JP2012046763A - 耐熱性粘着テープ - Google Patents
耐熱性粘着テープ Download PDFInfo
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- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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Abstract
【解決手段】 本発明の耐熱性粘着テープは、基材層と、該基材層上に設けられた粘着剤層を備え、前記粘着剤層は、紫外線硬化性化合物を含む紫外線硬化型粘着剤により構成され、前記粘着剤層に紫外線を照射し、更に200℃で1時間加熱した後にJIS Z0237に準拠して測定した前記粘着剤層の粘着力が1N/19mm幅以下である。
【選択図】 図1
Description
前記粘着剤層は、紫外線硬化性化合物を含む紫外線硬化型粘着剤により構成され、
前記粘着剤層に紫外線を照射し、更に200℃で1時間加熱した後にJIS Z0237に準拠して測定した前記粘着剤層の粘着力が1N/19mm幅以下である。
即ち、本発明によれば、封止樹脂による半導体チップの封止前に、リードフレームに貼着している耐熱性粘着テープの粘着剤層に予め放射線を照射することにより、該粘着剤層の粘着力を低下させておくので、耐熱性粘着テープにより封止工程での樹脂漏れを好適に防止すると共に、該耐熱性粘着テープの剥離の際には、モールドした封止樹脂の剥がれや破損、糊残りを防止することができる。即ち、本発明の耐熱性粘着テープによれば、歩留まりを向上させて半導体装置を製造することができる。
ブチル(メタ)アクリレートモノマー100重量部に対して、構成モノマーとしての(メタ)アクリル酸モノマーを5重量部配合してアクリル系共重合体を得た。このアクリル系共重合体100重量部に対して、エポキシ系架橋剤(三菱ガス化学製:Tebad‐C)を0.5重量部添加したアクリル系粘着剤に、紫外線硬化性化合物50重量部と、紫外線硬化開始剤3重量部とを添加して、粘着剤組成物を調製した。
リードフレームの材質をNi/Pd PPFに変更したこと以外は、実施例1と同様して行った。その結果、封止樹脂の樹脂漏れも無く、またモールド終了時に耐熱性粘着テープを剥離する際にも、該耐熱性粘着テープを容易に剥離することができた。更に、完成したパッケージに対しても、封止樹脂に糊付着による著しい汚染等が認められず、良好なパッケージを得ることができた。
前記耐熱性粘着テープを貼着しないでリードフレーム単体に半導体チップをボンディングし、その後、実施例1と同様にして樹脂封止を行った。その結果、樹脂漏れが発生した。
粘着剤層に紫外線硬化性化合物を添加しなかったこと以外は、実施例1で使用したのと同じ組成のアクリル系粘着剤を用いて、本比較例に係る耐熱性粘着テープを作成した。この耐熱性粘着テープをステンレス板に貼り合わせた状態で、200℃にて1時間加熱し、その後の粘着力をJIS Z0237に準拠して測定した。その結果、粘着力は2.5N/19mm幅であった。
11 パッケージパターン領域
11a 開口
11b 端子部
11c ダイパッド
11d ダイバー
12 インジェクション時間
13 ガイドピン用孔
15 半導体チップ
15a 電極パッド
16 ボンディングワイヤー
17 封止樹脂
18 金型
18a 上金型
18b 下金型
19 導電性ペースト
20 耐熱性粘着テープ
Claims (7)
- 基材層と、該基材層上に設けられた粘着剤層を備える耐熱性粘着テープであって、
前記粘着剤層は、紫外線硬化性化合物を含む紫外線硬化型粘着剤により構成され、
前記粘着剤層に紫外線を照射し、更に200℃で1時間加熱した後にJIS Z0237に準拠して測定した前記粘着剤層の粘着力が1N/19mm幅以下である耐熱性粘着テープ。 - 前記粘着剤層を200℃で1時間加熱した後にJIS Z0237に準拠して測定した前記粘着剤層の粘着力が5N/19mm幅以下である請求項1に記載の耐熱性粘着テープ。
- 前記基材層の線熱膨張係数が1.0×10−5〜3.0×10−5/Kである請求項1又は2に記載の耐熱性粘着テープ。
- 前記紫外線硬化性化合物の配合量は、前記紫外線硬化型粘着剤を構成する粘着剤100重量部に対し5〜500重量部である請求項1〜3のいずれか1項に記載の耐熱性粘着テープ。
- 前記粘着剤がアクリル系ポリマーを含むアクリル系粘着剤である請求項4に記載の耐熱性粘着テープ。
