片状结构，使该第一沟槽的该毛细结构与该第二片状结构之间形成一内部空腔；以及
加工该第一片状结构与该第二片状结构以形成具导热功能的一超薄热管板。
其中：该浆料进一步包含有一第一粉末、一第二粉末以及一溶剂，该第一粉末为焊锡合金，以及该第二粉末为具表面可焊性的粉末。
其中：于加热该第一片状结构以使该浆料于该内表面形成该毛细结构的步骤中，进一步包含有以下子步骤：
以低于该第一粉末熔点的温度加热该第一片状结构；以及
以高于该第一粉末熔点的温度且小于该第二粉末熔点的温度加热该第一片状结构，以使该浆料于该内表面形成具亲水性的该毛细结构。
其中：该毛细结构的厚度取决于该第一粉末、该第二粉末以及该溶剂的成分、混合比例以及该浆料的固含量。
其中：于压合并密封该第一片状结构与该第二片状结构以使该第一沟槽的该毛细结构与该第二片状结构之间形成该内部空腔的步骤之前，进一步包含有以下步骤：
形成一第二沟槽于该第二片状结构上，且该第二沟槽的位置相对应于该第一沟槽的位置。
其中：于加工该第一片状结构与该第二片状结构以形成具导热功能的该超薄热管板的步骤中，进一步包含有以下子步骤：
制作一导管连通该内部空腔；
利用该导管抽出该内部空腔的空气以使该内部空腔形成负压状态；
利用连通该内部空腔的该导管注入工作流体至该内部空腔；以及
密封该导管以使该第一片状结构与该第二片状结构形成具导热功能的该超薄热管板。
其中：形成该第一沟槽于该第一片状结构上的步骤，进一步为：
形成数个该第一沟槽于该第一片状结构上，其中每一第一沟槽分别具有一第一端与一第二端，该第一沟槽的该第一端至少连通另一第一沟槽的该第一端，而该第一沟槽的该第二端不与另一第一沟槽的该第二端连通，且该毛细结构形成于该第一沟槽与另一第一沟槽。
其中：形成该第一沟槽于该第一片状结构上的步骤，进一步为：
形成数个该第一沟槽于该第一片状结构上，其中每一第一沟槽分别具有一第一端与一第二端，该第一沟槽的该第一端至少连通另一第一沟槽的该第一端，而该第一沟槽的该第二端至少连通另一第一沟槽的该第二端。
其中：于加热该第一片状结构以使该浆料于该内表面形成该毛细结构的步骤中，进一步为：
加热该第一片状结构以使该浆料于该第一沟槽的该第一端与该第二端之间及该第一沟槽的该第二端与另一第一沟槽的该第二端的连通处皆形成该毛细结构并附着于该内表面，而另一第一沟槽的该第一端与该第二端之间不形成该毛细结构；以及
其中于压合并密封该第一片状结构与该第二片状结构，使该第一沟槽的该毛细结构与该第二片状结构之间形成该内部空腔的步骤中，进一步系为：
压合并密封该第一片状结构与该第二片状结构，使该第一片状结构与该第二片状结构整体形成一空腔结构，该第一沟槽的该毛细结构与该第二片状结构之间形成该内部空腔，该空腔结构包含有具该毛细结构与该内部空腔的一气水流道与不具该毛细结构的一辅助气道。
其中：该超薄热管板的总厚度不小于0.25mm，且不大于0.4mm。
综上所述，本发明的制作具有印刷毛细结构的超薄热管板的方法系将两个片状结构分别加工后压合，与习知的微热导管压扁或是于热管板中塞入编织网和纤维是不同的概念。此方法有利于电子装置系统设计者于设计电子装置内部零件配置时，保有更大的散热管理空间运用及设计弹性以及更佳的散热效能。此外，利用浆料形成毛细结构有利于大量生产时的效率。并且，藉此方法做出来的超薄热管板，相较于习知技术具有更大的内部空腔以利蒸气流通，却又无需增加整体电子装置机身的厚度，而获得符合制造出更超薄化且散热功效更佳的电子装置产品。
附图说明
图1A：绘示本发明一具体实施例中第一片状结构的第一沟槽的俯视图。
图1B：绘示依据图1A的具体实施例的第一片状结构制成的超薄热管板的俯视图。
