JP2006019429A5 - - Google Patents
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- Publication number
- JP2006019429A5 JP2006019429A5 JP2004194667A JP2004194667A JP2006019429A5 JP 2006019429 A5 JP2006019429 A5 JP 2006019429A5 JP 2004194667 A JP2004194667 A JP 2004194667A JP 2004194667 A JP2004194667 A JP 2004194667A JP 2006019429 A5 JP2006019429 A5 JP 2006019429A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- semiconductor
- base wafer
- protective film
- formation region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims 45
- 239000000758 substrate Substances 0.000 claims 13
- 230000015572 biosynthetic process Effects 0.000 claims 11
- 230000001681 protective effect Effects 0.000 claims 11
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 5
- 229910052710 silicon Inorganic materials 0.000 claims 5
- 239000010703 silicon Substances 0.000 claims 5
- 238000004519 manufacturing process Methods 0.000 claims 4
- 238000002360 preparation method Methods 0.000 claims 3
- 238000005530 etching Methods 0.000 claims 2
- 238000010030 laminating Methods 0.000 claims 2
- 230000000149 penetrating effect Effects 0.000 claims 2
- 238000000034 method Methods 0.000 claims 1
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004194667A JP4383274B2 (ja) | 2004-06-30 | 2004-06-30 | 半導体装置および半導体ウエハの製造方法 |
| US11/142,417 US7663244B2 (en) | 2004-06-30 | 2005-06-02 | Semiconductor device and semiconductor wafer and a method for manufacturing the same |
| CN200710199542.6A CN101188231B (zh) | 2004-06-30 | 2005-06-29 | 半导体器件和半导体晶片及其制造方法 |
| CNB2005100810989A CN100463172C (zh) | 2004-06-30 | 2005-06-29 | 半导体器件和半导体晶片及其制造方法 |
| US11/834,094 US7812457B2 (en) | 2004-06-30 | 2007-08-06 | Semiconductor device and semiconductor wafer and a method for manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004194667A JP4383274B2 (ja) | 2004-06-30 | 2004-06-30 | 半導体装置および半導体ウエハの製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2006019429A JP2006019429A (ja) | 2006-01-19 |
| JP2006019429A5 true JP2006019429A5 (enExample) | 2007-09-06 |
| JP4383274B2 JP4383274B2 (ja) | 2009-12-16 |
Family
ID=35600009
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004194667A Expired - Lifetime JP4383274B2 (ja) | 2004-06-30 | 2004-06-30 | 半導体装置および半導体ウエハの製造方法 |
Country Status (3)
| Country | Link |
|---|---|
| US (2) | US7663244B2 (enExample) |
| JP (1) | JP4383274B2 (enExample) |
| CN (2) | CN101188231B (enExample) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4383274B2 (ja) * | 2004-06-30 | 2009-12-16 | Ｎｅｃエレクトロニクス株式会社 | 半導体装置および半導体ウエハの製造方法 |
| KR100809696B1 (ko) * | 2006-08-08 | 2008-03-06 | 삼성전자주식회사 | 사이즈가 상이한 복수의 반도체 칩이 적층된 멀티 칩패키지 및 그 제조방법 |
| JP5489512B2 (ja) * | 2009-04-06 | 2014-05-14 | キヤノン株式会社 | 半導体装置の製造方法 |
| WO2010116694A2 (en) | 2009-04-06 | 2010-10-14 | Canon Kabushiki Kaisha | Method of manufacturing semiconductor device |
| JP5409084B2 (ja) | 2009-04-06 | 2014-02-05 | キヤノン株式会社 | 半導体装置の製造方法 |
| JP5353628B2 (ja) * | 2009-10-15 | 2013-11-27 | 住友ベークライト株式会社 | 半導体装置の製造方法 |
| JP2011108770A (ja) * | 2009-11-16 | 2011-06-02 | Sumitomo Bakelite Co Ltd | 半導体装置の製造方法、半導体装置、および電子部品の製造方法、電子部品 |
| JP5601079B2 (ja) * | 2010-08-09 | 2014-10-08 | 三菱電機株式会社 | 半導体装置、半導体回路基板および半導体回路基板の製造方法 |
