TWI224854B - Semiconductor integrated circuit and method of manufacturing the same - Google Patents

Semiconductor integrated circuit and method of manufacturing the same Download PDF

Info

Publication number
TWI224854B
TWI224854B TW092115175A TW92115175A TWI224854B TW I224854 B TWI224854 B TW I224854B TW 092115175 A TW092115175 A TW 092115175A TW 92115175 A TW92115175 A TW 92115175A TW I224854 B TWI224854 B TW I224854B
Authority
TW
Taiwan
Prior art keywords
layer
inductor
ferromagnetic material
semiconductor integrated
integrated circuit
Prior art date
Application number
TW092115175A
Other languages
English (en)
Chinese (zh)
Other versions
TW200405547A (en
Inventor
Masayuki Furumiya
Ryota Yamamoto
Original Assignee
Nec Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nec Electronics Corp filed Critical Nec Electronics Corp
Publication of TW200405547A publication Critical patent/TW200405547A/zh
Application granted granted Critical
Publication of TWI224854B publication Critical patent/TWI224854B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/20—Inductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5227—Inductive arrangements or effects of, or between, wiring layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/34—Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041—Printed circuit coils
    • H01F41/046—Printed circuit coils structurally combined with ferromagnetic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
TW092115175A 2002-06-24 2003-06-05 Semiconductor integrated circuit and method of manufacturing the same TWI224854B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002183471A JP3745316B2 (ja) 2002-06-24 2002-06-24 半導体集積回路及びその製造方法

Publications (2)

Publication Number Publication Date
TW200405547A TW200405547A (en) 2004-04-01
TWI224854B true TWI224854B (en) 2004-12-01

Family

ID=29720212

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092115175A TWI224854B (en) 2002-06-24 2003-06-05 Semiconductor integrated circuit and method of manufacturing the same

Country Status (4)

Country Link
US (1) US7053165B2 (enExample)
JP (1) JP3745316B2 (enExample)
FR (1) FR2841381B1 (enExample)
TW (1) TWI224854B (enExample)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7259639B2 (en) 2002-03-29 2007-08-21 M/A-Com Eurotec, B.V. Inductor topologies and decoupling structures for filters used in broadband applications, and design methodology thereof
US6856003B2 (en) * 2002-09-05 2005-02-15 Industrial Technology Research Institute Microelectronic 3-D solenoid of circular cross-section and method for fabrication
US7126443B2 (en) * 2003-03-28 2006-10-24 M/A-Com, Eurotec, B.V. Increasing performance of planar inductors used in broadband applications
JP4464127B2 (ja) * 2003-12-22 2010-05-19 Ｎｅｃエレクトロニクス株式会社 半導体集積回路及びその製造方法
JP4291164B2 (ja) * 2004-01-08 2009-07-08 富士通メディアデバイス株式会社 弾性表面波装置
US7410894B2 (en) * 2005-07-27 2008-08-12 International Business Machines Corporation Post last wiring level inductor using patterned plate process
JP5457182B2 (ja) 2006-09-14 2014-04-02 サーキュライト・インコーポレーテッド 血管内血液ポンプおよびカテーテル
US20080186123A1 (en) * 2007-02-07 2008-08-07 Industrial Technology Research Institute Inductor devices
KR100946753B1 (ko) * 2007-10-18 2010-03-11 엘아이지넥스원 주식회사 수중 음향센서
US20090140383A1 (en) * 2007-11-29 2009-06-04 Taiwan Semiconductor Manufacturing Co., Ltd. Method of creating spiral inductor having high q value
US9269485B2 (en) * 2007-11-29 2016-02-23 Taiwan Semiconductor Manufacturing Co., Ltd. Method of creating spiral inductor having high Q value
US7666688B2 (en) * 2008-01-25 2010-02-23 Taiwan Semiconductor Manufacturing Co., Ltd. Method of manufacturing a coil inductor
JP2010160142A (ja) * 2008-12-09 2010-07-22 Renesas Electronics Corp 信号送受信方法、半導体装置の製造方法、半導体装置、およびテスタ装置
EP2337063B1 (en) * 2009-12-17 2013-10-23 Nxp B.V. On chip integrated inductor and manufacturing method therefor
TWI499011B (zh) * 2011-02-10 2015-09-01 國立清華大學 封裝結構及其製作方法
DE102011016159B3 (de) * 2011-04-05 2012-10-18 Micronas Gmbh Anordnung aus einem integrierten passiven Bauelement und einem auf einem Metallträger angeordneten Halbleiterkörper
US9219106B2 (en) * 2011-08-05 2015-12-22 Taiwan Semiconductor Manufacturing Company, Ltd. Integrated inductor
CN102569032B (zh) * 2012-01-16 2014-05-28 中国科学院上海微系统与信息技术研究所 多层金属化薄膜叠加制作电感元件的方法
JP2012209278A (ja) * 2012-08-03 2012-10-25 Toshiba Lighting & Technology Corp 点灯回路および照明装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2072277A1 (en) * 1991-07-03 1993-01-04 Nobuo Shiga Inductance element
US5738931A (en) 1994-09-16 1998-04-14 Kabushiki Kaisha Toshiba Electronic device and magnetic device
TW362222B (en) 1995-11-27 1999-06-21 Matsushita Electric Industrial Co Ltd Coiled component and its production method
US6492705B1 (en) 1996-06-04 2002-12-10 Intersil Corporation Integrated circuit air bridge structures and methods of fabricating same
US5793272A (en) 1996-08-23 1998-08-11 International Business Machines Corporation Integrated circuit toroidal inductor
JP3661380B2 (ja) 1997-12-12 2005-06-15 富士電機デバイステクノロジー株式会社 平面型インダクタ
JP4200631B2 (ja) 2000-03-29 2008-12-24 沖電気工業株式会社 オンチップ・コイルとその製造方法
JP2002043520A (ja) 2000-07-19 2002-02-08 Sony Corp 半導体装置及びその製造方法
FR2813987B1 (fr) * 2000-09-12 2003-01-10 Memscap Microcomposant du type micro-inductance ou micro-transformateur
JP2002123915A (ja) 2000-10-16 2002-04-26 Alps Electric Co Ltd スピンバルブ型薄膜磁気素子及び薄膜磁気ヘッド及び浮上式磁気ヘッド並びにスピンバルブ型薄膜磁気素子の製造方法
CA2365560A1 (en) 2000-12-19 2002-06-19 Bombardier Inc. Windshield assembly for an all terrain vehicle
US6593838B2 (en) * 2000-12-19 2003-07-15 Atheros Communications Inc. Planar inductor with segmented conductive plane

