JP2004534129A5 - - Google Patents

Download PDF

Info

Publication number
JP2004534129A5
JP2004534129A5 JP2003509047A JP2003509047A JP2004534129A5 JP 2004534129 A5 JP2004534129 A5 JP 2004534129A5 JP 2003509047 A JP2003509047 A JP 2003509047A JP 2003509047 A JP2003509047 A JP 2003509047A JP 2004534129 A5 JP2004534129 A5 JP 2004534129A5
Authority
JP
Japan
Prior art keywords
adhesive composition
optionally
clay
conductive
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2003509047A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004534129A (ja
JP4417710B2 (ja
Filing date
Publication date
Priority claimed from US09/896,655 external-priority patent/US6884833B2/en
Application filed filed Critical
Publication of JP2004534129A publication Critical patent/JP2004534129A/ja
Publication of JP2004534129A5 publication Critical patent/JP2004534129A5/ja
Application granted granted Critical
Publication of JP4417710B2 publication Critical patent/JP4417710B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2003509047A 2001-06-29 2002-04-12 親有機性粘土成分により性能を向上させた接着剤が組み入れられたデバイス、組成物、および方法 Expired - Fee Related JP4417710B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/896,655 US6884833B2 (en) 2001-06-29 2001-06-29 Devices, compositions, and methods incorporating adhesives whose performance is enhanced by organophilic clay constituents
PCT/US2002/011309 WO2003002682A1 (en) 2001-06-29 2002-04-12 Devices, compositions, and methods incorporating adhesives whose preformance is enhanced by organophilic clay constituents

Publications (3)

Publication Number Publication Date
JP2004534129A JP2004534129A (ja) 2004-11-11
JP2004534129A5 true JP2004534129A5 (enExample) 2005-12-22
JP4417710B2 JP4417710B2 (ja) 2010-02-17

Family

ID=25406577

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003509047A Expired - Fee Related JP4417710B2 (ja) 2001-06-29 2002-04-12 親有機性粘土成分により性能を向上させた接着剤が組み入れられたデバイス、組成物、および方法

Country Status (10)

Country Link
US (1) US6884833B2 (enExample)
EP (1) EP1399519B8 (enExample)
JP (1) JP4417710B2 (enExample)
KR (1) KR100877444B1 (enExample)
CN (1) CN1246410C (enExample)
AT (1) ATE290055T1 (enExample)
DE (1) DE60203113T2 (enExample)
MY (1) MY132559A (enExample)
TW (1) TWI301145B (enExample)
WO (1) WO2003002682A1 (enExample)

