JP2004523649A5 - - Google Patents

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Publication number
JP2004523649A5
JP2004523649A5 JP2002554295A JP2002554295A JP2004523649A5 JP 2004523649 A5 JP2004523649 A5 JP 2004523649A5 JP 2002554295 A JP2002554295 A JP 2002554295A JP 2002554295 A JP2002554295 A JP 2002554295A JP 2004523649 A5 JP2004523649 A5 JP 2004523649A5
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JP
Japan
Prior art keywords
coating
component
boron nitride
yttria
composite
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JP2002554295A
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English (en)
Japanese (ja)
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JP2004523649A (ja
JP4634005B2 (ja
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Priority claimed from US09/749,924 external-priority patent/US6613442B2/en
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Publication of JP2004523649A publication Critical patent/JP2004523649A/ja
Publication of JP2004523649A5 publication Critical patent/JP2004523649A5/ja
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Publication of JP4634005B2 publication Critical patent/JP4634005B2/ja
Anticipated expiration legal-status Critical
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JP2002554295A 2000-12-29 2001-11-23 半導体処理装置の窒化ホウ素とイットリアとの複合材料の構成部品及びその製造方法 Expired - Fee Related JP4634005B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/749,924 US6613442B2 (en) 2000-12-29 2000-12-29 Boron nitride/yttria composite components of semiconductor processing equipment and method of manufacturing thereof
PCT/US2001/043836 WO2002053799A1 (en) 2000-12-29 2001-11-23 Boron nitride/yttria composite components of semiconductor processing equipment and method of manufacturing thereof

Publications (3)

Publication Number Publication Date
JP2004523649A JP2004523649A (ja) 2004-08-05
JP2004523649A5 true JP2004523649A5 (enExample) 2005-12-22
JP4634005B2 JP4634005B2 (ja) 2011-02-16

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JP2002554295A Expired - Fee Related JP4634005B2 (ja) 2000-12-29 2001-11-23 半導体処理装置の窒化ホウ素とイットリアとの複合材料の構成部品及びその製造方法

Country Status (7)

Country Link
US (2) US6613442B2 (enExample)
EP (1) EP1364075A1 (enExample)
JP (1) JP4634005B2 (enExample)
KR (1) KR100830068B1 (enExample)
CN (1) CN1484712B (enExample)
TW (1) TW533494B (enExample)
WO (1) WO2002053799A1 (enExample)

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