JP5019434B2 - 粘着テープ - Google Patents
粘着テープ Download PDFInfo
- Publication number
- JP5019434B2 JP5019434B2 JP2007027480A JP2007027480A JP5019434B2 JP 5019434 B2 JP5019434 B2 JP 5019434B2 JP 2007027480 A JP2007027480 A JP 2007027480A JP 2007027480 A JP2007027480 A JP 2007027480A JP 5019434 B2 JP5019434 B2 JP 5019434B2
- Authority
- JP
- Japan
- Prior art keywords
- pressure
- sensitive adhesive
- clay mineral
- layered clay
- adhesive tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000002390 adhesive tape Substances 0.000 title claims description 40
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 79
- 239000002734 clay mineral Substances 0.000 claims description 74
- 239000000203 mixture Substances 0.000 claims description 46
- 239000000853 adhesive Substances 0.000 claims description 39
- 230000001070 adhesive effect Effects 0.000 claims description 39
- 239000010410 layer Substances 0.000 claims description 31
- 239000000178 monomer Substances 0.000 claims description 19
- 229920001296 polysiloxane Polymers 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 239000003522 acrylic cement Substances 0.000 claims description 5
- 239000010445 mica Substances 0.000 claims description 5
- 229910052618 mica group Inorganic materials 0.000 claims description 5
- 229910052500 inorganic mineral Inorganic materials 0.000 claims description 4
- 239000011707 mineral Substances 0.000 claims description 4
- 125000005233 alkylalcohol group Chemical group 0.000 claims description 3
- 229910021647 smectite Inorganic materials 0.000 claims description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 11
- -1 isooctyl group Chemical group 0.000 description 11
- 239000012790 adhesive layer Substances 0.000 description 10
- 239000007822 coupling agent Substances 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 229910052604 silicate mineral Inorganic materials 0.000 description 6
- 239000006185 dispersion Substances 0.000 description 5
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 4
- 125000004432 carbon atom Chemical group C* 0.000 description 4
- 150000001768 cations Chemical class 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
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- 125000000217 alkyl group Chemical group 0.000 description 3
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- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 2
- 239000005977 Ethylene Substances 0.000 description 2
- 229920000106 Liquid crystal polymer Polymers 0.000 description 2
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 2
- 239000004697 Polyetherimide Substances 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229940114077 acrylic acid Drugs 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 239000003093 cationic surfactant Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
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- 238000005342 ion exchange Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 150000004714 phosphonium salts Chemical group 0.000 description 2
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 2
- 229920002492 poly(sulfone) Polymers 0.000 description 2
- 229920001230 polyarylate Polymers 0.000 description 2
- 229920006267 polyester film Polymers 0.000 description 2
