JP2004235647A - 積層キャリアを有するマルチチップ電子パッケージ及び該パッケージの組立体 - Google Patents
積層キャリアを有するマルチチップ電子パッケージ及び該パッケージの組立体 Download PDFInfo
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- JP2004235647A JP2004235647A JP2004021260A JP2004021260A JP2004235647A JP 2004235647 A JP2004235647 A JP 2004235647A JP 2004021260 A JP2004021260 A JP 2004021260A JP 2004021260 A JP2004021260 A JP 2004021260A JP 2004235647 A JP2004235647 A JP 2004235647A
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Abstract
【解決手段】有機積層チップキャリアは、複数の導電プレーンと誘電層とを含み、その底面で基礎を成す導電体にチップを結合させる。このキャリアは、半導体チップ間の高周波接続を確保する高速部分を含むことが可能であり、動作性能の強化のために、内部コンデンサ及び又は熱伝導部材を含むこともできる。
【選択図】図1
Description
「マルチチップ電子パッケージであって、
間隔を空けて内部に配置されてそれぞれの誘電材料層により分離された複数の導電プレーンを含む有機積層チップキャリアにして、その第一の表面上の複数の電気接点と、その第二の表面上の複数の導電体とを含み、前記電気接点の選択されたものが、前記導電体の選択されたものと電気的に結合される、チップキャリアと、
前記有機積層チップキャリアの前記第一の表面上に間隔を空けて配置され、前記導電体の前記選択されたものと結合されるように前記電気接点の選択されたものと電気的に結合される、複数の半導体チップと、を備えたパッケージ」
である。
「前記半導体チップの選択されたものが互いに電気的に結合されるように、前記電気接点の選択されたものが、前記電気接点の他の選択されたものに電気的に接続されること」
である。
「前記複数の半導体チップが、前記有機積層チップキャリアの前記第一の表面上で、ほぼ同一平面を成す方向に配位される」
ことである。
「前記複数の半導体チップが、前記有機積層チップキャリアの前記第一の表面に対して、それぞれほぼ垂直に配位される」
ことである。
「前記複数の半導体チップが、互いにほぼ平行である」
ことである。
「前記有機積層チップキャリアの前記第一の表面上に位置し、前記複数の半導体チップをほぼ取り囲む多量のカプセル材料を更に含む」
ことである。
「前記複数の半導体チップを熱的接触状態でほぼ覆って配置される熱吸収カバー部材を更に含む」
ことである。
「前記有機積層チップキャリアの前記第一の表面上に配置され、前記複数の半導体チップの周りに間隔を空けて配置される補強部材を更に含む」
ことである。
「前記複数の半導体チップを覆って配置され、前記半導体チップによりその動作中に生成される熱を除去する熱吸収部材を更に含む」
ことである。
「前記複数の半導体チップを覆って配置される熱吸収カバー部材を更に含み、前記熱吸収部材が、前記熱吸収カバー部材上に配置される」
ことである。
「前記有機積層チップキャリアが、その内部の熱伝導部材と、前記有機積層チップキャリアの前記第一の表面上で前記複数の半導体チップを前記電気接点に結合させる複数の半田要素とを含み、前記熱伝導層が、前記電気接点上の前記半田要素により形成される前記電気結合の障害を十分に防止するために、選択された厚さと熱膨張率とを有する」
ことである。
「前記熱伝導部材が、銅の第一の層と、鉄合金の第二の層と、銅の第三の層とを備える」
ことである。
「前記有機積層チップキャリアが、少なくとも一つの誘電層と少なくとも一つの導電プレーンを含み、前記導電プレーンが第一の周波数で信号を通すことが可能な信号線を含む第一の多層部分と、前記第一の多層部分に接合され、前記複数の半導体チップを結合させることに適応した第二の多層部分とを含み、前記第二の多層部分が、少なくとも一つの誘電層と少なくとも一つの導電信号プレーンとを含み、前記第二の多層部分の前記導電信号プレーンが、前記第一の周波数よりも高い周波数で信号を通すことが可能な信号線を含み、これにより、前記複数の半導体デバイス間の高速接続を提供する」
ことである。
「前記第二の多層部分が、導電プレーンと、前記導電プレーンの両側の第一及び第二の誘電層とを含み、導電信号プレーンの数が2であり、各導電信号プレーンが、信号を通すことが可能で、前記導電プレーンと向かい合う前記第一及び第二の誘電層のそれぞれの一つに配置されている前記信号線を含む」
ことである。
「前記第二の多層部分が、前記第一の誘電層上の前記導電信号プレーンの少なくとも一つの信号線を、前記第二の誘電層上の前記導電信号プレーンの少なくとも一つの前記信号線と相互接続する導電スルーホールを更に含む」
ことである。
「前記有機積層チップキャリアが、その中に内部コンデンサを含む」
ことである。
「マルチチップ電子パッケージ組立体であって、
複数の導電部材をその上に含む回路化基板と、
内部に間隔を空けて配置され、それぞれの誘電材料層により分離された複数の導電プレーンを含む有機積層チップキャリアにして、その第一の表面上の複数の電気接点と、その第二の表面上の複数の導電体とを含み、前記電気接点の選択されたものが前記導電体の選択されたものと電気的に結合される、チップキャリアと、
前記有機積層チップキャリアの前記第一の表面上に間隔を空けて配置され、前記導電体の前記選択されたものと結合されるように前記電気接点の選択されたものと電気的に結合される、複数の半導体チップと、
記有機積層チップキャリアの前記第二の表面上の前記導電体の前記選択されたものを、前記回路化基板上の前記導電部材のそれぞれのものに電気的に接続する複数の導電要素と、を含む組立体」
である。
「前記回路化基板が、プリント基板である」
ことである。
「前記複数の導電要素が、複数の半田部材を含む」
ことである。
「前記複数の半導体チップを、前記積層チップキャリアの前記第一の表面上の前記複数の電気接点のそれぞれのものと電気的に結合させる第一の複数の半田部材を更に含む」
ことである。
2 有機積層チップキャリア
3、3’ 半導体チップ
4 導電プレーン
5 誘電材料層
6 電気接点
7、7’、9 半田球
8 導電体
10 基礎回路基板
11 上部高速部、パッケージ
12 下部、半導体チップ
13 熱伝導部材
14 カプセル材料
15、17 熱吸収カバー部材
16、18 補強部材
19 上方処理システム
20、20’、20’’ 多層部分、第二の部分
21 中央導電プレーン
23 誘電材料
25、27導電プレーン
29 導電スルーホール
30、30’、30’’、30’’’ チップキャリア
31、31’ 第一の多層部分
33、35 外部導電層
41、43、51 誘電層、導電プレーン
45 開口部
55、61 導電材料
55’ 外部導電層
71、71’ メッキスルーホール
77 半導体チップ
79 半田球
81 誘電層
83 導電層
85 メッキスルーホール
91 導電スルーホール
93 ピン
95 延長開口部
101 幅広導電体
103 メッキスルーホール
105 幅広信号線
106 中間導電プレーン
Claims (20)
- マルチチップ電子パッケージであって、
間隔を空けて内部に配置されてそれぞれの誘電材料層により分離された複数の導電プレーンを含む有機積層チップキャリアにして、その第一の表面上の複数の電気接点と、その第二の表面上の複数の導電体とを含み、前記電気接点の選択されたものが、前記導電体の選択されたものと電気的に結合される、チップキャリアと、
前記有機積層チップキャリアの前記第一の表面上に間隔を空けて配置され、前記導電体の前記選択されたものと結合されるように前記電気接点の選択されたものと電気的に結合される、複数の半導体チップと、
を備えたパッケージ。 - 前記半導体チップの選択されたものが互いに電気的に結合されるように、前記電気接点の選択されたものが、前記電気接点の他の選択されたものに電気的に接続される、請求項1記載のパッケージ。
- 前記複数の半導体チップが、前記有機積層チップキャリアの前記第一の表面上で、ほぼ同一平面を成す方向に配位される、請求項1記載のパッケージ。
- 前記複数の半導体チップが、前記有機積層チップキャリアの前記第一の表面に対して、それぞれほぼ垂直に配位される、請求項1記載のパッケージ。
- 前記複数の半導体チップが、互いにほぼ平行である、請求項4記載のパッケージ。
- 前記有機積層チップキャリアの前記第一の表面上に位置し、前記複数の半導体チップをほぼ取り囲む多量のカプセル材料を更に含む、請求項1記載のパッケージ。
- 前記複数の半導体チップを熱的接触状態でほぼ覆って配置される熱吸収カバー部材を更に含む、請求項6記載のパッケージ。
- 前記有機積層チップキャリアの前記第一の表面上に配置され、前記複数の半導体チップの周りに間隔を空けて配置される補強部材を更に含む、請求項1記載のパッケージ。
- 前記複数の半導体チップを覆って配置され、前記半導体チップによりその動作中に生成される熱を除去する熱吸収部材を更に含む、請求項8記載のパッケージ。
- 前記複数の半導体チップを覆って配置される熱吸収カバー部材を更に含み、前記熱吸収部材が、前記熱吸収カバー部材上に配置される、請求項9記載のパッケージ。
- 前記有機積層チップキャリアが、その内部の熱伝導部材と、前記有機積層チップキャリアの前記第一の表面上で前記複数の半導体チップを前記電気接点に結合させる複数の半田要素とを含み、前記熱伝導層が、前記電気接点上の前記半田要素により形成される前記電気結合の障害を十分に防止するために、選択された厚さと熱膨張率とを有する、請求項1記載のパッケージ。
- 前記熱伝導部材が、銅の第一の層と、鉄合金の第二の層と、銅の第三の層とを備える、請求項11記載のパッケージ。