图1C：绘示图1B的具体实施例的超薄热管板沿A-A的剖面图。
图2A：绘示本发明一具体实施例中具印刷浆料成形毛细结构的第一片状结构的结构示意图。
图2B：绘示图2A的具体实施例的超薄热管板的结构示意图。
图2C：绘示图2B的具体实施例的超薄热管板另一视角的结构示意图。
图3A：绘示本发明另一具体实施例中第一片状结构与第二片状结构的结构示意图。
图3B：绘示图3A的具体实施例的超薄热管板的结构示意图。
图3C：绘示图3B的具体实施例的超薄热管板另一视角的结构示意图。
图4A与图4B：分别绘示本发明不同具体实施例中第一片状结构的第一沟槽及印刷浆料成形毛细结构俯视图。
图5：绘示本发明又一具体实施例中第一片状结构的第一沟槽及印刷浆料成形毛细结构俯视图。
图6A：绘示本发明再一具体实施例中第一片状结构的第一沟槽及印刷浆料成形毛细结构的俯视图。
图6B：绘示图6A的具体实施例中的第一片状结构沿B-B的剖面图。
图6C：绘示图6B的具体实施例中的超薄热管板的结构示意图。
图7A至图7C：绘示形成图6B的具体实施例中具第一毛细结构的第一片状结构的步骤示意图。
图8A至图8C：绘示形成图3A的具体实施例中形成具第一毛细结构的第一片状结构的步骤示意图。
图9A：绘示一手机。
图9B：绘示本发明套用至图9A的手机中的一具体实施例沿C-C的剖面图。
图9C：绘示本发明套用至图9A的手机中的另一具体实施例沿C-C的剖面图。
图10A及图10B：分别绘示本发明的浆料6与毛细结构4的示意图。
图11A至图11C：分别绘示不同实施例中的超薄热管板的结构示意图。
具体实施方式
为了让本发明的优点，精神与特征可以更容易且明确地了解，后续将以实施例并参照所附图式进行详述与讨论。值得注意的是，这些实施例仅为本发明代表性的实施例，其中所举例的特定方法，装置，条件，材质等并非用以限定本发明或对应的实施例。
在本发明的描述中，需要理解的是，术语“纵向、横向、上、下、前、后、左、右、顶、底、内、外”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本发明和简化描述，而不是指示所述的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本发明的限制。
此外，本发明装置或元件前的不定冠词“一”、“一种”和“一个”对装置或元件的数量要求(即出现次数)无限制性。因此“一”应被解读为包括一或至少一，并且单数形式的装置或元件也包括复数形式，除非所述数量明显指单数形式。
请先参阅图1A至图1C以及图8A至图8C。图1A绘示本发明一具体实施例中第一片状结构1与第一沟槽10的俯视图。图1B绘示依据图1A的具体实施例的第一片状结构1制成的超薄热管板5的俯视图。图1C绘示图1B的具体实施例的超薄热管板5沿A-A的剖面图。图8A至图8C绘示形成图3A的具体实施例中形成具第一毛细结构4的第一片状结构1的步骤示意图。本发明系一种制作具有印刷浆料形成毛细结构4的超薄热管板5的方法，包含有以下步骤：提供一第一片状结构1以及一第二片状结构2；形成一第一沟槽10于第一片状结构1上；印刷一浆料6于第一沟槽10的一内表面；加热第一片状结构1以使浆料6于内表面形成一毛细结构4；压合并密封第一片状结构1与第二片状结构2，使第一沟槽10的毛细结构4与第二片状结构2之间形成一内部空腔51；以及加工第一片状结构1与第二片状结构2的密合器件以形成具导热功能的一超薄热管板5。