- 229920001601 polyetherimide Polymers 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 2
- 239000013464 silicone adhesive Substances 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- 229920003067 (meth)acrylic acid ester copolymer Polymers 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- MVYVKSBVZFBBPL-UHFFFAOYSA-N 2-(prop-2-enoylamino)propane-1-sulfonic acid Chemical compound OS(=O)(=O)CC(C)NC(=O)C=C MVYVKSBVZFBBPL-UHFFFAOYSA-N 0.000 description 1
- 125000000022 2-aminoethyl group Chemical group [H]C([*])([H])C([H])([H])N([H])[H] 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- DOYKFSOCSXVQAN-UHFFFAOYSA-N 3-[diethoxy(methyl)silyl]propyl 2-methylprop-2-enoate Chemical compound CCO[Si](C)(OCC)CCCOC(=O)C(C)=C DOYKFSOCSXVQAN-UHFFFAOYSA-N 0.000 description 1
- OXYZDRAJMHGSMW-UHFFFAOYSA-N 3-chloropropyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)CCCCl OXYZDRAJMHGSMW-UHFFFAOYSA-N 0.000 description 1
- URDOJQUSEUXVRP-UHFFFAOYSA-N 3-triethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CCO[Si](OCC)(OCC)CCCOC(=O)C(C)=C URDOJQUSEUXVRP-UHFFFAOYSA-N 0.000 description 1
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 229920002126 Acrylic acid copolymer Polymers 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- HEFNNWSXXWATRW-UHFFFAOYSA-N Ibuprofen Chemical compound CC(C)CC1=CC=C(C(C)C(O)=O)C=C1 HEFNNWSXXWATRW-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- 229920012266 Poly(ether sulfone) PES Polymers 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical group CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 229940048053 acrylate Drugs 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- 125000005907 alkyl ester group Chemical group 0.000 description 1
- 150000003863 ammonium salts Chemical class 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- LUKKCEVNUJBTRF-UHFFFAOYSA-N decyl(triphenyl)phosphanium Chemical class C=1C=CC=CC=1[P+](C=1C=CC=CC=1)(CCCCCCCCCC)C1=CC=CC=C1 LUKKCEVNUJBTRF-UHFFFAOYSA-N 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 description 1
- NDMVEPBCXVVMEN-UHFFFAOYSA-N dibenzyl(dioctadecyl)azanium Chemical class C=1C=CC=CC=1C[N+](CCCCCCCCCCCCCCCCCC)(CCCCCCCCCCCCCCCCCC)CC1=CC=CC=C1 NDMVEPBCXVVMEN-UHFFFAOYSA-N 0.000 description 1
- FAMDLVPKRRDPQV-UHFFFAOYSA-N dibenzyl(dioctadecyl)phosphanium Chemical class C=1C=CC=CC=1C[P+](CCCCCCCCCCCCCCCCCC)(CCCCCCCCCCCCCCCCCC)CC1=CC=CC=C1 FAMDLVPKRRDPQV-UHFFFAOYSA-N 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- OTARVPUIYXHRRB-UHFFFAOYSA-N diethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](C)(OCC)CCCOCC1CO1 OTARVPUIYXHRRB-UHFFFAOYSA-N 0.000 description 1
- OGQYPPBGSLZBEG-UHFFFAOYSA-N dimethyl(dioctadecyl)azanium Chemical class CCCCCCCCCCCCCCCCCC[N+](C)(C)CCCCCCCCCCCCCCCCCC OGQYPPBGSLZBEG-UHFFFAOYSA-N 0.000 description 1
- JKODDBUWSNWKJZ-UHFFFAOYSA-N dimethyl(dioctadecyl)phosphanium Chemical class CCCCCCCCCCCCCCCCCC[P+](C)(C)CCCCCCCCCCCCCCCCCC JKODDBUWSNWKJZ-UHFFFAOYSA-N 0.000 description 1
- MIQYOHNNWUEBSP-UHFFFAOYSA-N dodecyl(trimethyl)phosphanium Chemical class CCCCCCCCCCCC[P+](C)(C)C MIQYOHNNWUEBSP-UHFFFAOYSA-N 0.000 description 1
- VICYBMUVWHJEFT-UHFFFAOYSA-N dodecyltrimethylammonium ion Chemical class CCCCCCCCCCCC[N+](C)(C)C VICYBMUVWHJEFT-UHFFFAOYSA-N 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- WOXXJEVNDJOOLV-UHFFFAOYSA-N ethenyl-tris(2-methoxyethoxy)silane Chemical compound COCCO[Si](OCCOC)(OCCOC)C=C WOXXJEVNDJOOLV-UHFFFAOYSA-N 0.000 description 1
