JP2005209936A - 半導体装置の製造方法及びこれに用いる耐熱性粘着テープ - Google Patents
半導体装置の製造方法及びこれに用いる耐熱性粘着テープ Download PDFInfo
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- JP2005209936A JP2005209936A JP2004015795A JP2004015795A JP2005209936A JP 2005209936 A JP2005209936 A JP 2005209936A JP 2004015795 A JP2004015795 A JP 2004015795A JP 2004015795 A JP2004015795 A JP 2004015795A JP 2005209936 A JP2005209936 A JP 2005209936A
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- H01L2224/92—Specific sequence of method steps
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- H01L2224/9222—Sequential connecting processes
- H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
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- H01L2924/156—Material
- H01L2924/157—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2924/15738—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950 C and less than 1550 C
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Abstract
【解決手段】 アウターパッド側に耐熱性粘着テープ20を貼り合わせた金属製のリードフレーム10のダイパッド11c上に半導体チップ15をボンディングする搭載工程と、封止樹脂17により半導体チップ側を片面封止する封止工程と、封止された構造物21を個別の半導体装置21aに切断する切断工程とを、少なくとも含む半導体装置の製造方法であって、前記耐熱性粘着テープ20は、基材層と、離型剤を含有する粘着剤層とから少なくとも構成されていることを特徴とする半導体装置の製造方法。
【選択図】 図1
Description
前記耐熱性粘着テープは、基材層と、離型剤を含有する粘着剤層とから少なくとも構成されていることを特徴とする半導体装置の製造方法、に関する。
25μm厚のポリイミドフィルム(東レデュポン製:カプトン100H)を基材として用いた。一方、ブチルアクリレート100重量部に対してアクリル酸5重量部を構成モノマーとするアクリル系共重合体を用いて、このポリマー100重量部に対してエポキシ系架橋剤(三菱ガス化学製,Tetrad−C)を3重量部、および離型剤として酸化ポリエチレンワックス(クラリアントジャパン製:Licowax PED 521,酸価15−19mgKOH/g)を0.2重量部添加し添加したアクリル系粘着剤を調製した。このアクリル系粘着剤を用いて、厚さ10μmの粘着剤層を設けた耐熱性粘着テープを作製した。このアクリル系粘着剤は、レオメトリック・サイエンティフィック社製のARESを用いて、周波数1Hz、昇温速度5℃/分、サンプルサイズφ7.9mmのパラレルプレートによるせん断貯蔵弾性モードにて測定したところ、200℃における貯蔵弾性率が9.0×105 Paであった。また、この粘着テープは、ステンレス板に貼り合わせた状態で200℃にて1時間加熱後、JIS Z0237に準じて測定された粘着力が0.2N/19mm幅であった。
ファーストボンディング超音波強度:550mW
ファーストボンディング印加時間:10msec
セカンドボンディング加圧:80g
セカンドボンディング超音波強度:500mW
セカンドボンディング印加時間:8msec
実施例1において、アクリル系粘着剤の調製にあたって、離型剤(可塑剤)としてトリメリツト酸エステル(大日本インキ製,W−700)を20重量部添加した以外は実施例と1と同じ組成のアクリル系粘着剤を調製した。また当該アクリル系粘着剤を用いて、実施例1と同様にして耐熱性粘着テープを作製し、また実施例1と同様にしてQFNを製造した。このようにして得られたQFNは、粘着テープを糊残りなく容易に剥がすことができた。また封止樹脂のはみ出しを抑えるマスキング性能も良好である、完成したパッケージに対しても特に著しい付着汚染物などが認められない良好なパッケージを得ることができた。なお、実施例1と同様にして測定した、アクリル系粘着剤の貯蔵弾性率は、7.0×105 Pa、粘着テープの粘着力は、0.5N/19mm幅であった。
上記記耐熱性粘着テープを貼着していないリードフレーム単体に半導体チップをポンディングし、金型に挟み実施例1と同様の条件で樹脂封止を行ったところ、樹脂漏れが発生した。
実施例1において、アクリル系粘着剤の調製にあたって、離型剤を添加しなかったこと以外は実施例と1と同じ組成のアクリル系粘着剤を調製した。また当該アクリル系粘着剤を用いて、実施例1と同様にして耐熱性粘着テープを作製し、また実施例1と同様にしてQFNを製造した。このようにして得られたQFNは、封止樹脂のはみ出しを抑えるマスキング性能は良好であったが、粘着テープの粘着力が著しく高いため、無理に引き剥がしたところ粘着剤層の表層が完成したパッケージに残余してしまった。なお、実施例1と同様にして測定した、アクリル系粘着剤の貯蔵弾性率は、9.0×105 Pa、粘着テープの粘着力は、7.5N/19mm幅であった。
11a 開口
11b 端子部
11c ダイパッド
15 半導体チップ
15a 電極パッド
16 ボンディングワイヤ
17 封止樹脂
20 粘着テープ
21 封止された構造物
21a 半導体装置
Claims (3)
