JP2005518668A - 研磨組成物 - Google Patents

研磨組成物 Download PDF

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Publication number
JP2005518668A
JP2005518668A JP2003571362A JP2003571362A JP2005518668A JP 2005518668 A JP2005518668 A JP 2005518668A JP 2003571362 A JP2003571362 A JP 2003571362A JP 2003571362 A JP2003571362 A JP 2003571362A JP 2005518668 A JP2005518668 A JP 2005518668A
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JP
Japan
Prior art keywords
polishing
polishing composition
water
slurry
colloidal silica
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
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JP2003571362A
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English (en)
Japanese (ja)
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JP2005518668A5 (enExample
Inventor
シュ，ハオフェン
クァンシ，ジョン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Electronic Materials Holding Inc
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DuPont Electronic Materials Holding Inc
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Publication date
Application filed by DuPont Electronic Materials Holding Inc filed Critical DuPont Electronic Materials Holding Inc
Publication of JP2005518668A publication Critical patent/JP2005518668A/ja
Publication of JP2005518668A5 publication Critical patent/JP2005518668A5/ja
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2003571362A 2002-02-21 2003-02-14 研磨組成物 Pending JP2005518668A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/081,707 US6685757B2 (en) 2002-02-21 2002-02-21 Polishing composition
PCT/US2003/004684 WO2003072669A2 (en) 2002-02-21 2003-02-14 Polishing composition

Publications (2)

Publication Number Publication Date
JP2005518668A true JP2005518668A (ja) 2005-06-23
JP2005518668A5 JP2005518668A5 (enExample) 2006-03-30

Family

ID=27733294

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003571362A Pending JP2005518668A (ja) 2002-02-21 2003-02-14 研磨組成物

Country Status (8)

Country Link
US (1) US6685757B2 (enExample)
EP (1) EP1478492A2 (enExample)
JP (1) JP2005518668A (enExample)
KR (1) KR20040103946A (enExample)
CN (1) CN100446926C (enExample)
AU (1) AU2003215261A1 (enExample)
TW (1) TWI262209B (enExample)
WO (1) WO2003072669A2 (enExample)

Cited By (12)

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Publication number Priority date Publication date Assignee Title
JP2006352043A (ja) * 2005-06-20 2006-12-28 Nitta Haas Inc 半導体研磨用組成物
JP2008235491A (ja) * 2007-03-19 2008-10-02 Nitta Haas Inc 研磨用組成物
JP2009231486A (ja) * 2008-03-21 2009-10-08 Kao Corp シリコンウエハ用研磨液組成物
DE102009031356A1 (de) 2008-07-03 2010-01-21 Fujimi Inc., Kiyosu-shi Benetzungsmittel für Halbleiter, Polierzusammensetzung und sie verwendendes Polierverfahren
JP2014049633A (ja) * 2012-08-31 2014-03-17 Fujimi Inc 研磨用組成物及び基板の製造方法
KR20140080543A (ko) 2011-10-24 2014-06-30 가부시키가이샤 후지미인코퍼레이티드 연마용 조성물, 그것을 사용한 연마 방법 및 기판의 제조 방법
JP2014130958A (ja) * 2012-12-28 2014-07-10 Kao Corp シリコンウェーハ用研磨液組成物
KR20140117496A (ko) 2012-01-16 2014-10-07 가부시키가이샤 후지미인코퍼레이티드 연마용 조성물, 그의 제조 방법, 실리콘 기판의 제조 방법, 및 실리콘 기판
KR20140117495A (ko) 2012-01-16 2014-10-07 가부시키가이샤 후지미인코퍼레이티드 연마용 조성물, 그의 제조 방법, 희석용 원액, 실리콘 기판의 제조 방법, 및 실리콘 기판
WO2017169154A1 (ja) * 2016-03-30 2017-10-05 株式会社フジミインコーポレーテッド 研磨用組成物セット、前研磨用組成物、及びシリコンウェーハの研磨方法
KR20170118690A (ko) 2015-02-19 2017-10-25 가부시키가이샤 후지미인코퍼레이티드 실리콘 웨이퍼 연마용 조성물 및 연마 방법
WO2018150945A1 (ja) * 2017-02-20 2018-08-23 株式会社フジミインコーポレーテッド シリコン基板中間研磨用組成物およびシリコン基板研磨用組成物セット