Also Published As

Publication number Publication date
JP3745316B2 (ja) 2006-02-15
FR2841381B1 (fr) 2008-03-28
JP2004031520A (ja) 2004-01-29
US20040004266A1 (en) 2004-01-08
US7053165B2 (en) 2006-05-30
FR2841381A1 (fr) 2003-12-26
TW200405547A (en) 2004-04-01

Similar Documents

Publication Publication Date Title
TWI224854B (en) Semiconductor integrated circuit and method of manufacturing the same
TWI230435B (en) Inductor with high quality factor and method of fabricating the same
TWI351747B (en) High q factor integrated circuit inductor
US20140061920A1 (en) Semiconductor device
TWI249755B (en) Multilayered chip capacitor
JP2005175434A5 (enExample)
CN103311219B (zh) 用于后钝化互连的电感器
TW201243912A (en) Compact vertical inductors extending in vertical planes
TW200843062A (en) Semiconductor package having dimpled plate interconnections
US20100314714A1 (en) Integrated circuit device
TW200906260A (en) Circuit board structure and fabrication method thereof
CN107492437A (zh) 一种玻璃基高q值电感及其制备方法
WO2021247094A1 (en) Integrated inductor with a stacked metal wire
TW200400614A (en) Inductor for semiconductor integrated circuit and method of fabricating the same
JP2005501418A (ja) 並列分岐構造の螺旋形インダクタ
US8324097B2 (en) Method of forming a copper topped interconnect structure that has thin and thick copper traces
TW201528469A (zh) 多晶片疊合封裝結構及其製作方法
TW200418124A (en) Interconnection structure
TW201010550A (en) Printed circuit board and fabrication method thereof
CN106098661B (zh) 半导体组件及其制造方法
TW200901240A (en) Integrated inductor
CN104538383A (zh) 一种高效率的集成电感结构
TWI293186B (en) Active area bonding compatible high current structures
CN101106129A (zh) 具有高质量因素的集成电路螺旋电感
CN101271895B (zh) 半导体装置及其制造方法

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees