JP2007242698A - 半導体装置の製造方法 - Google Patents
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Abstract
【解決手段】 本発明の半導体装置の製造方法は、半導体チップ15側を封止樹脂により片面封止する工程の前に、放射線硬化型粘着剤を含み構成される粘着剤層を備えた耐熱性粘着テープ20に対して、予め放射線を照射して耐熱性粘着テープ20の粘着力を低下させ、これにより、封止樹脂のはみ出しを防止すると共に、耐熱性粘着テープ20のリードフレーム10からの剥離を容易にする。
【選択図】 図1
Description
即ち、本発明によれば、封止樹脂による半導体チップの封止前に、リードフレームに貼着している耐熱性粘着テープの粘着剤層に予め放射線を照射することにより、該粘着剤層の粘着力を低下させておくので、耐熱性粘着テープにより封止工程での樹脂漏れを好適に防止すると共に、該耐熱性粘着テープの剥離の際には、モールドした封止樹脂の剥がれや破損、糊残りを防止することができる。即ち、本発明の半導体装置の製造方法によれば、歩留まりを向上させて半導体装置を製造することができる。
ブチル(メタ)アクリレートモノマー100重量部に対して、構成モノマーとしての(メタ)アクリル酸モノマーを5重量部配合してアクリル系共重合体を得た。このアクリル系共重合体100重量部に対して、エポキシ系架橋剤(三菱ガス化学製:Tebad‐C)を0.5重量部添加したアクリル系粘着剤に、紫外線硬化性化合物50重量部と、紫外線硬化開始剤3重量部とを添加して、粘着剤組成物を調製した。
リードフレームの材質をNi/Pd PPFに変更したこと以外は、実施例1と同様して行った。その結果、封止樹脂の樹脂漏れも無く、またモールド終了時に耐熱性粘着テープを剥離する際にも、該耐熱性粘着テープを容易に剥離することができた。更に、完成したパッケージに対しても、封止樹脂に糊付着による著しい汚染等が認められず、良好なパッケージを得ることができた。
前記耐熱性粘着テープを貼着しないでリードフレーム単体に半導体チップをボンディングし、その後、実施例1と同様にして樹脂封止を行った。その結果、樹脂漏れが発生した。
粘着剤層に紫外線硬化性化合物を添加しなかったこと以外は、実施例1で使用したのと同じ組成のアクリル系粘着剤を用いて、本比較例に係る耐熱性粘着テープを作成した。この耐熱性粘着テープをステンレス板に貼り合わせた状態で、200℃にて1時間加熱し、その後の粘着力をJIS Z0237に準拠して測定した。その結果、粘着力は2.5N/19mm幅であった。
11 パッケージパターン領域
11a 開口
11b 端子部
11c ダイパッド
11d ダイバー
12 インジェクション時間
13 ガイドピン用孔
15 半導体チップ
15a 電極パッド
16 ボンディングワイヤー
17 封止樹脂
18 金型
18a 上金型
18b 下金型
19 導電性ペースト
20 耐熱性粘着テープ
Claims (4)
- 放射線硬化型粘着剤を含み構成される粘着剤層を備えた耐熱性粘着テープを、リードフレームのアウターパッド側に貼り合わせる貼着工程と、
前記リードフレームのダイパッド上に半導体チップをボンディングする搭載工程と、
前記リードフレームの端子部先端と前記半導体チップ上の電極パッドとをボンディングワイヤーで電気的に接続する結線工程と、
前記リードフレーム側から前記耐熱性粘着テープに放射線を照射することにより、該耐熱性粘着テープの粘着力を低下させる放射線照射工程と、
前記半導体チップ側を封止樹脂により片面封止する封止工程と、
前記耐熱性粘着テープを前記リードフレームから剥離する剥離工程とを有することを特徴とする半導体装置の製造方法。 - 前記放射線硬化型粘着剤として、紫外線硬化型粘着剤を使用することを特徴とする請求項1に記載の半導体装置の製造方法。
- 前記耐熱性粘着テープとして、200℃で2時間加熱後にJIS Z0237に準拠して測定した粘着力が5N/19mm幅以下のものを使用することを特徴とする請求項1又は2に記載の半導体装置の製造方法。
- 前記耐熱性粘着テープとして、電子線を照射し、更に200℃で2時間加熱後にJIS Z0237に準拠して測定した粘着力が1N/19mm幅以下のものを使用することを特徴とする請求項1〜3の何れか1項に記載の半導体装置の製造方法。
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010073853A (ja) * | 2008-09-18 | 2010-04-02 | Nitto Denko Corp | 半導体装置製造用耐熱性粘着テープ及び半導体装置の製造方法 |