在本发明的方法中，形成一第一沟槽10于第一片状结构1的步骤可以是将第一片状结构1进行化学蚀刻以形成沟槽，或于制作第一片状结构1时即利用模具形成具沟槽的结构等方式。印刷一浆料6于第一沟槽10的一内表面的方式，可以是利用具有孔洞的钢板7铺设于第一片状结构1之上，钢板7的孔洞对应到第一沟槽10的上方，如图8A所示。当推动浆料6从第一片状结构1的一端至另外一端时，浆 料6落至第一沟槽10中，如图8B所示。之后，加热乘载浆料6的第一片状结构1，以使浆料6中的液相物质汽化，浆料6内混合粉末因受热塌陷并于内表面附着形成毛细结构4，如图8C所示。接着将第二片状结构2压合至第一片状结构1之上，并且使第一片状结构1与第二片状结构2的接合边缘密封，第一沟槽10的毛细结构4与第二片状结构2之间形成内部空腔51，如图1C所示。最后再进一步加工以使第一片状结构1与第二片状结构2的密合器件形成超薄热管板5。
习知技术的一种作法将圆管长条形的微热导管加工压扁以置入电子装置中，此制程制作的扁形导热元件的厚度与宽度有其限制。然而，此种做法的设计弹性极低，且内腔截面积小，导热能力低。本发明系利用印刷浆料加温形成毛细结构，再将两个结构片迭合后形成热管板，热管板的外型可随着结构片的设计而改变，并且内腔截面积也可以设计到极大化化，大幅度的提升了整个电子装置的散热效率。
此外，习知技术的另一种作法将纤维或编织铜网铺置在热管板的沟槽中，不但制作过程不易实现自动化，且纤维或编织铜网不易控制厚度及良率.也容易造成气体与液体在腔体内穿插往来而影响了热管板的导热效率。本发明的毛细结构系由印刷的浆料加热后形成，方便操作与量产，并且在加热后浆料自然塌陷并成形，毛细结构并未布满内腔，使得在同一沟槽腔体内气体与液体有明确各自上下分离的流道而不影响热管板的导热效果。藉由此突破既有的热导元件制作概念，可以在现有的工业技术限制下，形成更高效率或更薄的热导元件。并且，能快速地大量生产超薄型热管板，带动可携式电子装置微型化的发展。
请参阅图2A至图2C以及图3A至图3C。图2A绘示本发明一具体实施例中具印刷浆料成形毛细结构4的第一片状结构1的结构示意图。图2B绘示图2A的具体实施例的超薄热管板5的结构示意图。图2C绘示图2B的具体实施例的超薄热管板5另一视角的结构示意图。图3A绘示本发明另一具体实施例中第一片状结构1与第二片状结构2的结构示意图。图3B绘示图3A的具体实施例的超薄热管板5的结构示意图。图3C绘示图3B的具体实施例的超薄热管板5另一视角的结构示意图。
本发明的一具体实施例中，于压合并密封第一片状结构1与第二片状结构2以使第一沟槽10的毛细结构4与第二片状结构2之间形成内部空腔51的步骤之前，进一步包含有一步骤：形成一第二沟槽20于第二片状结构2上，且第二沟槽20的位置相对应于第一沟槽10的位置，如图3A所示。当第一片状结构1与第二片状结构2压合之后，因第一沟槽10与第二沟槽20而形成的内部空腔51更大，如图3B与图3C所示。换句话说，相较于图2A至图2C的实施例中，图3A至图3C的实施例制作的超薄热管板5中允许气体流动的空间更大，导热的效率更优异。
本方法的加工第一片状结构1与第二片状结构2的密合器件以形成具导热功 能的超薄热管板5的步骤中，进一步包含有以下子步骤：制作一导管连通内部空腔51，具体而言可以是于压合第一片状结构1与第二片状结构2时，于第一片状结构1与第二片状结构2之间放置一导管，且压合后导管一端连通内部空腔51，另一端连通第一片状结构1与第二片状结构2之外；也可以是压合第一片状结构1与第二片状结构2后，于第一片状结构1或第二片状结构2上钻洞并插入导管连通内部空腔。接着利用导管抽出内部空腔51的空气以使内部空腔51形成负压状态。然后利用连通内部空腔51的导管注入或吸入工作流体至内部空腔。最后密封导管以使第一片状结构1与第二片状结构2的密合器件形成具导热功能的超薄热管板5。