- 229920001038 ethylene copolymer Polymers 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000004299 exfoliation Methods 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
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- 150000004665 fatty acids Chemical class 0.000 description 1
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- 238000001879 gelation Methods 0.000 description 1
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- KWLMIXQRALPRBC-UHFFFAOYSA-L hectorite Chemical compound [Li+].[OH-].[OH-].[Na+].[Mg+2].O1[Si]2([O-])O[Si]1([O-])O[Si]([O-])(O1)O[Si]1([O-])O2 KWLMIXQRALPRBC-UHFFFAOYSA-L 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
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- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
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- 238000005259 measurement Methods 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- AZFQCTBZOPUVOW-UHFFFAOYSA-N methyl(triphenyl)phosphanium Chemical class C=1C=CC=CC=1[P+](C=1C=CC=CC=1)(C)C1=CC=CC=C1 AZFQCTBZOPUVOW-UHFFFAOYSA-N 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 229910052901 montmorillonite Inorganic materials 0.000 description 1
- XTAZYLNFDRKIHJ-UHFFFAOYSA-N n,n-dioctyloctan-1-amine Chemical class CCCCCCCCN(CCCCCCCC)CCCCCCCC XTAZYLNFDRKIHJ-UHFFFAOYSA-N 0.000 description 1
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
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- 125000005372 silanol group Chemical group 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- GQIUQDDJKHLHTB-UHFFFAOYSA-N trichloro(ethenyl)silane Chemical compound Cl[Si](Cl)(Cl)C=C GQIUQDDJKHLHTB-UHFFFAOYSA-N 0.000 description 1
- QQQSFSZALRVCSZ-UHFFFAOYSA-N triethoxysilane Chemical compound CCO[SiH](OCC)OCC QQQSFSZALRVCSZ-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- PDSVZUAJOIQXRK-UHFFFAOYSA-N trimethyl(octadecyl)azanium Chemical class CCCCCCCCCCCCCCCCCC[N+](C)(C)C PDSVZUAJOIQXRK-UHFFFAOYSA-N 0.000 description 1
- IKANSXQHJXBNIN-UHFFFAOYSA-N trimethyl(octadecyl)phosphanium Chemical class CCCCCCCCCCCCCCCCCC[P+](C)(C)C IKANSXQHJXBNIN-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000005050 vinyl trichlorosilane Substances 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/062—Copolymers with monomers not covered by C09J133/06
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/346—Clay
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2483/00—Presence of polysiloxane
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F2202/00—Materials and properties
- G02F2202/28—Adhesive materials or arrangements
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24174—Structurally defined web or sheet [e.g., overall dimension, etc.] including sheet or component perpendicular to plane of web or sheet
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Inorganic Chemistry (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Cleaning In General (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Laminated Bodies (AREA)
Description
粘着剤層の断面構造について、電子顕微鏡(SEM)にて観察を行い、層状粘土鉱物の粘着剤層中における配列状態を確認した。配列状態は基板シートに対する方向にて評価した。