| JP5717502B2 (ja) * | 2011-03-30 | 2015-05-13 | 信越ポリマー株式会社 | 半導体チップ用保持具及びその使用方法 |
| US8916421B2 (en) | 2011-08-31 | 2014-12-23 | Freescale Semiconductor, Inc. | Semiconductor device packaging having pre-encapsulation through via formation using lead frames with attached signal conduits |
| US9142502B2 (en) * | 2011-08-31 | 2015-09-22 | Zhiwei Gong | Semiconductor device packaging having pre-encapsulation through via formation using drop-in signal conduits |
| JP6157356B2 (ja) * | 2011-11-10 | 2017-07-05 | シチズン時計株式会社 | 光集積デバイス |
| US8597983B2 (en) | 2011-11-18 | 2013-12-03 | Freescale Semiconductor, Inc. | Semiconductor device packaging having substrate with pre-encapsulation through via formation |
| WO2015046334A1 (ja) | 2013-09-27 | 2015-04-02 | 株式会社ダイセル | 半導体素子三次元実装用充填材 |
| JP2020013911A (ja) * | 2018-07-19 | 2020-01-23 | 東京エレクトロン株式会社 | 基板処理システム及び基板処理方法 |
| KR102498148B1 (ko) * | 2018-09-20 | 2023-02-08 | 삼성전자주식회사 | 반도체 장치의 제조 방법 |
| CN114121845A (zh) * | 2020-09-01 | 2022-03-01 | Jmj韩国株式会社 | 半导体封装 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3770631B2 (ja) | 1994-10-24 | 2006-04-26 | 株式会社ルネサステクノロジ | 半導体装置の製造方法 |
| US5861666A (en) * | 1995-08-30 | 1999-01-19 | Tessera, Inc. | Stacked chip assembly |
| JP3920399B2 (ja) * | 1997-04-25 | 2007-05-30 | 株式会社東芝 | マルチチップ半導体装置用チップの位置合わせ方法、およびマルチチップ半導体装置の製造方法・製造装置 |
| JP3563604B2 (ja) * | 1998-07-29 | 2004-09-08 | 株式会社東芝 | マルチチップ半導体装置及びメモリカード |
| JP2000114206A (ja) | 1998-10-05 | 2000-04-21 | Sony Corp | 半導体パッケージの製造方法 |
| JP2000208702A (ja) | 1999-01-14 | 2000-07-28 | Hitachi Ltd | 半導体装置およびその製造方法 |
| US6307270B1 (en) * | 1999-08-05 | 2001-10-23 | Ming-Tung Shen | Electro-optic device and method for manufacturing the same |
| JP2001250913A (ja) | 1999-12-28 | 2001-09-14 | Mitsumasa Koyanagi | ３次元半導体集積回路装置及びその製造方法 |
| JP4137328B2 (ja) | 1999-12-28 | 2008-08-20 | 光正 小柳 | ３次元半導体集積回路装置の製造方法 |
| US6559539B2 (en) * | 2001-01-24 | 2003-05-06 | Hsiu Wen Tu | Stacked package structure of image sensor |
| US6627983B2 (en) * | 2001-01-24 | 2003-09-30 | Hsiu Wen Tu | Stacked package structure of image sensor |
| SG111919A1 (en) * | 2001-08-29 | 2005-06-29 | Micron Technology Inc | Packaged microelectronic devices and methods of forming same |
| US6611052B2 (en) * | 2001-11-16 | 2003-08-26 | Micron Technology, Inc. | Wafer level stackable semiconductor package |
| TWI234253B (en) | 2002-05-31 | 2005-06-11 | Fujitsu Ltd | Semiconductor device and manufacturing method thereof |
| JP2004140037A (ja) * | 2002-10-15 | 2004-05-13 | Oki Electric Ind Co Ltd | 半導体装置、及びその製造方法 |
| JP3908146B2 (ja) | 2002-10-28 | 2007-04-25 | シャープ株式会社 | 半導体装置及び積層型半導体装置 |
| JP3566957B2 (ja) * | 2002-12-24 | 2004-09-15 | 沖電気工業株式会社 | 半導体装置及びその製造方法 |
| JP4383274B2 (ja) * | 2004-06-30 | 2009-12-16 | Ｎｅｃエレクトロニクス株式会社 | 半導体装置および半導体ウエハの製造方法 |
-
2004
- 2004-06-30 JP JP2004194667A patent/JP4383274B2/ja not_active Expired - Lifetime
-
2005
- 2005-06-02 US US11/142,417 patent/US7663244B2/en not_active Expired - Lifetime
- 2005-06-29 CN CN200710199542.6A patent/CN101188231B/zh not_active Expired - Lifetime
- 2005-06-29 CN CNB2005100810989A patent/CN100463172C/zh not_active Expired - Lifetime
-
2007
- 2007-08-06 US US11/834,094 patent/US7812457B2/en not_active Expired - Lifetime