- アウターパッド側に耐熱性粘着テープを貼り合わせた金属製のリードフレームのダイパッド上に半導体チップをボンディングする搭載工程と、封止樹脂により半導体チップ側を片面封止する封止工程と、封止された構造物を個別の半導体装置に切断する切断工程とを、少なくとも含む半導体装置の製造方法であって、
前記耐熱性粘着テープは、基材層と、離型剤を含有する粘着剤層とから少なくとも構成されていることを特徴とする半導体装置の製造方法。 - 前記耐熱性粘着テープは、ステンレス板に貼り合わせた状態で200℃にて1時間加熱後に、JIS Z0237に準じて測定される粘着力が5.0N/19mm幅以下であることを特徴とする請求項1記載の半導体装置の製造方法。
- 請求項1または2記載の半導体装置の製造方法に用いられる耐熱性粘着テープであって、前記耐熱性粘着テープは、基材層と、離型剤を含有する粘着剤層とから少なくとも構成されていることを特徴とする半導体装置製造用耐熱性粘着テープ。
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JP2004015795A JP4566568B2 (ja) | 2004-01-23 | 2004-01-23 | 半導体装置の製造方法及びこれに用いる耐熱性粘着テープ |
TW093140720A TW200525662A (en) | 2004-01-23 | 2004-12-27 | Process for producing semiconductor devices, and heat resistant adhesive tape used in this process |
CNA2004100819160A CN1645580A (zh) | 2004-01-23 | 2004-12-29 | 半导体装置的制造方法及使用于其中的耐热性粘合带 |
SG200500219A SG113568A1 (en) | 2004-01-23 | 2005-01-18 | Process for producing semiconductor devices, and heat resistant adhesive tape used in this process |
KR1020050006000A KR20050076771A (ko) | 2004-01-23 | 2005-01-21 | 반도체 장치의 제조 방법 및 이에 이용되는 내열성 점착테이프 |
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Cited By (8)
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JP2007123711A (ja) * | 2005-10-31 | 2007-05-17 | Tomoegawa Paper Co Ltd | 半導体装置製造用接着シート及び半導体装置並びにその製造方法 |
JP2007242698A (ja) * | 2006-03-06 | 2007-09-20 | Nitto Denko Corp | 半導体装置の製造方法 |
WO2007129711A1 (ja) * | 2006-05-09 | 2007-11-15 | Hitachi Chemical Company, Ltd. | 接着シート、これを用いた回路部材の接続構造及び半導体装置 |
JP2011124495A (ja) * | 2009-12-14 | 2011-06-23 | Nitto Denko Corp | 樹脂封止用耐熱性粘着テープ及びこれを用いた樹脂封止型半導体装置の製造方法 |
JP2011124558A (ja) * | 2009-11-12 | 2011-06-23 | Nitto Denko Corp | 樹脂封止用粘着テープ及びこれを用いた樹脂封止型半導体装置の製造方法 |
JP2012046763A (ja) * | 2011-10-17 | 2012-03-08 | Nitto Denko Corp | 耐熱性粘着テープ |
JP2012059934A (ja) * | 2010-09-09 | 2012-03-22 | Nitto Denko Corp | 樹脂封止用粘着テープ及び樹脂封止型半導体装置の製造方法 |
JP2022108342A (ja) * | 2021-01-13 | 2022-07-26 | アオイ電子株式会社 | 半導体デバイスの製造方法および半導体デバイス |
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- 2005-01-18 SG SG200500219A patent/SG113568A1/en unknown
- 2005-01-21 KR KR1020050006000A patent/KR20050076771A/ko not_active Application Discontinuation
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JP2007123711A (ja) * | 2005-10-31 | 2007-05-17 | Tomoegawa Paper Co Ltd | 半導体装置製造用接着シート及び半導体装置並びにその製造方法 |
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JP2011124558A (ja) * | 2009-11-12 | 2011-06-23 | Nitto Denko Corp | 樹脂封止用粘着テープ及びこれを用いた樹脂封止型半導体装置の製造方法 |
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JP2012059934A (ja) * | 2010-09-09 | 2012-03-22 | Nitto Denko Corp | 樹脂封止用粘着テープ及び樹脂封止型半導体装置の製造方法 |
JP2012046763A (ja) * | 2011-10-17 | 2012-03-08 | Nitto Denko Corp | 耐熱性粘着テープ |
JP2022108342A (ja) * | 2021-01-13 | 2022-07-26 | アオイ電子株式会社 | 半導体デバイスの製造方法および半導体デバイス |
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