请参阅图8A至图8C、图10A及图10B。图10A及图10B分别绘示本发明的浆料6与毛细结构4的示意图。本发明中所述的浆料6进一步包含有一第一粉末61、一第二粉末62以及一溶剂63，如图10A所示。第一粉末61为焊锡合金。第二粉末62为具表面可焊性的粉末，可以是铜或是铜合金等金属。此外，第二粉末62的熔点高于焊锡的熔点。当承载浆料6的第一片状结构1被加热时，溶剂63挥发后使浆料6体积减少。此外，第一粉末61被熔化，进而将多个第二粉末62彼此焊接，固定第二粉末62于第一沟槽10的内表面而形成毛细结构4，如图10B所示。
本发明的加热第一片状结构1以使浆料6于内表面形成毛细结构4的步骤中，进一步包含有以下子步骤：以低于第一粉末61熔点的温度加热第一片状结构1。此步骤的低温加热系先将溶剂63蒸发掉。待驱赶完溶剂63，接着以高于第一粉末61熔点的温度且小于第二粉末62熔点的温度加热第一片状结构1，此步骤的高温加热要熔化第一粉末61，使其焊接于第二粉末62与第一沟槽10。最后，浆料6于内表面形成毛细结构4。毛细结构4的孔隙使其具有毛细力。
印刷浆料6于第一片状结构1时，原则上浆料6将会铺满第一沟槽10。本发明中所述的毛细结构4的厚度取决于第一粉末61、第二粉末62以及溶剂63的成分、混合比例以及浆料6的固含量。当固含量高时，加热后形成的毛细结构4的厚度大；当固含量低时，加热后形成的毛细结构4的厚度小。藉此，可以调整浆料6配方及印刷厚度以控制加热后的毛细结构4的厚度，进而掌控内部空腔51的大小，保持超薄热管板5设计时的弹性。
请参阅图2B与图4A。图4A绘示本发明一具体实施例中第一片状结构1的第一沟槽10的俯视图。于本具体实施例中，本方法的形成第一沟槽10于该第一片状结构1上的步骤，进一步系为：形成数个第一沟槽10于第一片状结构1上，其中每一第一沟槽10分别具有一第一端101与一第二端102，第一沟槽10的第一端101至少连通另一第一沟槽10的第一端101，而第一沟槽10的第二端102不与另一第一沟槽10的第二端102连通，且毛细结构形成于该第一沟槽与另一第一沟槽。上述的第一端101可做为接触发热源的吸热端，毛细结构内的工作流体于此端受热蒸发成 气体，气体沿着第一沟槽10形成的内部空腔51往第二端102移动。第二端102为蒸气的冷凝端及散热端，将吸热端因相变化产生的潜热冷凝并散去。因此于实际应用中，第一端101的分散范围可相对较小以吻合发热高密度的热
Figure PCTCN2019110038-appb-000001
(Hot Spot)区域，第二端102的分散范围可相对较大以将热能导向不同位置。并且，各第一片状结构1的第一端101彼此相连可以平衡超薄热管板5内部空腔51的热流散逸，避免热能传导的工作集中于某几根第一沟槽10形成的内部空腔51，浪费导热效率。
请参阅图4B、图5、图6A至图6C。图4B绘示与图4A不同具体实施例中第一片状结构1的第一沟槽10及印刷浆料成形毛细结构4的俯视图。图5绘示本发明又一具体实施例中第一片状结构1的第一沟槽10及印刷浆料成形毛细结构4俯视图。图6A绘示本发明再一具体实施例中第一片状结构1的第一沟槽10及印刷浆料成形毛细结构4的俯视图。图6B绘示图6A的具体实施例中的第一片状结构1沿B-B的剖面图。图6C绘示图6B的具体实施例中的超薄热管板5的结构示意图。于这些具体实施例中，本方法的形成该第一沟槽10于该第一片状结构1上的步骤，进一步系为：形成数个第一沟槽10于第一片状结构1上，其中每一第一沟槽10分别具有一第一端101与一第二端102，第一沟槽10的第一端101至少连通另一第一沟槽10的第一端101，而第一沟槽10的第二端102至少连通另一第一沟槽10的第二端102。图4B的构造外形与功能大致与上述实施例相同，最大差异为本构造中，每两个第一沟槽10的第二端102亦为相连。如此一来，液体与气体的于不同流道流动方向可以较明确。图5与图6A则是另一种型态的结构示意图。
