JP2005510072A - 基板表面を研磨するための方法 - Google Patents

基板表面を研磨するための方法 Download PDF

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Publication number
JP2005510072A
JP2005510072A JP2003545445A JP2003545445A JP2005510072A JP 2005510072 A JP2005510072 A JP 2005510072A JP 2003545445 A JP2003545445 A JP 2003545445A JP 2003545445 A JP2003545445 A JP 2003545445A JP 2005510072 A JP2005510072 A JP 2005510072A
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Japan
Prior art keywords
act
polishing
substrate
aln substrate
aln
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Pending
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JP2003545445A
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English (en)
Japanese (ja)
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JP2005510072A5 (enExample
Inventor
スコウォルター，レオ，ジェイ．
ロホ，カルロス，ホタ．
ロペス，ハヴィエル マルティネス
モーガン，ケニス
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レンセラール ポリテクニック インスティチュート
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Publication of JP2005510072A publication Critical patent/JP2005510072A/ja
Publication of JP2005510072A5 publication Critical patent/JP2005510072A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02024—Mirror polishing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/0056—Control means for lapping machines or devices taking regard of the pH-value of lapping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/006—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the speed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
JP2003545445A 2001-11-20 2002-11-20 基板表面を研磨するための方法 Pending JP2005510072A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US33186801P 2001-11-20 2001-11-20
PCT/US2002/037135 WO2003043780A2 (en) 2001-11-20 2002-11-20 Method for polishing a substrate surface

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2012022627A Division JP5628224B2 (ja) 2001-11-20 2012-02-06 基板表面を研磨するための方法

Publications (2)

Publication Number Publication Date
JP2005510072A true JP2005510072A (ja) 2005-04-14
JP2005510072A5 JP2005510072A5 (enExample) 2009-04-16

Family

ID=23295726

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2003545445A Pending JP2005510072A (ja) 2001-11-20 2002-11-20 基板表面を研磨するための方法
JP2012022627A Expired - Lifetime JP5628224B2 (ja) 2001-11-20 2012-02-06 基板表面を研磨するための方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2012022627A Expired - Lifetime JP5628224B2 (ja) 2001-11-20 2012-02-06 基板表面を研磨するための方法

Country Status (8)

Country Link
US (2) US7037838B2 (enExample)
EP (1) EP1446263B1 (enExample)
JP (2) JP2005510072A (enExample)
AT (1) ATE418420T1 (enExample)
AU (1) AU2002365979A1 (enExample)
CA (1) CA2467806C (enExample)
DE (1) DE60230538D1 (enExample)
WO (1) WO2003043780A2 (enExample)

Cited By (7)

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JP2004281671A (ja) * 2003-03-14 2004-10-07 Ricoh Co Ltd Ｉｉｉ族窒化物結晶の研磨方法およびｉｉｉ族窒化物結晶および半導体デバイス
JP2011049610A (ja) * 2010-12-10 2011-03-10 Sumitomo Electric Ind Ltd ＡｌＮ結晶の表面処理方法、ＡｌＮ結晶基板、エピタキシャル層付ＡｌＮ結晶基板および半導体デバイス
WO2016039116A1 (ja) * 2014-09-11 2016-03-17 株式会社トクヤマ 窒化アルミニウム単結晶基板の洗浄方法および積層体
JP2018170491A (ja) * 2016-11-29 2018-11-01 パロ アルト リサーチ センター インコーポレイテッド 薄膜および基板除去ｉｉｉ族窒化物ベースのデバイスおよび方法
US10208400B2 (en) 2015-02-02 2019-02-19 Fuji Electric Co., Ltd. Method for manufacturing silicon carbide semiconductor device and silicon carbide semiconductor device
JP2021104547A (ja) * 2019-12-26 2021-07-26 ニッタ・デュポン株式会社 研磨スラリー
WO2023277103A1 (ja) * 2021-06-30 2023-01-05 京セラ株式会社 周期表第１３族元素窒化物結晶基板の製造方法

