JP2004031520A5 - - Google Patents
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- Publication number
- JP2004031520A5 JP2004031520A5 JP2002183471A JP2002183471A JP2004031520A5 JP 2004031520 A5 JP2004031520 A5 JP 2004031520A5 JP 2002183471 A JP2002183471 A JP 2002183471A JP 2002183471 A JP2002183471 A JP 2002183471A JP 2004031520 A5 JP2004031520 A5 JP 2004031520A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- inductor
- integrated circuit
- semiconductor integrated
- circuit according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims 36
- 230000005294 ferromagnetic effect Effects 0.000 claims 30
- 239000000758 substrate Substances 0.000 claims 24
- 229910052751 metal Inorganic materials 0.000 claims 23
- 239000002184 metal Substances 0.000 claims 23
- 239000012212 insulator Substances 0.000 claims 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 4
- 238000004519 manufacturing process Methods 0.000 claims 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 2
- 229910052782 aluminium Inorganic materials 0.000 claims 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 2
- 230000004888 barrier function Effects 0.000 claims 2
- 229910052802 copper Inorganic materials 0.000 claims 2
- 239000010949 copper Substances 0.000 claims 2
- 238000000034 method Methods 0.000 claims 2
- 229910052759 nickel Inorganic materials 0.000 claims 2
- 238000000059 patterning Methods 0.000 claims 2
- 238000009792 diffusion process Methods 0.000 claims 1
- 239000003302 ferromagnetic material Substances 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002183471A JP3745316B2 (ja) | 2002-06-24 | 2002-06-24 | 半導体集積回路及びその製造方法 |
| TW092115175A TWI224854B (en) | 2002-06-24 | 2003-06-05 | Semiconductor integrated circuit and method of manufacturing the same |
| US10/600,104 US7053165B2 (en) | 2002-06-24 | 2003-06-20 | Semiconductor integrated circuit including an inductor and method of manufacturing the same |
| FR0350243A FR2841381B1 (fr) | 2002-06-24 | 2003-06-23 | Circuit integre a semi-conducteur et un procede de fabrication du circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002183471A JP3745316B2 (ja) | 2002-06-24 | 2002-06-24 | 半導体集積回路及びその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004031520A JP2004031520A (ja) | 2004-01-29 |
| JP2004031520A5 true JP2004031520A5 (enExample) | 2005-09-29 |
| JP3745316B2 JP3745316B2 (ja) | 2006-02-15 |
Family
ID=29720212
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002183471A Expired - Fee Related JP3745316B2 (ja) | 2002-06-24 | 2002-06-24 | 半導体集積回路及びその製造方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US7053165B2 (enExample) |
| JP (1) | JP3745316B2 (enExample) |
| FR (1) | FR2841381B1 (enExample) |
| TW (1) | TWI224854B (enExample) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7259639B2 (en) | 2002-03-29 | 2007-08-21 | M/A-Com Eurotec, B.V. | Inductor topologies and decoupling structures for filters used in broadband applications, and design methodology thereof |
| US6856003B2 (en) * | 2002-09-05 | 2005-02-15 | Industrial Technology Research Institute | Microelectronic 3-D solenoid of circular cross-section and method for fabrication |
| US7126443B2 (en) * | 2003-03-28 | 2006-10-24 | M/A-Com, Eurotec, B.V. | Increasing performance of planar inductors used in broadband applications |
| JP4464127B2 (ja) * | 2003-12-22 | 2010-05-19 | Ｎｅｃエレクトロニクス株式会社 | 半導体集積回路及びその製造方法 |
| JP4291164B2 (ja) * | 2004-01-08 | 2009-07-08 | 富士通メディアデバイス株式会社 | 弾性表面波装置 |