Families Citing this family (93)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001014484A1 (en) * 1999-08-25 2001-03-01 Hitachi Chemical Company, Ltd. Adhesive agent, method for connecting wiring terminals and wiring structure
USRE44145E1 (en) 2000-07-07 2013-04-09 A.V. Topchiev Institute Of Petrochemical Synthesis Preparation of hydrophilic pressure sensitive adhesives having optimized adhesive properties
KR100522528B1 (ko) * 2000-10-13 2005-10-19 가부시키가이샤 덴소 터치 패널 및 표시장치
US8206738B2 (en) 2001-05-01 2012-06-26 Corium International, Inc. Hydrogel compositions with an erodible backing member
US20050215727A1 (en) 2001-05-01 2005-09-29 Corium Water-absorbent adhesive compositions and associated methods of manufacture and use
EP1390085B1 (en) 2001-05-01 2009-08-05 A.V. Topchiev Institute of Petrochemical Synthesis Hydrogel compositions
US8541021B2 (en) 2001-05-01 2013-09-24 A.V. Topchiev Institute Of Petrochemical Synthesis Hydrogel compositions demonstrating phase separation on contact with aqueous media
US20050113510A1 (en) 2001-05-01 2005-05-26 Feldstein Mikhail M. Method of preparing polymeric adhesive compositions utilizing the mechanism of interaction between the polymer components
US8840918B2 (en) 2001-05-01 2014-09-23 A. V. Topchiev Institute of Petrochemical Synthesis, Russian Academy of Sciences Hydrogel compositions for tooth whitening
WO2002087642A2 (en) * 2001-05-01 2002-11-07 A.V. Topchiev Institute Of Petrochemical Synthesis Two-phase, water-absorbent bioadhesive composition
DE10153562A1 (de) * 2001-10-30 2003-05-15 Infineon Technologies Ag Verfahren zur Verringerung des elektrischen Kontaktwiderstandes in organischen Feldeffekt-Transistoren durch Einbetten von Nanopartikeln zur Erzeugung von Feldüberhöhungen an der Grenzfläche zwischen dem Kontaktmaterial und dem organischen Halbleitermaterial
DE10206818A1 (de) * 2002-02-18 2003-08-28 Infineon Technologies Ag Elektronisches Bauteil mit Klebstoffschicht und Verfahren zur Herstellung derselben
US7754976B2 (en) * 2002-04-15 2010-07-13 Hamilton Sundstrand Corporation Compact circuit carrier package
US7217853B2 (en) * 2002-05-24 2007-05-15 Corium International, Inc. Composition for cushions, wound dressings and other skin-contacting products
JP2004051755A (ja) 2002-07-18 2004-02-19 Ricoh Co Ltd 弾性導電樹脂及び弾性導電接合構造
US7285583B2 (en) * 2002-07-30 2007-10-23 Liquamelt Licensing Llc Hybrid plastisol/hot melt compositions
KR20050040812A (ko) * 2002-09-18 2005-05-03 가부시키가이샤 에바라 세이사꾸쇼 본딩물질 및 본딩방법
US6867978B2 (en) * 2002-10-08 2005-03-15 Intel Corporation Integrated heat spreader package for heat transfer and for bond line thickness control and process of making
DE10313121A1 (de) * 2003-01-29 2004-08-05 Tesa Ag Klebeband und Verwendung dessen zur Verklebung von Drucktüchern
US8518304B1 (en) 2003-03-31 2013-08-27 The Research Foundation Of State University Of New York Nano-structure enhancements for anisotropic conductive material and thermal interposers
US7034403B2 (en) * 2003-04-10 2006-04-25 3M Innovative Properties Company Durable electronic assembly with conductive adhesive
WO2004094550A1 (en) * 2003-04-10 2004-11-04 3M Innovative Properties Company Heat-activatable adhesive
US8062734B2 (en) * 2003-04-28 2011-11-22 Eastman Kodak Company Article comprising conductive conduit channels
FR2854899B1 (fr) * 2003-05-16 2006-07-07 Atofina Compositions de polymeres thermoplastiques olefiniques et de charges de taille nanometrique sous forme de melanges-maitres
US7352070B2 (en) * 2003-06-27 2008-04-01 Delphi Technologies, Inc. Polymer encapsulated electrical devices
US7408787B2 (en) * 2003-07-30 2008-08-05 Intel Corporation Phase change thermal interface materials including polyester resin
