JP2012015142A5 - - Google Patents

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Publication number
JP2012015142A5
JP2012015142A5 JP2010147196A JP2010147196A JP2012015142A5 JP 2012015142 A5 JP2012015142 A5 JP 2012015142A5 JP 2010147196 A JP2010147196 A JP 2010147196A JP 2010147196 A JP2010147196 A JP 2010147196A JP 2012015142 A5 JP2012015142 A5 JP 2012015142A5
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JP
Japan
Prior art keywords
semiconductor chip
semiconductor
package
thermosetting resin
resin film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2010147196A
Other languages
English (en)
Japanese (ja)
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JP5453678B2 (ja
JP2012015142A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2010147196A priority Critical patent/JP5453678B2/ja
Priority claimed from JP2010147196A external-priority patent/JP5453678B2/ja
Priority to KR1020110061455A priority patent/KR101730916B1/ko
Priority to US13/169,335 priority patent/US8803304B2/en
Priority to TW100122795A priority patent/TWI527186B/zh
Publication of JP2012015142A publication Critical patent/JP2012015142A/ja
Publication of JP2012015142A5 publication Critical patent/JP2012015142A5/ja
Application granted granted Critical
Publication of JP5453678B2 publication Critical patent/JP5453678B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2010147196A 2010-06-29 2010-06-29 半導体パッケージおよびその製造方法 Active JP5453678B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2010147196A JP5453678B2 (ja) 2010-06-29 2010-06-29 半導体パッケージおよびその製造方法
KR1020110061455A KR101730916B1 (ko) 2010-06-29 2011-06-24 반도체 패키지 및 그 제조 방법
US13/169,335 US8803304B2 (en) 2010-06-29 2011-06-27 Semiconductor package and manufacturing method thereof
TW100122795A TWI527186B (zh) 2010-06-29 2011-06-29 半導體封裝及其製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010147196A JP5453678B2 (ja) 2010-06-29 2010-06-29 半導体パッケージおよびその製造方法

Publications (3)

Publication Number Publication Date
JP2012015142A JP2012015142A (ja) 2012-01-19
JP2012015142A5 true JP2012015142A5 (enExample) 2013-05-30
JP5453678B2 JP5453678B2 (ja) 2014-03-26

Family

ID=45351768

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010147196A Active JP5453678B2 (ja) 2010-06-29 2010-06-29 半導体パッケージおよびその製造方法

Country Status (4)

Country Link
US (1) US8803304B2 (enExample)
JP (1) JP5453678B2 (enExample)
KR (1) KR101730916B1 (enExample)
TW (1) TWI527186B (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102012788B1 (ko) 2015-09-23 2019-08-21 주식회사 엘지화학 접착 필름, 반도체 장치의 제조 방법 및 반도체 장치
US10373932B2 (en) 2017-04-20 2019-08-06 Nanya Technology Corporation Stacked semiconductor structure
KR102531762B1 (ko) * 2017-09-29 2023-05-12 엘지이노텍 주식회사 인쇄회로기판 및 이의 제조 방법
US10347507B2 (en) * 2017-09-29 2019-07-09 Lg Innotek Co., Ltd. Printed circuit board
WO2019150445A1 (ja) * 2018-01-30 2019-08-08 日立化成株式会社 フィルム状接着剤及びその製造方法、並びに半導体装置及びその製造方法
KR102565715B1 (ko) 2019-05-03 2023-08-10 삼성전자주식회사 반도체 패키지
JP7385483B2 (ja) * 2020-01-27 2023-11-22 キオクシア株式会社 半導体装置およびその製造方法
JP2022034947A (ja) * 2020-08-19 2022-03-04 キオクシア株式会社 半導体装置およびその製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3565319B2 (ja) * 1999-04-14 2004-09-15 シャープ株式会社 半導体装置及びその製造方法
JP2002184936A (ja) 2000-12-11 2002-06-28 Matsushita Electric Ind Co Ltd 半導体装置およびその製造方法
JP2002222914A (ja) * 2001-01-26 2002-08-09 Sony Corp 半導体装置及びその製造方法
JP2004193174A (ja) * 2002-12-06 2004-07-08 Matsushita Electric Ind Co Ltd 半導体装置およびその製造方法
JP2005197491A (ja) * 2004-01-08 2005-07-21 Matsushita Electric Ind Co Ltd 半導体装置
US9129826B2 (en) * 2005-05-31 2015-09-08 Stats Chippac Ltd. Epoxy bump for overhang die
JP4620553B2 (ja) * 2005-08-30 2011-01-26 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
US8314480B2 (en) * 2010-02-08 2012-11-20 Fairchild Semiconductor Corporation Stackable semiconductor package with embedded die in pre-molded carrier frame

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