ステンレス板に2kgのローラーを1往復させて、粘着テープを圧着し貼り合わせた。この試験片を、175℃で1時間放置した後、ステンレス板から90度の方向に粘着テープを引き剥がし、ステンレス板に粘着剤を残すことなく剥離可能かを調べた。
○:粘着剤を残すことなく良好に剥離できた。
×:粘着剤残りがあった。
層状粘土鉱物としてコープケミカル製ソマシフMAEを用いた。また、剥離手法としては吉田機械興業製ナノマイザーIIを用いて高圧せん断により層間剥離を行い、層状粘土鉱物分散液を作製した。
アクリル酸ブチル100部及びアクリル酸3部からなるモノマー混合液から得たアクリルポリマー100部に対して、ポリイソシアネート化合物(日本ポリウレタン工業製、商品名:コロネートL)2部、エポキシ系化合物(三菱瓦斯化学製、商品名:テトラッドC)0.6部を均一に混合して、アクリル系粘着剤溶液を調製した。
参考例2で調製したアクリル系粘着剤溶液のアクリルポリマー100部に対して、層状粘土鉱物が5部となるように参考例1で作製した層状粘土鉱物分散液を配合して十分に攪拌させ、粘着剤溶液(1)を作製した。
片面がシリコーン系離型剤にて処理されたポリエステルフィルム(三菱化学ポリエステルフィルム製、商品名:MRF50、厚み50μm、幅250mm)のシリコーン離型処理面に、上記粘着剤溶液(1)をコーティングして乾燥させ、粘着剤シート(1)を作製した。粘着剤シート(1)を離型フィルムより剥離し重ね合わせていき、積層シート(1)を作製した。積層シート(1)を90度反転させた後の粘着剤層の厚みが10μm、幅50mm、長さ200mmとなるように積層シート(1)を切断し、25μm厚のポリイミドフィルム(東レデュポン製、商品名:カプトン100H)上にラミネートして粘着剤層を形成し、さらにMRF50を貼り合せて、粘着テープ(1)を作製した。
得られた粘着テープ(1)について、層状粘土鉱物の配列状態、粘着剤残りを評価した。結果を表1に示す。
層状粘土鉱物を10部配合した以外は実施例1と同様に行い、粘着テープ(2)を作製した。
得られた粘着テープ(2)について、層状粘土鉱物の配列状態、粘着剤残りを評価した。結果を表1に示す。
層状粘土鉱物を20部配合した以外は実施例1と同様に行い、粘着テープ(3)を作製した。
得られた粘着テープ(3)について、層状粘土鉱物の配列状態、粘着剤残りを評価した。結果を表1に示す。
アクリル系粘着剤溶液の代わりにシリコーン系粘着剤(東レダウコーニング製、商品名:SD−4587)を用いた以外は実施例1と同様に行い、粘着テープ(4)を作製した。
得られた粘着テープ(4)について、層状粘土鉱物の配列状態、粘着剤残りを評価した。結果を表1に示す。
アクリル系粘着剤溶液の代わりにシリコーン系粘着剤(東レダウコーニング製、商品名:SD−4587)を用いた以外は実施例2と同様に行い、粘着テープ(5)を作製した。
得られた粘着テープ(5)について、層状粘土鉱物の配列状態、粘着剤残りを評価した。結果を表1に示す。
アクリル系粘着剤溶液の代わりにシリコーン系粘着剤(東レダウコーニング製、商品名:SD−4587)を用いた以外は実施例3と同様に行い、粘着テープ(6)を作製した。
得られた粘着テープ(6)について、層状粘土鉱物の配列状態、粘着剤残りを評価した。結果を表1に示す。
層状粘土鉱物を配合しなかった以外は実施例1と同様に行い、粘着テープ(C1)を作製した。
得られた粘着テープ(C1)について、層状粘土鉱物の配列状態、粘着剤残りを評価した。結果を表1に示す。
参考例2で調製したアクリル系粘着剤溶液のアクリルポリマー100部に対して、層状粘土鉱物が5部となるように参考例1で作製した層状粘土鉱物分散液を配合して十分に攪拌させ、粘着剤溶液(1)を作製した。
上記粘着剤溶液(1)を乾燥後の厚みが10μmとなるように25μm厚のポリイミドフィルム(東レデュポン製、商品名:カプトン100H)上にコーティングして乾燥させた。さらにMRF50を貼り合せ、粘着テープ(C2)を作製した。
得られた粘着テープ(C2)について、層状粘土鉱物の配列状態、粘着剤残りを評価した。結果を表1に示す。
層状粘土鉱物を10部配合した以外は比較例2と同様に行い、粘着テープ(C3)を作製した。
得られた粘着テープ(C3)について、層状粘土鉱物の配列状態、粘着剤残りを評価した。結果を表1に示す。
層状粘土鉱物を20部配合した以外は比較例2と同様に行い、粘着テープ(C4)を作製した。
得られた粘着テープ(C4)について、層状粘土鉱物の配列状態、粘着剤残りを評価した。結果を表1に示す。
20 粘着剤層
30 粘着剤組成物
40 親油性の層状粘土鉱物
100 粘着テープ
Claims (6)
- 粘着剤組成物と該粘着剤組成物中に分散した親油性の層状粘土鉱物を含む粘着剤層を基材シート上に有し、該層状粘土鉱物が該基材シートに対して実質的に垂直方向に配列している、粘着テープ。
- 前記層状粘土鉱物が、スメクタイト系粘度鉱物および/またはマイカ系粘度鉱物である、請求項1に記載の粘着テープ。
- 前記粘着剤組成物100重量部に対して、前記層状粘土鉱物が2〜20重量部含まれる、請求項1または2に記載の粘着テープ。
- 前記粘着剤組成物が、炭素数が4〜14個のアルキルアルコールの(メタ)アクリル酸アルキルエステルを主成分とするモノマー組成物から形成されるアクリル系粘着剤組成物である、請求項1から3までのいずれかに記載の粘着テープ。
- 前記粘着剤組成物が、シリコーン系粘着剤組成物である、請求項1から3までのいずれかに記載の粘着テープ。
- 電子部品製造に用いられる、請求項1から5までのいずれかに記載の粘着テープ。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007027480A JP5019434B2 (ja) | 2007-02-07 | 2007-02-07 | 粘着テープ |
PCT/JP2008/050985 WO2008096610A1 (ja) | 2007-02-07 | 2008-01-24 | 粘着テープ |
EP08703812A EP2110422A4 (en) | 2007-02-07 | 2008-01-24 | DUCT TAPE |
US12/526,126 US20100323151A1 (en) | 2007-02-07 | 2008-01-24 | Pressure-Sensitive Adhesive Tape |
TW097104288A TW200846438A (en) | 2007-02-07 | 2008-02-04 | Adhesive tape |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007027480A JP5019434B2 (ja) | 2007-02-07 | 2007-02-07 | 粘着テープ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008189857A JP2008189857A (ja) | 2008-08-21 |
JP5019434B2 true JP5019434B2 (ja) | 2012-09-05 |
Family
ID=39681521
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007027480A Expired - Fee Related JP5019434B2 (ja) | 2007-02-07 | 2007-02-07 | 粘着テープ |
Country Status (5)
Country | Link |
---|---|