US7163967B2 (en) * 2003-12-01 2007-01-16 Cryovac, Inc. Method of increasing the gas transmission rate of a film
US7335327B2 (en) * 2003-12-31 2008-02-26 Cryovac, Inc. Method of shrinking a film
AU2005210637B2 (en) 2004-01-30 2010-09-16 A.V. Topchiev Institute Of Petrochemical Synthesis Rapidly dissolving film for delivery of an active agent
KR100604984B1 (ko) * 2004-06-10 2006-07-31 한국생산기술연구원 나노점토가 포함된 부식방지 코팅제 및 그 제법
JP4517225B2 (ja) * 2004-06-14 2010-08-04 ▲晧▼一 新原 感圧導電性エラストマー
KR100584962B1 (ko) * 2004-07-26 2006-05-29 삼성전기주식회사 액정 중합체로 커버레이 성형된 경연성 인쇄회로기판 및그 제조 방법
US9242021B2 (en) * 2004-08-05 2016-01-26 Corium International, Inc. Adhesive composition
DE102004049663B3 (de) * 2004-10-11 2006-04-13 Infineon Technologies Ag Kunststoffgehäuse und Halbleiterbauteil mit derartigem Kunststoffgehäuse sowie Verfahren zur Herstellung derselben
CA2578851C (en) * 2004-10-22 2010-12-14 Michelin Recherche Et Technique S.A. Barrier layer for elastomeric articles
JP2006140052A (ja) * 2004-11-12 2006-06-01 Three M Innovative Properties Co 熱硬化性接着フィルム付きコネクタ及びそれを用いた接続方法
CN100405506C (zh) * 2004-11-26 2008-07-23 鸿富锦精密工业(深圳)有限公司 各向异性导电材料
TWI323901B (en) * 2004-11-26 2010-04-21 Hon Hai Prec Ind Co Ltd Anisotropic conductive material
US7749350B2 (en) * 2005-04-27 2010-07-06 Avery Dennison Retail Information Services Webs and methods of making same
US7842156B2 (en) * 2005-04-27 2010-11-30 Avery Dennison Corporation Webs and methods of making same
US8802214B2 (en) 2005-06-13 2014-08-12 Trillion Science, Inc. Non-random array anisotropic conductive film (ACF) and manufacturing processes
US20060280912A1 (en) * 2005-06-13 2006-12-14 Rong-Chang Liang Non-random array anisotropic conductive film (ACF) and manufacturing processes
DE102005030627A1 (de) * 2005-06-30 2007-01-04 Bundesdruckerei Gmbh Sicherheits- oder Wertdokument mit einer Einrichtung zur kontaktlosen Kommunikation mit einem externen Lese- und/oder Schreibgerät
US7678841B2 (en) * 2005-08-19 2010-03-16 Cryovac, Inc. Increasing the gas transmission rate of a film comprising fullerenes
US7888419B2 (en) * 2005-09-02 2011-02-15 Naturalnano, Inc. Polymeric composite including nanoparticle filler
JP5034206B2 (ja) * 2005-10-03 2012-09-26 株式会社デンソー 導電性接着剤
JP4761952B2 (ja) * 2005-12-14 2011-08-31 富士通株式会社 Rfidタグ
GB2433926A (en) * 2005-12-22 2007-07-11 Lifescan Scotland Inc Container with RFID for storing calibration information
US7923488B2 (en) * 2006-10-16 2011-04-12 Trillion Science, Inc. Epoxy compositions
US8124678B2 (en) * 2006-11-27 2012-02-28 Naturalnano, Inc. Nanocomposite master batch composition and method of manufacture
JP5019434B2 (ja) * 2007-02-07 2012-09-05 日東電工株式会社 粘着テープ
JP2008189858A (ja) * 2007-02-07 2008-08-21 Nitto Denko Corp 感圧性粘着テープ
US8648132B2 (en) * 2007-02-07 2014-02-11 Naturalnano, Inc. Nanocomposite method of manufacture
JP2008214518A (ja) * 2007-03-06 2008-09-18 Nitto Denko Corp 粘着テープ
US20090326133A1 (en) * 2007-05-23 2009-12-31 Naturalnano Research, Inc. Fire and flame retardant polymer composites
TWI334746B (en) * 2008-03-31 2010-12-11 Raydium Semiconductor Corp Assembly structure
US20120080418A1 (en) * 2008-05-15 2012-04-05 Atsunobu Sakamoto Impulse sealer including ceramic-covered heater
WO2010015420A1 (de) * 2008-08-08 2010-02-11 Pp-Mid Gmbh Polymerformkörper und leiterplatten-anordnung, sowie verfahren zu deren herstellung
US8486305B2 (en) 2009-11-30 2013-07-16 Lockheed Martin Corporation Nanoparticle composition and methods of making the same
WO2010056689A1 (en) * 2008-11-14 2010-05-20 Naturalnano, Inc. Nanocomposite including heat-treated clay and polymer