请参阅图7A至图7C。图7A至图7C绘示形成图6B的具体实施例中具第一毛细结构4的第一片状结构1的步骤示意图。欲形成如图4B、图5或图6A的第一片状结构1，其步骤可于印刷浆料6于第一片状结构1的步骤中，利用钢板7的阻隔，仅印刷浆料6至部份第一沟槽中，如图7A及图7B所示。并且，于加热第一片状结构1以使浆料6于内表面形成毛细结构4的步骤中，进一步系为：加热第一片状结构1以使浆料6于第一沟槽10的第一端101与第二端102之间及第一沟槽10的第二端102与另一第一沟槽10的第二端102的连通处皆形成毛细结构4并附着于内表面，而另一第一沟槽10的第一端101与第二端102之间不形成毛细结构4，如图4B、图5或图6A。
请再参阅图4B、图5、图6A至图6C。此外，于压合并密封第一片状结构1与第二片状结构2使第一沟槽10与第二片状结构2之间形成内部空腔51的步骤中，进一步系为：压合并密封第一片状结构1与第二片状结构2，使第一片状结构1与第二片状结构2整体形成一空腔结构，第一沟槽10与第二片状结构2之间形成内部空腔51，空腔结构包含有具毛细结构4与内部空腔51的一气水流道511与不具毛细结构4的一辅助气道510，如图6C所示。辅助气道510缺少毛细结构，仅做为蒸气的流动气道。第二端102毛细结构中冷凝后的工作流体将趋向于自气水流道511流至第 一端101。另一方面，第一端101的热蒸气则可以同时经辅助气道510和气水流道511到达第二端102。藉由辅助气道510的形成，吸热区因相变化所产的潜热可传导及流通的空间更大，这对于要制作更超薄的热管板内部空腔高度被局限时又同时要维持较大的解热及散热能力具有很好的操作性。本发明中，辅助气道510的截面积大小并无限定于大于、等于或小于气水流道511。
请参阅图11A至图11C。图11A至图11C分别绘示不同实施例中的超薄热管板的结构示意图。本发明中超薄热管板5的总厚度不小于0.25mm，且可不大于0.4mm。以下针对各种厚度需求介绍相对应的高度设计。
当超薄热管板5的总厚度为0.4mm时，可利用图11A的设计。其中第一片状结构最大厚度a为0.25mm；第二片状结构最大厚度b为0.15mm；第一片状结构最小厚度c(第一沟槽处的厚度)为0.1mm；第二片状结构最小厚度d(第二沟槽处的厚度)为0.1mm；第一沟槽与第二沟槽间的高度e为0.2mm。毛细结构4的厚度为0.1mm，剩下0.1mm的空间高度可供气流通过。
当超薄热管板5的总厚度为0.35mm时，可利用图11A或图11B的设计。
例如图11A中，第一片状结构最大厚度a为0.2mm；第二片状结构最大厚度b为0.15mm；第一片状结构最小厚度c(第一沟槽处的厚度)为0.1mm；第二片状结构最小厚度d(第二沟槽处的厚度)为0.1mm；第一沟槽与第二沟槽间的高度e为0.15mm。毛细结构4的厚度为0.075mm，剩下0.075mm的空间高度可供气流通过。
或例如图11B中，第一片状结构最大厚度a为0.25mm；第二片状结构最大厚度b为0.1mm；第一片状结构最小厚度c(第一沟槽处的厚度)为0.1mm；第二片状结构最小厚度d(无第二沟槽)为0.1mm；第一沟槽与第二片状结构间的高度e为0.15mm。毛细结构4的厚度为0.075mm，剩下0.075mm的空间高度可供气流通过。