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4593064B2 (ja) * 2002-09-30 2010-12-08 株式会社フジミインコーポレーテッド 研磨用組成物及びそれを用いた研磨方法
KR100516886B1 (ko) * 2002-12-09 2005-09-23 제일모직주식회사 실리콘 웨이퍼의 최종 연마용 슬러리 조성물
US7736405B2 (en) * 2003-05-12 2010-06-15 Advanced Technology Materials, Inc. Chemical mechanical polishing compositions for copper and associated materials and method of using same
JP4668528B2 (ja) * 2003-09-05 2011-04-13 株式会社フジミインコーポレーテッド 研磨用組成物
JP4532149B2 (ja) * 2004-03-30 2010-08-25 ニッタ・ハース株式会社 シリコンウエハ研磨用組成物およびシリコンウエハの研磨方法
US20100087065A1 (en) * 2007-01-31 2010-04-08 Advanced Technology Materials, Inc. Stabilization of polymer-silica dispersions for chemical mechanical polishing slurry applications
JP2008270584A (ja) * 2007-04-23 2008-11-06 Nippon Chem Ind Co Ltd 半導体ウエハ研磨用組成物及び研磨加工方法
US8877643B2 (en) 2009-06-05 2014-11-04 Sumco Corporation Method of polishing a silicon wafer
DE102009028762A1 (de) * 2009-08-20 2011-03-03 Rena Gmbh Verfahren zum Ätzen von Siliziumoberflächen
US8815110B2 (en) * 2009-09-16 2014-08-26 Cabot Microelectronics Corporation Composition and method for polishing bulk silicon
US8883034B2 (en) * 2009-09-16 2014-11-11 Brian Reiss Composition and method for polishing bulk silicon
US8697576B2 (en) * 2009-09-16 2014-04-15 Cabot Microelectronics Corporation Composition and method for polishing polysilicon
JP5492603B2 (ja) * 2010-03-02 2014-05-14 株式会社フジミインコーポレーテッド 研磨用組成物及びそれを用いた研磨方法
KR20130014588A (ko) * 2010-07-02 2013-02-07 가부시키가이샤 사무코 실리콘 웨이퍼의 연마 방법
DE112011102297B4 (de) * 2010-07-08 2020-10-08 Sumco Corporation Verfahren zum Polieren von Siliziumwafern
KR101685144B1 (ko) * 2011-01-21 2016-12-12 캐보트 마이크로일렉트로닉스 코포레이션 개선된 psd 성능을 갖는 규소 연마 조성물
RU2467047C1 (ru) * 2011-05-04 2012-11-20 Александр Николаевич Коротков Абразивно-притирочная паста
KR20120136882A (ko) * 2011-06-10 2012-12-20 동우 화인켐 주식회사 결정성 실리콘 웨이퍼의 텍스쳐 에칭액 조성물 및 텍스쳐 에칭방법
KR102155205B1 (ko) 2012-08-31 2020-09-11 가부시키가이샤 후지미인코퍼레이티드 연마용 조성물 및 기판의 제조 방법
DE102013205448A1 (de) * 2013-03-27 2014-10-16 Siltronic Ag Verfahren zum Polieren eines Substrates aus Halbleitermaterial
US9012327B2 (en) 2013-09-18 2015-04-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Low defect chemical mechanical polishing composition
CN105802509B (zh) * 2014-12-29 2018-10-26 安集微电子（上海）有限公司 一种组合物在阻挡层抛光中的应用
JP6822432B2 (ja) * 2018-02-23 2021-01-27 株式会社Sumco ウェーハの片面研磨方法
US11600499B2 (en) * 2018-06-27 2023-03-07 Tokyo Electron Limited Substrate cleaning method, substrate cleaning system, and storage medium
CN110551453A (zh) * 2018-12-25 2019-12-10 清华大学 一种抛光组合物
CN111269695A (zh) * 2020-02-29 2020-06-12 上海大学 花生状氧化硅磨粒及其制备方法和应用
JP7619796B2 (ja) * 2020-12-18 2025-01-22 山口精研工業株式会社 フツリン酸ガラス用研磨剤組成物、及びフツリン酸ガラス用研磨剤組成物を用いた研磨方法
CN115851138B (zh) * 2022-12-23 2024-06-28 博力思(天津)电子科技有限公司 一种可减少硅片表面颗粒沾污的硅精抛液

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5352277A (en) * 1988-12-12 1994-10-04 E. I. Du Pont De Nemours & Company Final polishing composition
JPH10309660A (ja) 1997-05-07 1998-11-24 Tokuyama Corp 仕上げ研磨剤
JP4052607B2 (ja) 1998-04-20 2008-02-27 株式会社東芝 研磨剤及び半導体基板のポリッシング方法
JPH11349925A (ja) * 1998-06-05 1999-12-21 Fujimi Inc エッジポリッシング用組成物
JP3810588B2 (ja) * 1998-06-22 2006-08-16 株式会社フジミインコーポレーテッド 研磨用組成物
JP4090589B2 (ja) 1998-09-01 2008-05-28 株式会社フジミインコーポレーテッド 研磨用組成物
JP4132432B2 (ja) * 1999-07-02 2008-08-13 日産化学工業株式会社 研磨用組成物
JP3563017B2 (ja) 2000-07-19 2004-09-08 ロデール・ニッタ株式会社 研磨組成物、研磨組成物の製造方法及びポリシング方法
JP2002043258A (ja) 2000-07-24 2002-02-08 Asahi Kasei Corp 金属膜用研磨組成物
JP2002110596A (ja) * 2000-10-02 2002-04-12 Mitsubishi Electric Corp 半導体加工用研磨剤およびこれに用いる分散剤、並びに上記半導体加工用研磨剤を用いた半導体装置の製造方法

