JP4908150B2 - 撮像装置の保持構造及び撮像装置 - Google Patents
撮像装置の保持構造及び撮像装置 Download PDFInfo
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- JP4908150B2 JP4908150B2 JP2006283956A JP2006283956A JP4908150B2 JP 4908150 B2 JP4908150 B2 JP 4908150B2 JP 2006283956 A JP2006283956 A JP 2006283956A JP 2006283956 A JP2006283956 A JP 2006283956A JP 4908150 B2 JP4908150 B2 JP 4908150B2
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- 238000003384 imaging method Methods 0.000 title claims description 126
- 239000000758 substrate Substances 0.000 claims description 14
- 230000001681 protective effect Effects 0.000 claims description 10
- 230000003287 optical effect Effects 0.000 claims description 8
- 230000005540 biological transmission Effects 0.000 claims description 5
- 230000002093 peripheral effect Effects 0.000 description 10
- 238000001444 catalytic combustion detection Methods 0.000 description 8
- 238000007689 inspection Methods 0.000 description 8
- 239000011521 glass Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- 238000001514 detection method Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000010030 laminating Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 239000000428 dust Substances 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 238000005245 sintering Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000005587 bubbling Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
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- 238000002834 transmittance Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
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- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Studio Devices (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
Description
Claims (8)
- 一方の面側から入射した光像を他方の面側の撮像部で撮像する撮像素子と、前記撮像素子の他方の面側に設けられた配線基板と、を有する撮像装置と、
前記撮像素子を囲むように、前記配線基板の側面に着脱自在に取り付けられ、前記配線基板を保持する保持部材と、を備え、
前記配線基板において対向する側面のそれぞれには、第1係合部が形成されており、
前記保持部材には、前記第1係合部と係合する第2係合部が形成されていることを特徴とする撮像装置の保持構造。 - 前記第1係合部は凹状であると共に前記第2係合部は凸状であり、
前記第1係合部と前記第2係合部とが嵌合することを特徴とする請求項1記載の撮像装置の保持構造。 - 前記第1係合部は、前記側面における長手方向の一端から他端に亘って延在することを特徴とする請求項1又は2記載の撮像装置の保持構造。
- 前記第1係合部は、前記側面における長手方向の一端から他端に亘って断続的に設けられていることを特徴とする請求項1又は2記載の撮像装置の保持構造。
- 前記配線基板は、複数の基板が積層されて成る積層体であることを特徴とする請求項1〜4の何れか一項記載の撮像装置の保持構造。
- 前記保持部材に取り付けられ、前記撮像素子の一方の面を覆う保護部材を備えることを特徴とする請求項1〜5の何れか一項記載の撮像装置の保持構造。
- 前記保護部材は、光透過領域を含むことを特徴とする請求項1〜6の何れか一項記載の撮像装置の保持構造。
- 着脱自在の保持部材によって保持される撮像装置であって、
一方の面側から入射した光像を他方の面側の撮像部で撮像する撮像素子と、
前記撮像素子の他方の面側に設けられた配線基板と、を備え、
前記配線基板において対向する側面のそれぞれには、前記保持部材と係合するための第1係合部が形成されていることを特徴とする撮像装置。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006283956A JP4908150B2 (ja) | 2006-10-18 | 2006-10-18 | 撮像装置の保持構造及び撮像装置 |
KR1020097001456A KR101369667B1 (ko) | 2006-10-18 | 2007-10-12 | 촬상장치의 유지구조 및 촬상장치 |
US12/445,630 US8947587B2 (en) | 2006-10-18 | 2007-10-12 | Imaging device holding structure and imaging device |
EP07829711A EP2086221B1 (en) | 2006-10-18 | 2007-10-12 | Imaging device holding structure and imaging device |
PCT/JP2007/069975 WO2008047717A1 (fr) | 2006-10-18 | 2007-10-12 | Structure de support de dispositif d'imagerie et dispositif d'imagerie |