- 前記有機積層チップキャリアが、少なくとも一つの誘電層と少なくとも一つの導電プレーンを含み、前記導電プレーンが第一の周波数で信号を通すことが可能な信号線を含む第一の多層部分と、前記第一の多層部分に接合され、前記複数の半導体チップを結合させることに適応した第二の多層部分とを含み、前記第二の多層部分が、少なくとも一つの誘電層と少なくとも一つの導電信号プレーンとを含み、前記第二の多層部分の前記導電信号プレーンが、前記第一の周波数よりも高い周波数で信号を通すことが可能な信号線を含み、これにより、前記複数の半導体デバイス間の高速接続を提供する、請求項1記載のパッケージ。
- 前記第二の多層部分が、導電プレーンと、前記導電プレーンの両側の第一及び第二の誘電層とを含み、導電信号プレーンの数が2であり、各導電信号プレーンが、信号を通すことが可能で、前記導電プレーンと向かい合う前記第一及び第二の誘電層のそれぞれの一つに配置されている前記信号線を含む、請求項13記載のパッケージ。
- 前記第二の多層部分が、前記第一の誘電層上の前記導電信号プレーンの少なくとも一つの信号線を、前記第二の誘電層上の前記導電信号プレーンの少なくとも一つの前記信号線と相互接続する導電スルーホールを更に含む、請求項14記載のパッケージ。
- 前記有機積層チップキャリアが、その中に内部コンデンサを含む、請求項1記載のパッケージ。
- マルチチップ電子パッケージ組立体であって、
複数の導電部材をその上に含む回路化基板と、
内部に間隔を空けて配置され、それぞれの誘電材料層により分離された複数の導電プレーンを含む有機積層チップキャリアにして、その第一の表面上の複数の電気接点と、その第二の表面上の複数の導電体とを含み、前記電気接点の選択されたものが前記導電体の選択されたものと電気的に結合される、チップキャリアと、
前記有機積層チップキャリアの前記第一の表面上に間隔を空けて配置され、前記導電体の前記選択されたものと結合されるように前記電気接点の選択されたものと電気的に結合される、複数の半導体チップと、
記有機積層チップキャリアの前記第二の表面上の前記導電体の前記選択されたものを、前記回路化基板上の前記導電部材のそれぞれのものに電気的に接続する複数の導電要素と、を含む組立体。 - 前記回路化基板が、プリント基板である、請求項17記載の組立体。
- 前記複数の導電要素が、複数の半田部材を含む、請求項17記載の組立体。
- 前記複数の半導体チップを、前記積層チップキャリアの前記第一の表面上の前記複数の電気接点のそれぞれのものと電気的に結合させる第一の複数の半田部材を更に含む、請求項17記載の組立体。
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US8164920B2 (en) | 2005-06-13 | 2012-04-24 | Ibiden Co., Ltd. | Printed wiring board |
JP2010529665A (ja) * | 2007-06-07 | 2010-08-26 | コミサリア ア レネルジ アトミク | 再構成基板内への垂直コンポーネントの集積化 |
KR20170122184A (ko) * | 2015-03-03 | 2017-11-03 | 인텔 코포레이션 | 다층 스티프너를 포함하는 전자 패키지 |
KR102552894B1 (ko) * | 2015-03-03 | 2023-07-10 | 인텔 코포레이션 | 다층 스티프너를 포함하는 전자 패키지 |
KR20180083004A (ko) * | 2015-12-10 | 2018-07-19 | 테라다인 인코퍼레이티드 | 포켓 회로 보드 |
JP2018538693A (ja) * | 2015-12-10 | 2018-12-27 | テラダイン、 インコーポレイテッド | ポケット付き回路基板 |
JP7018015B2 (ja) | 2015-12-10 | 2022-02-09 | テラダイン、 インコーポレイテッド | 回路基板構造体と装置インターフェースボード |
KR102580492B1 (ko) * | 2015-12-10 | 2023-09-20 | 테라다인 인코퍼레이티드 | 포켓 회로 보드 |
Also Published As
Publication number | Publication date |
---|---|
US20040150095A1 (en) | 2004-08-05 |
TW200428628A (en) | 2004-12-16 |
TWI302735B (en) | 2008-11-01 |
EP1443560A2 (en) | 2004-08-04 |
CA2454971A1 (en) | 2004-07-30 |
JP2011139083A (ja) | 2011-07-14 |
TWI267180B (en) | 2006-11-21 |
TW200503228A (en) | 2005-01-16 |
US20040150114A1 (en) | 2004-08-05 |
US7035113B2 (en) | 2006-04-25 |
EP1443560A3 (en) | 2008-01-02 |
US6992896B2 (en) | 2006-01-31 |
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