JP2011249564A5 - - Google Patents

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Publication number
JP2011249564A5
JP2011249564A5 JP2010121337A JP2010121337A JP2011249564A5 JP 2011249564 A5 JP2011249564 A5 JP 2011249564A5 JP 2010121337 A JP2010121337 A JP 2010121337A JP 2010121337 A JP2010121337 A JP 2010121337A JP 2011249564 A5 JP2011249564 A5 JP 2011249564A5
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JP
Japan
Prior art keywords
metal film
metal
electrodes
film
edge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010121337A
Other languages
English (en)
Japanese (ja)
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JP2011249564A (ja
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Publication date
Application filed filed Critical
Priority to JP2010121337A priority Critical patent/JP2011249564A/ja
Priority claimed from JP2010121337A external-priority patent/JP2011249564A/ja
Priority to US13/111,373 priority patent/US8426303B2/en
Publication of JP2011249564A publication Critical patent/JP2011249564A/ja
Publication of JP2011249564A5 publication Critical patent/JP2011249564A5/ja
Pending legal-status Critical Current

Links

JP2010121337A 2010-05-27 2010-05-27 半導体装置の製造方法及び実装構造 Pending JP2011249564A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2010121337A JP2011249564A (ja) 2010-05-27 2010-05-27 半導体装置の製造方法及び実装構造
US13/111,373 US8426303B2 (en) 2010-05-27 2011-05-19 Manufacturing method of semiconductor device, and mounting structure thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010121337A JP2011249564A (ja) 2010-05-27 2010-05-27 半導体装置の製造方法及び実装構造

Publications (2)

Publication Number Publication Date
JP2011249564A JP2011249564A (ja) 2011-12-08
JP2011249564A5 true JP2011249564A5 (enExample) 2013-04-04

Family

ID=45021411

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010121337A Pending JP2011249564A (ja) 2010-05-27 2010-05-27 半導体装置の製造方法及び実装構造

Country Status (2)

Country Link
US (1) US8426303B2 (enExample)
JP (1) JP2011249564A (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8759209B2 (en) 2010-03-25 2014-06-24 Stats Chippac, Ltd. Semiconductor device and method of forming a dual UBM structure for lead free bump connections
DE102018117822A1 (de) 2017-11-17 2019-05-23 Taiwan Semiconductor Manufacturing Co., Ltd. Drei-schritte-ätzen zum bilden einer rdl
US10522501B2 (en) * 2017-11-17 2019-12-31 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor structure and method of forming the same
WO2019125404A1 (en) * 2017-12-19 2019-06-27 Intel Corporation Barrier materials between bumps and pads
KR102765303B1 (ko) 2019-12-31 2025-02-07 삼성전자주식회사 반도체 패키지

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53131766A (en) * 1977-04-22 1978-11-16 Hitachi Ltd Semiconductor device electrode structural body and production of the same
JPS59117135A (ja) * 1982-12-24 1984-07-06 Hitachi Ltd 半導体装置の製造方法
JPS61225839A (ja) * 1985-03-29 1986-10-07 Fujitsu Ltd バンプ電極の形成方法
JPH01120848A (ja) * 1987-11-05 1989-05-12 Seiko Epson Corp 半導体装置及びその製造方法
US5268072A (en) * 1992-08-31 1993-12-07 International Business Machines Corporation Etching processes for avoiding edge stress in semiconductor chip solder bumps
JP3321351B2 (ja) * 1996-01-18 2002-09-03 東芝マイクロエレクトロニクス株式会社 半導体装置およびその製造方法
US5937320A (en) * 1998-04-08 1999-08-10 International Business Machines Corporation Barrier layers for electroplated SnPb eutectic solder joints
JP2001085457A (ja) * 1999-09-10 2001-03-30 Hitachi Ltd 半導体ウエハ、半導体装置及びその製造方法
JP2001257210A (ja) * 2000-03-10 2001-09-21 Hitachi Ltd 半導体集積回路装置
US6586323B1 (en) * 2000-09-18 2003-07-01 Taiwan Semiconductor Manufacturing Company Method for dual-layer polyimide processing on bumping technology
JP2006120803A (ja) 2004-10-20 2006-05-11 Fujitsu Ltd 半導体装置及び半導体装置の製造方法
JP2007317979A (ja) * 2006-05-29 2007-12-06 Toshiba Corp 半導体装置の製造方法
US7456090B2 (en) * 2006-12-29 2008-11-25 Taiwan Semiconductor Manufacturing Co., Ltd. Method to reduce UBM undercut
US8110508B2 (en) * 2007-11-22 2012-02-07 Samsung Electronics Co., Ltd. Method of forming a bump structure using an etching composition for an under bump metallurgy layer
US20120098124A1 (en) * 2010-10-21 2012-04-26 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor device having under-bump metallization (ubm) structure and method of forming the same
JP2012204788A (ja) * 2011-03-28 2012-10-22 Renesas Electronics Corp 半導体装置及び半導体装置の製造方法

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