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US20060005763A1 (en) * 2001-12-24 2006-01-12 Crystal Is, Inc. Method and apparatus for producing large, single-crystals of aluminum nitride
US7638346B2 (en) * 2001-12-24 2009-12-29 Crystal Is, Inc. Nitride semiconductor heterostructures and related methods
US8545629B2 (en) * 2001-12-24 2013-10-01 Crystal Is, Inc. Method and apparatus for producing large, single-crystals of aluminum nitride
US8025808B2 (en) * 2003-04-25 2011-09-27 Saint-Gobain Ceramics & Plastics, Inc. Methods for machine ceramics
JP4752214B2 (ja) * 2004-08-20 2011-08-17 住友電気工業株式会社 エピタキシャル層形成用ＡｌＮ結晶の表面処理方法
JP4792802B2 (ja) * 2005-04-26 2011-10-12 住友電気工業株式会社 Ｉｉｉ族窒化物結晶の表面処理方法
WO2006124067A1 (en) * 2005-05-11 2006-11-23 North Carolina State University Controlled polarity group iii-nitride films and methods of preparing such films
US20060288929A1 (en) * 2005-06-10 2006-12-28 Crystal Is, Inc. Polar surface preparation of nitride substrates
US7670902B2 (en) * 2005-07-26 2010-03-02 Semiconductor Manufacturing International (Shanghai) Corporation Method and structure for landing polysilicon contact
RU2320466C2 (ru) * 2005-11-23 2008-03-27 Ооо "Нитридные Кристаллы" Способ полирования поверхности подложки
JP2009517329A (ja) 2005-11-28 2009-04-30 クリスタル・イズ，インコーポレイテッド 低欠陥の大きな窒化アルミニウム結晶及びそれを製造する方法
EP1954857B1 (en) 2005-12-02 2018-09-26 Crystal Is, Inc. Doped aluminum nitride crystals and methods of making them
US9034103B2 (en) * 2006-03-30 2015-05-19 Crystal Is, Inc. Aluminum nitride bulk crystals having high transparency to ultraviolet light and methods of forming them
US8012257B2 (en) * 2006-03-30 2011-09-06 Crystal Is, Inc. Methods for controllable doping of aluminum nitride bulk crystals
WO2008060505A1 (en) * 2006-11-15 2008-05-22 Cabot Microelectronics Corporation Methods for polishing aluminum nitride
EP2121244B1 (en) * 2006-12-20 2013-07-10 Saint-Gobain Ceramics & Plastics, Inc. Methods for machining inorganic, non-metallic workpieces
US9771666B2 (en) 2007-01-17 2017-09-26 Crystal Is, Inc. Defect reduction in seeded aluminum nitride crystal growth
US8323406B2 (en) 2007-01-17 2012-12-04 Crystal Is, Inc. Defect reduction in seeded aluminum nitride crystal growth
US8080833B2 (en) * 2007-01-26 2011-12-20 Crystal Is, Inc. Thick pseudomorphic nitride epitaxial layers
CN101652832B (zh) * 2007-01-26 2011-06-22 晶体公司 厚的赝晶氮化物外延层
US8088220B2 (en) * 2007-05-24 2012-01-03 Crystal Is, Inc. Deep-eutectic melt growth of nitride crystals
US8210904B2 (en) * 2008-04-29 2012-07-03 International Business Machines Corporation Slurryless mechanical planarization for substrate reclamation
US7915178B2 (en) 2008-07-30 2011-03-29 North Carolina State University Passivation of aluminum nitride substrates
US20100314551A1 (en) * 2009-06-11 2010-12-16 Bettles Timothy J In-line Fluid Treatment by UV Radiation
CN105951177B (zh) 2010-06-30 2018-11-02 晶体公司 使用热梯度控制的大块氮化铝单晶的生长
WO2012012384A1 (en) 2010-07-20 2012-01-26 Hexatech, Inc. Polycrystalline aluminum nitride material and method of production thereof
US9299594B2 (en) 2010-07-27 2016-03-29 Taiwan Semiconductor Manufacturing Company, Ltd. Substrate bonding system and method of modifying the same
JP5319628B2 (ja) * 2010-08-26 2013-10-16 シャープ株式会社 窒化物半導体素子および半導体光学装置
WO2012082729A1 (en) 2010-12-14 2012-06-21 Hexatech, Inc. Thermal expansion engineering for polycrystalline aluminum nitride sintered bodies, and application to the manufacture of semi-conductors
US8962359B2 (en) 2011-07-19 2015-02-24 Crystal Is, Inc. Photon extraction from nitride ultraviolet light-emitting devices
JP6275817B2 (ja) 2013-03-15 2018-02-07 クリスタル アイエス, インコーポレーテッドCrystal Is, Inc. 仮像電子及び光学電子装置に対する平面コンタクト
DE112018005414T5 (de) 2017-11-10 2020-07-09 Crystal Is, Inc. Große, UV-Transparente Aluminiumnitrid-Einkristalle und Verfahren zu ihrer Herstellung
CN114667371B (zh) 2019-08-15 2025-05-13 晶化成半导体公司 氮化铝晶体的扩径
EP4189026A4 (en) * 2020-07-29 2024-07-31 Versum Materials US, LLC BUFFER-IN-BOTTLE (PIB) TECHNOLOGY FOR CHEMICAL-MECHANICAL PLANARIZATION (CMP) OF COPPER AND THROUGH-SILICON VIA (TSV)
WO2023004269A1 (en) * 2021-07-23 2023-01-26 Versum Materials Us, Llc Pad-in-a-bottle (pib) technology for copper barrier slurries
JP2024544897A (ja) * 2021-11-10 2024-12-05 バーサム マテリアルズ ユーエス，リミティド ライアビリティ カンパニー 費用効果の高い非多孔質固体研磨パッドを用いたパッドインボトル化学機械的平坦化研磨