CN2007800379887A CN101523892B (zh) | 2006-10-18 | 2007-10-12 | 摄影装置保持构造以及摄影装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006283956A JP4908150B2 (ja) | 2006-10-18 | 2006-10-18 | 撮像装置の保持構造及び撮像装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008103926A JP2008103926A (ja) | 2008-05-01 |
JP4908150B2 true JP4908150B2 (ja) | 2012-04-04 |
Family
ID=39313948
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006283956A Active JP4908150B2 (ja) | 2006-10-18 | 2006-10-18 | 撮像装置の保持構造及び撮像装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US8947587B2 (ja) |
EP (1) | EP2086221B1 (ja) |
JP (1) | JP4908150B2 (ja) |
KR (1) | KR101369667B1 (ja) |
CN (1) | CN101523892B (ja) |
WO (1) | WO2008047717A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6038733B2 (ja) * | 2013-06-18 | 2016-12-07 | 浜松ホトニクス株式会社 | 放射線検出ユニットの製造方法 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06196680A (ja) | 1992-12-22 | 1994-07-15 | Hamamatsu Photonics Kk | 半導体エネルギー検出器とその製造方法 |
JP4588837B2 (ja) * | 2000-04-11 | 2010-12-01 | 浜松ホトニクス株式会社 | 半導体受光装置 |
TW548479B (en) * | 2001-02-27 | 2003-08-21 | Matsushita Electric Ind Co Ltd | Display device, display panel for the device, and the manufacturing method thereof |
US6825540B2 (en) * | 2001-12-05 | 2004-11-30 | Matsushita Electric Industrial Co., Ltd. | Miniaturized, resin-sealed solid state imaging apparatus |
US7035113B2 (en) * | 2003-01-30 | 2006-04-25 | Endicott Interconnect Technologies, Inc. | Multi-chip electronic package having laminate carrier and method of making same |
JP4373695B2 (ja) * | 2003-04-16 | 2009-11-25 | 浜松ホトニクス株式会社 | 裏面照射型光検出装置の製造方法 |
JP4351012B2 (ja) | 2003-09-25 | 2009-10-28 | 浜松ホトニクス株式会社 | 半導体装置 |
JP4280990B2 (ja) * | 2003-12-19 | 2009-06-17 | ソニー株式会社 | 撮像装置 |
US6943425B2 (en) * | 2004-01-23 | 2005-09-13 | Intevac, Inc. | Wavelength extension for backthinned silicon image arrays |
JP4236594B2 (ja) * | 2004-01-27 | 2009-03-11 | シャープ株式会社 | 光学装置用モジュール及び光学装置用モジュールの製造方法 |
CN1674262A (zh) * | 2004-03-25 | 2005-09-28 | 郑明德 | 影像感测器及其封装方法 |
JP4379295B2 (ja) | 2004-10-26 | 2009-12-09 | ソニー株式会社 | 半導体イメージセンサー・モジュール及びその製造方法 |
KR100674833B1 (ko) * | 2005-02-16 | 2007-01-26 | 삼성전기주식회사 | 카메라 모듈 |
US8064146B2 (en) * | 2006-07-28 | 2011-11-22 | Sony Corporation | Image pickup apparatus |
-
2006
- 2006-10-18 JP JP2006283956A patent/JP4908150B2/ja active Active
-
2007
- 2007-10-12 US US12/445,630 patent/US8947587B2/en active Active
- 2007-10-12 CN CN2007800379887A patent/CN101523892B/zh active Active
- 2007-10-12 WO PCT/JP2007/069975 patent/WO2008047717A1/ja active Application Filing
- 2007-10-12 EP EP07829711A patent/EP2086221B1/en active Active
- 2007-10-12 KR KR1020097001456A patent/KR101369667B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
KR20090065506A (ko) | 2009-06-22 |
KR101369667B1 (ko) | 2014-03-04 |
US20100188564A1 (en) | 2010-07-29 |
EP2086221A1 (en) | 2009-08-05 |
WO2008047717A1 (fr) | 2008-04-24 |
US8947587B2 (en) | 2015-02-03 |
EP2086221B1 (en) | 2012-12-05 |
CN101523892A (zh) | 2009-09-02 |
EP2086221A4 (en) | 2011-11-16 |
CN101523892B (zh) | 2011-10-12 |
JP2008103926A (ja) | 2008-05-01 |
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