- 前記粘着剤が架橋剤をさらに含む請求項5に記載の耐熱性粘着テープ。
- 前記架橋剤の含有量は、前記アクリル系ポリマー100重量部に対し0.1〜15重量部である請求項6に記載の耐熱性粘着テープ。
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019131888A1 (ja) * | 2017-12-28 | 2019-07-04 | リンテック株式会社 | 粘着シート及び半導体装置の製造方法 |
WO2019130539A1 (ja) * | 2017-12-28 | 2019-07-04 | リンテック株式会社 | 粘着シート及び半導体装置の製造方法 |
WO2019181732A1 (ja) * | 2018-03-20 | 2019-09-26 | リンテック株式会社 | 粘着テープおよび半導体装置の製造方法 |
KR20230002527A (ko) | 2020-03-27 | 2023-01-05 | 가부시키가이샤 데라오카 세이사쿠쇼 | 열박리형 점착 테이프 |
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JP2002222911A (ja) * | 2001-01-29 | 2002-08-09 | Nitto Denko Corp | リードフレーム積層物および半導体装置の製造方法 |
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JP2002222911A (ja) * | 2001-01-29 | 2002-08-09 | Nitto Denko Corp | リードフレーム積層物および半導体装置の製造方法 |
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Cited By (13)
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JPWO2019131888A1 (ja) * | 2017-12-28 | 2020-12-24 | リンテック株式会社 | 粘着シート及び半導体装置の製造方法 |
WO2019130539A1 (ja) * | 2017-12-28 | 2019-07-04 | リンテック株式会社 | 粘着シート及び半導体装置の製造方法 |
CN111527594A (zh) * | 2017-12-28 | 2020-08-11 | 琳得科株式会社 | 粘合片及半导体装置的制造方法 |
KR20200101914A (ko) | 2017-12-28 | 2020-08-28 | 린텍 가부시키가이샤 | 점착 시트 및 반도체 장치의 제조 방법 |
WO2019131888A1 (ja) * | 2017-12-28 | 2019-07-04 | リンテック株式会社 | 粘着シート及び半導体装置の製造方法 |
CN111527594B (zh) * | 2017-12-28 | 2023-10-20 | 琳得科株式会社 | 粘合片及半导体装置的制造方法 |
JP7416626B2 (ja) | 2017-12-28 | 2024-01-17 | リンテック株式会社 | 粘着シート及び半導体装置の製造方法 |
WO2019181732A1 (ja) * | 2018-03-20 | 2019-09-26 | リンテック株式会社 | 粘着テープおよび半導体装置の製造方法 |
CN111868192A (zh) * | 2018-03-20 | 2020-10-30 | 琳得科株式会社 | 粘着胶带及半导体装置的制造方法 |
JPWO2019181732A1 (ja) * | 2018-03-20 | 2021-04-01 | リンテック株式会社 | 粘着テープおよび半導体装置の製造方法 |
TWI801527B (zh) * | 2018-03-20 | 2023-05-11 | 日商琳得科股份有限公司 | 半導體裝置的製造方法 |
JP7381448B2 (ja) | 2018-03-20 | 2023-11-15 | リンテック株式会社 | 粘着テープおよび半導体装置の製造方法 |
KR20230002527A (ko) | 2020-03-27 | 2023-01-05 | 가부시키가이샤 데라오카 세이사쿠쇼 | 열박리형 점착 테이프 |
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