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JPH04315457A (ja) * 1991-04-15 1992-11-06 Toshiba Corp ＡｌＮ回路基板
JPH04355920A (ja) * 1991-01-31 1992-12-09 Shin Etsu Handotai Co Ltd 半導体素子形成用基板およびその製造方法
JPH077237A (ja) * 1993-06-14 1995-01-10 Ibiden Co Ltd セラミックス基板、セラミックス基板の表面処理方法、セラミックス基板の粗化面への薄膜形成方法
JP2002016023A (ja) * 2000-06-30 2002-01-18 Shin Etsu Handotai Co Ltd 薄板の加工方法
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JPH04355920A (ja) * 1991-01-31 1992-12-09 Shin Etsu Handotai Co Ltd 半導体素子形成用基板およびその製造方法
JPH04315457A (ja) * 1991-04-15 1992-11-06 Toshiba Corp ＡｌＮ回路基板
JPH077237A (ja) * 1993-06-14 1995-01-10 Ibiden Co Ltd セラミックス基板、セラミックス基板の表面処理方法、セラミックス基板の粗化面への薄膜形成方法
JP2002083793A (ja) * 2000-06-28 2002-03-22 Internatl Business Mach Corp <Ibm> 化学機械研磨における終点検出方法
JP2002016023A (ja) * 2000-06-30 2002-01-18 Shin Etsu Handotai Co Ltd 薄板の加工方法

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004281671A (ja) * 2003-03-14 2004-10-07 Ricoh Co Ltd Ｉｉｉ族窒化物結晶の研磨方法およびｉｉｉ族窒化物結晶および半導体デバイス
JP2011049610A (ja) * 2010-12-10 2011-03-10 Sumitomo Electric Ind Ltd ＡｌＮ結晶の表面処理方法、ＡｌＮ結晶基板、エピタキシャル層付ＡｌＮ結晶基板および半導体デバイス
US10753011B2 (en) 2014-09-11 2020-08-25 Tokuyama Corporation Cleaning method and laminate of aluminum nitride single-crystal substrate
JPWO2016039116A1 (ja) * 2014-09-11 2017-06-29 株式会社トクヤマ 窒化アルミニウム単結晶基板の洗浄方法および積層体
WO2016039116A1 (ja) * 2014-09-11 2016-03-17 株式会社トクヤマ 窒化アルミニウム単結晶基板の洗浄方法および積層体
US11952677B2 (en) 2014-09-11 2024-04-09 Tokuyama Corporation Laminate of aluminum nitride single-crystal substrate
US10208400B2 (en) 2015-02-02 2019-02-19 Fuji Electric Co., Ltd. Method for manufacturing silicon carbide semiconductor device and silicon carbide semiconductor device
JP2018170491A (ja) * 2016-11-29 2018-11-01 パロ アルト リサーチ センター インコーポレイテッド 薄膜および基板除去ｉｉｉ族窒化物ベースのデバイスおよび方法
JP2022028712A (ja) * 2016-11-29 2022-02-16 パロ アルト リサーチ センター インコーポレイテッド 薄膜および基板除去ｉｉｉ族窒化物ベースのデバイスおよび方法
JP7216790B2 (ja) 2016-11-29 2023-02-01 パロ アルト リサーチ センター インコーポレイテッド 薄膜および基板除去ｉｉｉ族窒化物ベースのデバイスおよび方法
JP2021104547A (ja) * 2019-12-26 2021-07-26 ニッタ・デュポン株式会社 研磨スラリー
WO2023277103A1 (ja) * 2021-06-30 2023-01-05 京セラ株式会社 周期表第１３族元素窒化物結晶基板の製造方法
JPWO2023277103A1 (enExample) * 2021-06-30 2023-01-05
JP7650355B2 (ja) 2021-06-30 2025-03-24 京セラ株式会社 周期表第１３族元素窒化物結晶基板の製造方法

Also Published As

Publication number Publication date
EP1446263B1 (en) 2008-12-24
CA2467806A1 (en) 2003-05-30
CA2467806C (en) 2011-04-19
HK1068840A1 (en) 2005-05-06
AU2002365979A8 (en) 2003-06-10
ATE418420T1 (de) 2009-01-15
JP2012134515A (ja) 2012-07-12
WO2003043780B1 (en) 2003-10-30
JP5628224B2 (ja) 2014-11-19
US7037838B2 (en) 2006-05-02
WO2003043780A3 (en) 2003-08-28
WO2003043780A2 (en) 2003-05-30
US20070289946A1 (en) 2007-12-20
US7323414B2 (en) 2008-01-29
EP1446263A2 (en) 2004-08-18
AU2002365979A1 (en) 2003-06-10
US20040033690A1 (en) 2004-02-19
DE60230538D1 (de) 2009-02-05

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