US (1) | US20100323151A1 (ja) |
EP (1) | EP2110422A4 (ja) |
JP (1) | JP5019434B2 (ja) |
TW (1) | TW200846438A (ja) |
WO (1) | WO2008096610A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10825711B2 (en) | 2015-10-05 | 2020-11-03 | Lintec Corporation | Sheet for semiconductor processing |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101816332B1 (ko) * | 2013-06-28 | 2018-01-08 | 주식회사 엘지화학 | 광학용 점착 필름, 광학용 점착 필름의 제조 방법 및 이를 포함하는 터치 스크린 패널 |
JP2020184612A (ja) * | 2019-04-26 | 2020-11-12 | 積水化学工業株式会社 | 粘着テープ |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AU615730B2 (en) * | 1988-04-07 | 1991-10-10 | Kanegafuchi Chemical Industry Co. Ltd. | Pressure-sensitive adhesive material |
JP3040705B2 (ja) * | 1995-12-20 | 2000-05-15 | 株式会社麗光 | 光拡散シート用樹脂微粒子および光拡散シート |
JP2002167557A (ja) * | 2000-12-01 | 2002-06-11 | Sekisui Chem Co Ltd | 粘着剤用組成物、粘着剤及び粘着シート |
JP2002249209A (ja) * | 2001-02-22 | 2002-09-03 | Tsubakimoto Chain Co | バーコード付きハンガーを利用した搬送システム |
JP2002294209A (ja) * | 2001-03-30 | 2002-10-09 | Sekisui Chem Co Ltd | 粘着剤組成物及びその製造方法、並びに粘着テープ |
US6617020B2 (en) * | 2001-04-04 | 2003-09-09 | 3M Innovative Properties Company | Hot melt processable pressure sensitive adhesive comprising organophilic clay plate-like particles, a method of making, and articles made therefrom |
US6884833B2 (en) * | 2001-06-29 | 2005-04-26 | 3M Innovative Properties Company | Devices, compositions, and methods incorporating adhesives whose performance is enhanced by organophilic clay constituents |
JP4213887B2 (ja) * | 2001-10-26 | 2009-01-21 | 日東電工株式会社 | 透明性粘着剤組成物とその粘着シート |
JP2003181967A (ja) * | 2001-12-14 | 2003-07-03 | Nitto Denko Corp | 剥離ライナーおよび剥離ライナー付感圧性接着シート |
JP3849978B2 (ja) * | 2002-06-10 | 2006-11-22 | 日東電工株式会社 | 半導体装置の製造方法及びこれに用いる耐熱性粘着テープ |
AU2003261899A1 (en) * | 2002-09-05 | 2004-04-08 | Fuji Electric Co., Ltd. | Adhesive sheet for testing microbe on solid body and kit |
US6958860B2 (en) * | 2002-10-07 | 2005-10-25 | Eastman Kodak Company | Voided polymer film containing layered particulates |
KR100668921B1 (ko) * | 2003-03-25 | 2007-01-12 | 세키스이가세이힝코교가부시키가이샤 | 실리카 피복 중합체 입자, 이의 제조 방법 및 이의 용도 |
JP4583749B2 (ja) | 2003-11-26 | 2010-11-17 | 日東電工株式会社 | 感圧性接着シート |
JP4248019B2 (ja) * | 2003-12-25 | 2009-04-02 | 日東電工株式会社 | 感圧性接着シート付き偏光板 |
JP2005344008A (ja) | 2004-06-03 | 2005-12-15 | Nitto Denko Corp | 剥離可能な感圧性接着シート |
JP4836166B2 (ja) * | 2004-12-10 | 2011-12-14 | 独立行政法人産業技術総合研究所 | 粘着粘土膜及びその使用方法 |
-
2007
- 2007-02-07 JP JP2007027480A patent/JP5019434B2/ja not_active Expired - Fee Related
-
2008
- 2008-01-24 US US12/526,126 patent/US20100323151A1/en not_active Abandoned
- 2008-01-24 WO PCT/JP2008/050985 patent/WO2008096610A1/ja active Application Filing
- 2008-01-24 EP EP08703812A patent/EP2110422A4/en not_active Withdrawn
- 2008-02-04 TW TW097104288A patent/TW200846438A/zh unknown
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10825711B2 (en) | 2015-10-05 | 2020-11-03 | Lintec Corporation | Sheet for semiconductor processing |
Also Published As
Publication number | Publication date |
---|---|
EP2110422A1 (en) | 2009-10-21 |
JP2008189857A (ja) | 2008-08-21 |
EP2110422A4 (en) | 2010-11-24 |
TW200846438A (en) | 2008-12-01 |
WO2008096610A1 (ja) | 2008-08-14 |
US20100323151A1 (en) | 2010-12-23 |
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