| US7410894B2 (en) * | 2005-07-27 | 2008-08-12 | International Business Machines Corporation | Post last wiring level inductor using patterned plate process |
| CA2663586C (en) | 2006-09-14 | 2014-10-28 | Circulite, Inc | Intravascular blood pump and catheter |
| US20080186123A1 (en) * | 2007-02-07 | 2008-08-07 | Industrial Technology Research Institute | Inductor devices |
| KR100946753B1 (ko) * | 2007-10-18 | 2010-03-11 | 엘아이지넥스원 주식회사 | 수중 음향센서 |
| US20090140383A1 (en) * | 2007-11-29 | 2009-06-04 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method of creating spiral inductor having high q value |
| US9269485B2 (en) * | 2007-11-29 | 2016-02-23 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method of creating spiral inductor having high Q value |
| US7666688B2 (en) * | 2008-01-25 | 2010-02-23 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method of manufacturing a coil inductor |
| JP2010160142A (ja) | 2008-12-09 | 2010-07-22 | Renesas Electronics Corp | 信号送受信方法、半導体装置の製造方法、半導体装置、およびテスタ装置 |
| EP2337063B1 (en) * | 2009-12-17 | 2013-10-23 | Nxp B.V. | On chip integrated inductor and manufacturing method therefor |
| TWI499011B (zh) * | 2011-02-10 | 2015-09-01 | 國立清華大學 | 封裝結構及其製作方法 |
| DE102011016159B3 (de) * | 2011-04-05 | 2012-10-18 | Micronas Gmbh | Anordnung aus einem integrierten passiven Bauelement und einem auf einem Metallträger angeordneten Halbleiterkörper |
| US9219106B2 (en) * | 2011-08-05 | 2015-12-22 | Taiwan Semiconductor Manufacturing Company, Ltd. | Integrated inductor |
| CN102569032B (zh) * | 2012-01-16 | 2014-05-28 | 中国科学院上海微系统与信息技术研究所 | 多层金属化薄膜叠加制作电感元件的方法 |
| JP2012209278A (ja) * | 2012-08-03 | 2012-10-25 | Toshiba Lighting & Technology Corp | 点灯回路および照明装置 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2072277A1 (en) * | 1991-07-03 | 1993-01-04 | Nobuo Shiga | Inductance element |
| US5738931A (en) | 1994-09-16 | 1998-04-14 | Kabushiki Kaisha Toshiba | Electronic device and magnetic device |
| TW362222B (en) * | 1995-11-27 | 1999-06-21 | Matsushita Electric Industrial Co Ltd | Coiled component and its production method |
| US6492705B1 (en) | 1996-06-04 | 2002-12-10 | Intersil Corporation | Integrated circuit air bridge structures and methods of fabricating same |
| US5793272A (en) * | 1996-08-23 | 1998-08-11 | International Business Machines Corporation | Integrated circuit toroidal inductor |
| JP3661380B2 (ja) | 1997-12-12 | 2005-06-15 | 富士電機デバイステクノロジー株式会社 | 平面型インダクタ |
| JP4200631B2 (ja) | 2000-03-29 | 2008-12-24 | 沖電気工業株式会社 | オンチップ・コイルとその製造方法 |
| JP2002043520A (ja) * | 2000-07-19 | 2002-02-08 | Sony Corp | 半導体装置及びその製造方法 |
| FR2813987B1 (fr) * | 2000-09-12 | 2003-01-10 | Memscap | Microcomposant du type micro-inductance ou micro-transformateur |
| JP2002123915A (ja) | 2000-10-16 | 2002-04-26 | Alps Electric Co Ltd | スピンバルブ型薄膜磁気素子及び薄膜磁気ヘッド及び浮上式磁気ヘッド並びにスピンバルブ型薄膜磁気素子の製造方法 |
| US6752447B2 (en) | 2000-12-19 | 2004-06-22 | Bombardier Recreational Products Inc. | Windshield assembly for an all terrain vehicle |
| US6593838B2 (en) * | 2000-12-19 | 2003-07-15 | Atheros Communications Inc. | Planar inductor with segmented conductive plane |
-
2002
- 2002-06-24 JP JP2002183471A patent/JP3745316B2/ja not_active Expired - Fee Related
-
2003
- 2003-06-05 TW TW092115175A patent/TWI224854B/zh not_active IP Right Cessation
- 2003-06-20 US US10/600,104 patent/US7053165B2/en not_active Expired - Lifetime
- 2003-06-23 FR FR0350243A patent/FR2841381B1/fr not_active Expired - Fee Related
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