当超薄热管板5的总厚度为0.30mm时，可利用图11C的设计。其中第一片状结构最大厚度a为0.2mm；第二片状结构最大厚度b为0.1mm；第一片状结构最小厚度c(第一沟槽处的厚度)为0.1mm；第二片状结构最小厚度d(无第二沟槽)为0.1mm；第一沟槽与第二片状结构间的高度e为0.1mm。于气水流道511处的毛细结构4的厚度为0.05mm，剩下0.05mm的空间高度可供气流通过。于辅助气道510处无毛细结构，剩下0.1的空间高度可供气流通过。
上述个别元件的厚度或高度，系可以现有的工业技艺达成。然而藉由本发明突破既有的热导元件制作毛细结构的概念，用浆料印刷并控制固含量的方式来控制成形毛细结构的厚度以及气道内部空腔的高度才可以在超薄的热管板制作时达到维持高效率的热导特性。并且，使本发明制作成的超薄热管板可以大量生产运用在智慧手机等电子产品上。
请参阅图9A至图9C。图9A绘示一手机。图9B绘示本发明套用至图9A的手机中 的一具体实施例沿C-C的剖面图。图9C绘示本发明套用至图9A的手机中的另一具体实施例沿C-C的剖面图。手机9中的元件至少有背盖90、荧幕91、电路板93、中央处理器931、中框94、边框96和电池98。现在的手机制作技术中，手机发热源(中央处理器)粘着在电路板上的方式大致分为两种。一种是中央处理器朝向背盖方向，另一种是中央处理器朝向荧幕方向。若中央处理器931朝向背盖90方向，如图9B所示，则可以将本发明制成的超薄热管板5放于背盖90与中央处理器931之间，将热能从接近中央处理器931的区域快速导引到背盖90或边框96的其他地方。进一步地，还可增设一超薄隔热片7于超薄热管板5与背盖90之间，以避免热能集中于背盖90表面接近中央处理器931的区域，造成烫手。若中央处理器931朝向荧幕91方向，如图9C所示，则可以将本发明制成的超薄热管板5放于中框94上或中框94与中央处理器931之间，将热能从接近中央处理器931的区域快速导引到边框96。
综上所述，本发明制作作具有印刷浆料成形毛细结构的超薄热管板的方法系将两个片状结构分别加工后压合，与习知铺置编织铜网和纤维的成形毛细结构制程是不同的概念。此方法有利于电子装置系统设计者于设计电子装置内部零件配置时，保有更大的散热管理空间运用及设计弹性以及更佳的散热效能。此外，利用印刷浆料形成毛细结构有利于大量生产时的效率并降低生产成本。并且，藉此方法做出来的超薄热管板，相较于习知技术具有更大的内部空腔以利蒸气流通，却又无需增加整体电子装置机身的厚度，而获得符合制造出更超薄化且散热功效更佳的电子装置产品。
藉由以上较佳具体实施例的详述，希望能更加清楚描述本发明的特征与精神，而并非以上述所揭露的较佳具体实施例来对本发明的范畴加以限制。相反地，其目的是希望能涵盖各种改变及具相等性的安排于本发明所欲申请的专利范围的范畴内。因此，本发明所申请的专利范围的范畴应该根据上述的说明作最宽广的解释，以致使其涵盖所有可能的改变以及具相等性的安排。

Claims (10)

  1. 一种制作具有印刷毛细结构的超薄热管板的方法，其特征在于包含以下步骤：
    提供一第一片状结构以及一第二片状结构；
    形成一第一沟槽于该第一片状结构上；
    印刷一浆料于该第一沟槽的一内表面；
    加热该第一片状结构以使该浆料于该内表面形成一毛细结构；
    压合并密封该第一片状结构与该第二片状结构，使该第一沟槽的该毛细结构与该第二片状结构之间形成一内部空腔；以及