CA2751884C (en) * 2009-01-14 2018-09-25 Corium International, Inc. Transdermal administration of tamsulosin
US8488271B2 (en) * 2009-07-06 2013-07-16 Samsung Electro-Mechanics Japan Advanced Technology Co., Ltd. Adhesion structure and method using electrically conductive adhesive, disk drive device using the adhesion structure and method, and method for manufacturing the disk drive device
US9072185B2 (en) * 2009-07-30 2015-06-30 Lockheed Martin Corporation Copper nanoparticle application processes for low temperature printable, flexible/conformal electronics and antennas
US9011570B2 (en) 2009-07-30 2015-04-21 Lockheed Martin Corporation Articles containing copper nanoparticles and methods for production and use thereof
JP5691147B2 (ja) * 2009-08-25 2015-04-01 東ソー株式会社 エチレン−酢酸ビニル共重合体樹脂組成物、それからなる接着剤、接着フィルム、及びそれを含む積層体
KR20120099685A (ko) * 2009-10-30 2012-09-11 리서치 프론티어스 인코퍼레이티드 버스-바아 연결이 개선된 현탁형 입자 장치 필름 및 광 밸브 라미네이트
US20110132537A1 (en) * 2009-12-03 2011-06-09 3M Innovative Properties Company Composition, tape, and use thereof
US8061624B2 (en) * 2009-12-28 2011-11-22 Avery Dennison Corporation RFID strap and cutting device
US8834747B2 (en) * 2010-03-04 2014-09-16 Lockheed Martin Corporation Compositions containing tin nanoparticles and methods for use thereof
US10544483B2 (en) 2010-03-04 2020-01-28 Lockheed Martin Corporation Scalable processes for forming tin nanoparticles, compositions containing tin nanoparticles, and applications utilizing same
DE102010024523B4 (de) * 2010-06-21 2017-03-23 Leonhard Kurz Stiftung & Co. Kg Mehrschichtiges Folienelement
KR20110121662A (ko) * 2010-08-03 2011-11-08 삼성전기주식회사 터치패널 및 그 제조방법
TWI398198B (zh) * 2010-09-13 2013-06-01 Zhen Ding Technology Co Ltd 具有接地屏蔽結構之電路板及其製作方法
WO2012116193A1 (en) * 2011-02-25 2012-08-30 Carey & Co. Dry adhesive
WO2012145865A1 (zh) * 2011-04-29 2012-11-01 Yang Chang-Ming 布料电子化的产品及方法
US9102851B2 (en) 2011-09-15 2015-08-11 Trillion Science, Inc. Microcavity carrier belt and method of manufacture
US9475963B2 (en) 2011-09-15 2016-10-25 Trillion Science, Inc. Fixed array ACFs with multi-tier partially embedded particle morphology and their manufacturing processes
TWI488930B (zh) * 2012-03-12 2015-06-21 Lg Chemical Ltd 壓感性黏著組成物
CN102627669B (zh) * 2012-04-12 2015-01-07 天津药物研究院 含有磷酸酯的哌嗪衍生物及其制备方法和用途
US9261336B2 (en) 2013-03-15 2016-02-16 Mattel, Inc. Toy projectile and method of making
KR20140141208A (ko) * 2013-05-31 2014-12-10 제일모직주식회사 전기전도성이 우수한 캐리어 테이프용 폴리카보네이트계 수지 조성물
WO2014192881A1 (ja) * 2013-05-31 2014-12-04 積水化学工業株式会社 液晶表示素子用シール剤、上下導通材料、液晶表示素子、及び、液晶表示素子用シール剤の製造方法
KR20150043787A (ko) * 2013-10-15 2015-04-23 삼성전기주식회사 터치 스크린 패널 및 이의 제조방법
US10490521B2 (en) * 2014-06-26 2019-11-26 Taiwan Semiconductor Manufacturing Company, Ltd. Advanced structure for info wafer warpage reduction
US10893728B2 (en) * 2017-01-30 2021-01-19 Chi Huynh Jewelry having druzy or geode effect and methods of manufacture
TWI755492B (zh) 2017-03-06 2022-02-21 美商卡爾拜斯有限公司 基於碳納米管的熱界面材料及其製造和使用方法
DE102017010605B4 (de) * 2017-11-16 2025-07-24 Lohmann Gmbh & Co. Kg Elektrisch leitfähige klebende Verbindung als Einbruchsschutz
JP7140143B2 (ja) * 2018-01-30 2022-09-21 昭和電工マテリアルズ株式会社 半導体装置の製造方法、及びフィルム状接着剤
US12022642B2 (en) 2018-08-21 2024-06-25 Laird Technologies, Inc. Patterned electromagnetic interference (EMI) mitigation materials including carbon nanotubes
US10707596B2 (en) * 2018-09-21 2020-07-07 Carbice Corporation Coated electrical connectors and methods of making and using thereof
CN111642076A (zh) * 2020-04-29 2020-09-08 信维通信(江苏)有限公司 一种二维材料填充覆铜板的制造工艺
JP7513430B2 (ja) * 2020-06-05 2024-07-09 デクセリアルズ株式会社 接合体の製造方法、接合体、及び導電粒子含有ホットメルト接着シート
KR102798129B1 (ko) * 2025-02-06 2025-04-22 주식회사 대림산업 기능성 우레탄 접착제 제조방법 및 이에 의해 제조된 우레탄 접착제