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006352043A (ja) * 2005-06-20 2006-12-28 Nitta Haas Inc 半導体研磨用組成物
JP2008235491A (ja) * 2007-03-19 2008-10-02 Nitta Haas Inc 研磨用組成物
JP2009231486A (ja) * 2008-03-21 2009-10-08 Kao Corp シリコンウエハ用研磨液組成物
DE102009031356A1 (de) 2008-07-03 2010-01-21 Fujimi Inc., Kiyosu-shi Benetzungsmittel für Halbleiter, Polierzusammensetzung und sie verwendendes Polierverfahren
US8632693B2 (en) 2008-07-03 2014-01-21 Fujimi Incorporated Wetting agent for semiconductors, and polishing composition and polishing method employing it
US9579769B2 (en) 2011-10-24 2017-02-28 Fujimi Incorporated Composition for polishing purposes, polishing method using same, and method for producing substrate
KR20140080543A (ko) 2011-10-24 2014-06-30 가부시키가이샤 후지미인코퍼레이티드 연마용 조성물, 그것을 사용한 연마 방법 및 기판의 제조 방법
KR20140117496A (ko) 2012-01-16 2014-10-07 가부시키가이샤 후지미인코퍼레이티드 연마용 조성물, 그의 제조 방법, 실리콘 기판의 제조 방법, 및 실리콘 기판
KR20140117495A (ko) 2012-01-16 2014-10-07 가부시키가이샤 후지미인코퍼레이티드 연마용 조성물, 그의 제조 방법, 희석용 원액, 실리콘 기판의 제조 방법, 및 실리콘 기판
US9206336B2 (en) 2012-01-16 2015-12-08 Fujimi Incorporated Polishing composition, manufacturing process therefor, process for production of silicon substrate, and silicon substrate
JP2014049633A (ja) * 2012-08-31 2014-03-17 Fujimi Inc 研磨用組成物及び基板の製造方法
JP2014130958A (ja) * 2012-12-28 2014-07-10 Kao Corp シリコンウェーハ用研磨液組成物
KR20170118690A (ko) 2015-02-19 2017-10-25 가부시키가이샤 후지미인코퍼레이티드 실리콘 웨이퍼 연마용 조성물 및 연마 방법
US10273383B2 (en) 2015-02-19 2019-04-30 Fujimi Incorporated Polishing composition for silicon wafer and polishing method
WO2017169154A1 (ja) * 2016-03-30 2017-10-05 株式会社フジミインコーポレーテッド 研磨用組成物セット、前研磨用組成物、及びシリコンウェーハの研磨方法
JPWO2017169154A1 (ja) * 2016-03-30 2019-02-07 株式会社フジミインコーポレーテッド 研磨用組成物セット、前研磨用組成物、及びシリコンウェーハの研磨方法
WO2018150945A1 (ja) * 2017-02-20 2018-08-23 株式会社フジミインコーポレーテッド シリコン基板中間研磨用組成物およびシリコン基板研磨用組成物セット
JPWO2018150945A1 (ja) * 2017-02-20 2019-12-26 株式会社フジミインコーポレーテッド シリコン基板中間研磨用組成物およびシリコン基板研磨用組成物セット
JP7185533B2 (ja) 2017-02-20 2022-12-07 株式会社フジミインコーポレーテッド シリコン基板中間研磨用組成物およびシリコン基板研磨用組成物セット

Also Published As

Publication number Publication date
WO2003072669A2 (en) 2003-09-04
WO2003072669A3 (en) 2004-03-04
US20030154659A1 (en) 2003-08-21
EP1478492A2 (en) 2004-11-24
US6685757B2 (en) 2004-02-03
CN1635940A (zh) 2005-07-06
AU2003215261A1 (en) 2003-09-09
WO2003072669A9 (en) 2004-04-01
AU2003215261A8 (en) 2003-09-09
KR20040103946A (ko) 2004-12-09
TWI262209B (en) 2006-09-21
TW200303343A (en) 2003-09-01
CN100446926C (zh) 2008-12-31

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