    加工该第一片状结构与该第二片状结构以形成具导热功能的一超薄热管板。
  2. 如权利要求1所述的方法，其特征在于：该浆料进一步包含有一第一粉末、一第二粉末以及一溶剂，该第一粉末为焊锡合金，以及该第二粉末为具表面可焊性的粉末。
  3. 如权利要求2所述的方法，其特征在于：于加热该第一片状结构以使该浆料于该内表面形成该毛细结构的步骤中，进一步包含有以下子步骤：
    以低于该第一粉末熔点的温度加热该第一片状结构；以及
    以高于该第一粉末熔点的温度且小于该第二粉末熔点的温度加热该第一片状结构，以使该浆料于该内表面形成具亲水性的该毛细结构。
  4. 如权利要求2所述的方法，其特征在于：该毛细结构的厚度取决于该第一粉末、该第二粉末以及该溶剂的成分、混合比例以及该浆料的固含量。
  5. 如权利要求1所述的方法，其特征在于：于压合并密封该第一片状结构与该第二片状结构以使该第一沟槽的该毛细结构与该第二片状结构之间形成该内部空腔的步骤之前，进一步包含有以下步骤：
    形成一第二沟槽于该第二片状结构上，且该第二沟槽的位置相对应于该第一沟槽的位置。
  6. 如权利要求1所述的方法，其特征在于：于加工该第一片状结构与该第二片状结构以形成具导热功能的该超薄热管板的步骤中，进一步包含有以下子步骤：
    制作一导管连通该内部空腔；
    利用该导管抽出该内部空腔的空气以使该内部空腔形成负压状态；
    利用连通该内部空腔的该导管注入工作流体至该内部空腔；以及
    密封该导管以使该第一片状结构与该第二片状结构形成具导热功能的该超薄热管板。
  7. 如权利要求1所述的方法，其特征在于：形成该第一沟槽于该第一片状结 构上的步骤，进一步为：
    形成数个该第一沟槽于该第一片状结构上，其中每一第一沟槽分别具有一第一端与一第二端，该第一沟槽的该第一端至少连通另一第一沟槽的该第一端，而该第一沟槽的该第二端不与另一第一沟槽的该第二端连通，且该毛细结构形成于该第一沟槽与另一第一沟槽。
  8. 如权利要求1所述的方法，其特征在于：形成该第一沟槽于该第一片状结构上的步骤，进一步为：
    形成数个该第一沟槽于该第一片状结构上，其中每一第一沟槽分别具有一第一端与一第二端，该第一沟槽的该第一端至少连通另一第一沟槽的该第一端，而该第一沟槽的该第二端至少连通另一第一沟槽的该第二端。
  9. 如权利要求8所述的方法，其特征在于：于加热该第一片状结构以使该浆料于该内表面形成该毛细结构的步骤中，进一步为：
    加热该第一片状结构以使该浆料于该第一沟槽的该第一端与该第二端之间及该第一沟槽的该第二端与另一第一沟槽的该第二端的连通处皆形成该毛细结构并附着于该内表面，而另一第一沟槽的该第一端与该第二端之间不形成该毛细结构；以及
    其中于压合并密封该第一片状结构与该第二片状结构，使该第一沟槽的该毛细结构与该第二片状结构之间形成该内部空腔的步骤中，进一步系为：
    压合并密封该第一片状结构与该第二片状结构，使该第一片状结构与该第二片状结构形成一空腔结构，该第一沟槽的该毛细结构与该第二片状结构之间形成该内部空腔，该空腔结构包含有具该毛细结构与该内部空腔的一气水流道与不具该毛细结构的一辅助气道。
  10. 如权利要求1所述的方法，其特征在于：该超薄热管板的总厚度不小于0.25mm，且不大于0.4mm。
PCT/CN2019/110038 2018-10-12 2019-10-09 制作具有印刷毛细结构的超薄热管板的方法 WO2020073905A1 (zh)

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