JP2011124558A (ja) * | 2009-11-12 | 2011-06-23 | Nitto Denko Corp | 樹脂封止用粘着テープ及びこれを用いた樹脂封止型半導体装置の製造方法 |
JP2012059934A (ja) * | 2010-09-09 | 2012-03-22 | Nitto Denko Corp | 樹脂封止用粘着テープ及び樹脂封止型半導体装置の製造方法 |
KR101364438B1 (ko) * | 2012-09-21 | 2014-02-18 | 도레이첨단소재 주식회사 | 에너지선 반응형 내열성 점착시트를 이용한 반도체 장치의 제조방법 |
JP2014150182A (ja) * | 2013-02-01 | 2014-08-21 | Denso Corp | 半導体装置の製造方法 |
WO2016171170A1 (ja) * | 2015-04-24 | 2016-10-27 | 日東電工株式会社 | 封止半導体素子および半導体装置の製造方法 |
WO2020162330A1 (ja) * | 2019-02-06 | 2020-08-13 | 日東電工株式会社 | 粘着シート |
Citations (2)
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JP2002222911A (ja) * | 2001-01-29 | 2002-08-09 | Nitto Denko Corp | リードフレーム積層物および半導体装置の製造方法 |
JP2005209936A (ja) * | 2004-01-23 | 2005-08-04 | Nitto Denko Corp | 半導体装置の製造方法及びこれに用いる耐熱性粘着テープ |
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Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2002222911A (ja) * | 2001-01-29 | 2002-08-09 | Nitto Denko Corp | リードフレーム積層物および半導体装置の製造方法 |
JP2005209936A (ja) * | 2004-01-23 | 2005-08-04 | Nitto Denko Corp | 半導体装置の製造方法及びこれに用いる耐熱性粘着テープ |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010073853A (ja) * | 2008-09-18 | 2010-04-02 | Nitto Denko Corp | 半導体装置製造用耐熱性粘着テープ及び半導体装置の製造方法 |
JP2011124558A (ja) * | 2009-11-12 | 2011-06-23 | Nitto Denko Corp | 樹脂封止用粘着テープ及びこれを用いた樹脂封止型半導体装置の製造方法 |
JP2012059934A (ja) * | 2010-09-09 | 2012-03-22 | Nitto Denko Corp | 樹脂封止用粘着テープ及び樹脂封止型半導体装置の製造方法 |
KR101364438B1 (ko) * | 2012-09-21 | 2014-02-18 | 도레이첨단소재 주식회사 | 에너지선 반응형 내열성 점착시트를 이용한 반도체 장치의 제조방법 |
JP2014150182A (ja) * | 2013-02-01 | 2014-08-21 | Denso Corp | 半導体装置の製造方法 |
WO2016171170A1 (ja) * | 2015-04-24 | 2016-10-27 | 日東電工株式会社 | 封止半導体素子および半導体装置の製造方法 |
WO2020162330A1 (ja) * | 2019-02-06 | 2020-08-13 | 日東電工株式会社 | 粘着シート |
WO2020162331A1 (ja) * | 2019-02-06 | 2020-08-13 | 日東電工株式会社 | 粘着シート |
CN113412316A (zh) * | 2019-02-06 | 2021-09-17 | 日东电工株式会社 | 粘合片 |
CN113412317A (zh) * | 2019-02-06 | 2021-09-17 | 日东电工株式会社 | 粘合片 |
CN113412317B (zh) * | 2019-02-06 | 2023-11-28 | 日东电工株式会社 | 粘合片 |
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