Family Cites Families (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3084117A (en) * 1961-04-04 1963-04-02 Union Oil Co Organoclay-polyolefin compositions
NL294566A (enExample) * 1962-06-26
NL295858A (enExample) * 1962-07-27
US3671190A (en) * 1970-11-10 1972-06-20 Laporte Industries Ltd Synthetic clay-like minerals of the smectite type and method of preparation
US3666407A (en) * 1971-01-28 1972-05-30 Pfizer Process for producing synthetic hectorite-type clays
US3855147A (en) * 1972-05-26 1974-12-17 Nl Industries Inc Synthetic smectite compositions, their preparation, and their use as thickeners in aqueous systems
US3852405A (en) * 1972-09-22 1974-12-03 Nl Industries Inc Laminar heavy metal aluminosilicates
US3844979A (en) * 1972-12-01 1974-10-29 Chevron Res Layered clay minerals, catalysts, and processes for using
US3844978A (en) * 1972-12-01 1974-10-29 Chevron Res Layered clay minerals and processes for using
US4606962A (en) * 1983-06-13 1986-08-19 Minnesota Mining And Manufacturing Company Electrically and thermally conductive adhesive transfer tape
US4698242A (en) * 1985-08-12 1987-10-06 National Starch And Chemical Corporation Thermoplastic elastic adhesive containing polyether block amides
US4695402A (en) * 1985-08-20 1987-09-22 Nl Chemicals, Inc. Organophilic clay gellants and process for preparation
JPH0623349B2 (ja) 1986-01-30 1994-03-30 富士高分子工業株式会社 異方導電性接着剤
US4740657A (en) * 1986-02-14 1988-04-26 Hitachi, Chemical Company, Ltd Anisotropic-electroconductive adhesive composition, method for connecting circuits using the same, and connected circuit structure thus obtained
DE3806548C2 (de) * 1987-03-04 1996-10-02 Toyoda Chuo Kenkyusho Kk Verbundmaterial und Verfahren zu dessen Herstellung
JPH02206670A (ja) 1989-02-06 1990-08-16 Hitachi Chem Co Ltd 異方導電性を有する回路接続用熱伝導性接着剤組成物及び熱伝導性接着フィルム
JPH03223380A (ja) 1990-01-30 1991-10-02 Oki Electric Ind Co Ltd 異方性導電接着剤
DE4122211A1 (de) * 1991-07-04 1993-01-21 Inventa Ag Thermoplastische formmassen aus semikristallinem und amorphem polyamid, deren verwendung und verfahren zu ihrer herstellung
DE69222773T2 (de) * 1991-08-12 1998-02-12 Allied Signal Inc Bildung polymerer nanokomposite aus blättrigem schichtmaterial durch ein schmelzverfahren
US5336647A (en) * 1991-11-14 1994-08-09 Rheox, Inc. Organoclay compositions prepared with a mixture of two organic cations and their use in non-aqueous systems
US5429999A (en) * 1991-11-14 1995-07-04 Rheox, Inc. Organoclay compositions containing two or more cations and one or more organic anions, their preparation and use in non-aqueous systems
WO1993011190A1 (en) 1991-11-26 1993-06-10 Allied-Signal Inc. Polymer nanocomposites formed by melt processing of a polymer and an exfoliated layered material derivatized with reactive organo silanes
US5244707A (en) * 1992-01-10 1993-09-14 Shores A Andrew Enclosure for electronic devices
AU6696494A (en) * 1993-11-03 1995-05-23 W.L. Gore & Associates, Inc. Electrically conductive adhesives
US5443876A (en) * 1993-12-30 1995-08-22 Minnesota Mining And Manufacturing Company Electrically conductive structured sheets
US5686703A (en) * 1994-12-16 1997-11-11 Minnesota Mining And Manufacturing Company Anisotropic, electrically conductive adhesive film
DE69615090T2 (de) 1995-06-05 2002-06-06 Kabushiki Kaisha Toyota Chuo Kenkyusho, Aichi Verbundtonmaterial und Verfahren zu seiner Herstellung, Mischungsmaterial und Verbundtonkautschuk, die es anwenden, und Verfahren zu ihrer Herstellung
US5760106A (en) * 1995-07-05 1998-06-02 Board Of Trustees Operating Michigan State University Sealant method of epoxy resin-clay composites
WO1997003143A1 (en) * 1995-07-10 1997-01-30 Minnesota Mining And Manufacturing Company Screen printable adhesive compositions
US5672400A (en) * 1995-12-21 1997-09-30 Minnesota Mining And Manufacturing Company Electronic assembly with semi-crystalline copolymer adhesive
US5780376A (en) 1996-02-23 1998-07-14 Southern Clay Products, Inc. Organoclay compositions
US5730791A (en) * 1997-02-26 1998-03-24 Tomah Products, Inc. Asphalt-base coating composition with novel hindered acid/amine salt surfactant
NL1006743C2 (nl) * 1997-08-08 1999-02-09 Tno Nanocomposiet-materiaal.
WO1999041299A1 (en) 1998-02-13 1999-08-19 Solutia Inc. Polymer nanocomposite composition
DE69910623T2 (de) 1998-12-07 2004-06-17 University Of South Carolina Research Foundation Polymer/ton nanokomposit und verfahren zu seiner herstellung
US6060230A (en) * 1998-12-18 2000-05-09 Eastman Kodak Company Imaging element comprising an electrically-conductive layer containing metal-containing particles and clay particles and a transparent magnetic recording layer
US6025119A (en) * 1998-12-18 2000-02-15 Eastman Kodak Company Antistatic layer for imaging element
US6767951B2 (en) * 2001-11-13 2004-07-27 Eastman Kodak Company Polyester nanocomposites

