JPS53131766A - Semiconductor device electrode structural body and production of the same - Google Patents

Semiconductor device electrode structural body and production of the same

Info

Publication number
JPS53131766A
JPS53131766A JP4591577A JP4591577A JPS53131766A JP S53131766 A JPS53131766 A JP S53131766A JP 4591577 A JP4591577 A JP 4591577A JP 4591577 A JP4591577 A JP 4591577A JP S53131766 A JPS53131766 A JP S53131766A
Authority
JP
Japan
Prior art keywords
production
semiconductor device
same
structural body
device electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4591577A
Other languages
Japanese (ja)
Inventor
Shigeru Takahashi
Yoshikazu Hosokawa
Ryosaku Kanzawa
Yoshitaka Sugawara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP4591577A priority Critical patent/JPS53131766A/en
Publication of JPS53131766A publication Critical patent/JPS53131766A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

PURPOSE: To obtain a metal film electrode structual body of a specified size by evaporating underlying metal films by using a metal mask of a hole diameter larger than the specified size and removing part thereof through photoetching.
COPYRIGHT: (C)1978,JPO&Japio
JP4591577A 1977-04-22 1977-04-22 Semiconductor device electrode structural body and production of the same Pending JPS53131766A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4591577A JPS53131766A (en) 1977-04-22 1977-04-22 Semiconductor device electrode structural body and production of the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4591577A JPS53131766A (en) 1977-04-22 1977-04-22 Semiconductor device electrode structural body and production of the same

Publications (1)

Publication Number Publication Date
JPS53131766A true JPS53131766A (en) 1978-11-16

Family

ID=12732533

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4591577A Pending JPS53131766A (en) 1977-04-22 1977-04-22 Semiconductor device electrode structural body and production of the same

Country Status (1)

Country Link
JP (1) JPS53131766A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6064457A (en) * 1983-09-19 1985-04-13 Hitachi Ltd Semiconductor device
JPS60140737A (en) * 1983-12-27 1985-07-25 Seiko Instr & Electronics Ltd Manufacture of semiconductor device
JP2011249564A (en) * 2010-05-27 2011-12-08 Renesas Electronics Corp Semiconductor device manufacturing method and mounting structure

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6064457A (en) * 1983-09-19 1985-04-13 Hitachi Ltd Semiconductor device
JPS60140737A (en) * 1983-12-27 1985-07-25 Seiko Instr & Electronics Ltd Manufacture of semiconductor device
JPH0244145B2 (en) * 1983-12-27 1990-10-02 Seiko Instr & Electronics
JP2011249564A (en) * 2010-05-27 2011-12-08 Renesas Electronics Corp Semiconductor device manufacturing method and mounting structure

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