Similar Documents

Publication Publication Date Title
JP2004534129A5 (enExample)
AU711287B2 (en) Adhesive compositions and methods of use
JP3459012B2 (ja) 表面実装導電性接着剤
JP5833809B2 (ja) 異方性導電フィルム、接合体及び接続方法
KR101927474B1 (ko) 전기 전도성의 열 활성화되는 접착제 컴파운드
WO2009044732A1 (ja) 接着剤組成物及びこれを用いた回路接続材料、並びに、回路部材の接続方法及び回路接続体
CN103827236B (zh) 膜状各向异性导电粘合剂
MY132559A (en) Devices, compositions, and methods incorporating adhesives whose performance is enhanced by organophilic clay constituents
KR20180062243A (ko) 페이스트 재료와 이로부터 형성된 배선 부재 및 배선 부재를 포함하는 전자소자
KR20130106451A (ko) 이방성 도전 필름
CN1239654C (zh) 热固性粘合膜和基于其应用的粘合剂结构体
CN104059547A (zh) 各向异性导电粘结剂及使用该粘结剂的连接结构体的制备方法
KR101814848B1 (ko) 이방성 도전 재료 및 그 제조 방법, 그리고 실장체 및 그 제조 방법
TW200842180A (en) Semi thermosetting anisotropic conductive film composition
JP5672201B2 (ja) 異方性導電フィルム及び接続構造体の製造方法
CN103666363A (zh) 一种含有导电高分子的导电胶及其制备方法
Wang et al. Highly stretchable shape memory self-soldering conductive tape with reversible adhesion switched by temperature
JP2010251377A (ja) 電磁波吸収シート及びその製造方法
Yao et al. Granular ionogel particle inks for 3D printed tough and stretchable ionotronics
KR101552976B1 (ko) 전자기파 차폐 시트 및 그 제조 방법
CN101955736B (zh) 粘接剂组合物以及连接结构体
JP5539039B2 (ja) 異方性導電フィルム及びその製造方法
JP2002030223A (ja) 熱伝導性樹脂組成物
CN110391039A (zh) 异方性导电胶膜、显示面板及显示面板的制作方法
JP2007224228A5 (enExample)