JP2004014094A - 半導体メモリ素子 - Google Patents
半導体メモリ素子 Download PDFInfo
- Publication number
- JP2004014094A JP2004014094A JP2003033112A JP2003033112A JP2004014094A JP 2004014094 A JP2004014094 A JP 2004014094A JP 2003033112 A JP2003033112 A JP 2003033112A JP 2003033112 A JP2003033112 A JP 2003033112A JP 2004014094 A JP2004014094 A JP 2004014094A
- Authority
- JP
- Japan
- Prior art keywords
- transistor
- semiconductor memory
- memory device
- source
- data line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
- G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
- G11C11/401—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
- G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
- G11C11/401—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
- G11C11/406—Management or control of the refreshing or charge-regeneration cycles
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
- G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
- G11C11/401—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
- G11C11/403—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells with charge regeneration common to a multiplicity of memory cells, i.e. external refresh
- G11C11/405—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells with charge regeneration common to a multiplicity of memory cells, i.e. external refresh with three charge-transfer gates, e.g. MOS transistors, per cell
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
- G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
- G11C11/401—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
- G11C11/4063—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing
- G11C11/407—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing for memory cells of the field-effect type
- G11C11/4076—Timing circuits
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/201—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates the substrates comprising an insulating layer on a semiconductor body, e.g. SOI
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2207/00—Indexing scheme relating to arrangements for writing information into, or reading information out from, a digital store
- G11C2207/22—Control and timing of internal memory operations
- G11C2207/2281—Timing of a read operation
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2207/00—Indexing scheme relating to arrangements for writing information into, or reading information out from, a digital store
- G11C2207/22—Control and timing of internal memory operations
- G11C2207/229—Timing of a write operation
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
- H10D89/10—Integrated device layouts
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Dram (AREA)
- Semiconductor Memories (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/167,754 US6787835B2 (en) | 2002-06-11 | 2002-06-11 | Semiconductor memories |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2004014094A true JP2004014094A (ja) | 2004-01-15 |
| JP2004014094A5 JP2004014094A5 (enExample) | 2006-03-23 |
Family
ID=29710907
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003033112A Pending JP2004014094A (ja) | 2002-06-11 | 2003-02-12 | 半導体メモリ素子 |
Country Status (4)
| Country | Link |
|---|---|
| US (3) | US6787835B2 (enExample) |
| JP (1) | JP2004014094A (enExample) |
| KR (1) | KR20030095182A (enExample) |
| TW (1) | TWI295105B (enExample) |
Cited By (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005243059A (ja) * | 2004-02-24 | 2005-09-08 | Renesas Technology Corp | 半導体集積回路 |
| JP2006012878A (ja) * | 2004-06-22 | 2006-01-12 | Renesas Technology Corp | 半導体記憶装置 |
| JP2007081335A (ja) * | 2005-09-16 | 2007-03-29 | Renesas Technology Corp | 半導体装置 |
| JP2008034007A (ja) * | 2006-07-27 | 2008-02-14 | Sony Corp | 半導体メモリデバイス |
| JP2011129892A (ja) * | 2009-11-20 | 2011-06-30 | Semiconductor Energy Lab Co Ltd | 半導体装置 |
| KR20110081983A (ko) * | 2008-09-19 | 2011-07-15 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| JP2011166128A (ja) * | 2010-01-15 | 2011-08-25 | Semiconductor Energy Lab Co Ltd | 半導体装置 |
| WO2011114905A1 (en) * | 2010-03-19 | 2011-09-22 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor memory device |
| JP2011187940A (ja) * | 2010-02-12 | 2011-09-22 | Semiconductor Energy Lab Co Ltd | 半導体装置および半導体装置の駆動方法 |
| JP2012119048A (ja) * | 2010-09-29 | 2012-06-21 | Semiconductor Energy Lab Co Ltd | 半導体メモリ装置およびその駆動方法 |
| JP2013009008A (ja) * | 2009-11-24 | 2013-01-10 | Semiconductor Energy Lab Co Ltd | 半導体装置 |
| US8357963B2 (en) | 2010-07-27 | 2013-01-22 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| JP2013058770A (ja) * | 2010-01-15 | 2013-03-28 | Semiconductor Energy Lab Co Ltd | 半導体装置 |
| US8411480B2 (en) | 2010-04-16 | 2013-04-02 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| US8472231B2 (en) | 2010-04-07 | 2013-06-25 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor memory device |
| JP2013128123A (ja) * | 2009-10-30 | 2013-06-27 | Semiconductor Energy Lab Co Ltd | 半導体装置 |
| US8598648B2 (en) | 2010-03-19 | 2013-12-03 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and driving method of semiconductor device |
| US8619470B2 (en) | 2010-06-23 | 2013-12-31 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor memory device with long data holding period |
| US8797785B2 (en) | 2010-11-12 | 2014-08-05 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| US8896042B2 (en) | 2009-10-30 | 2014-11-25 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device comprising oxide semiconductor |
| JP2015008302A (ja) * | 2009-12-25 | 2015-01-15 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| JP2016105483A (ja) * | 2010-12-28 | 2016-06-09 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| JP2016219851A (ja) * | 2016-09-27 | 2016-12-22 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| KR101763969B1 (ko) * | 2010-01-20 | 2017-08-01 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| JP2019165229A (ja) * | 2010-08-06 | 2019-09-26 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| JP2022097482A (ja) * | 2012-02-29 | 2022-06-30 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| JP2023015175A (ja) * | 2017-11-24 | 2023-01-31 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| JP2023139304A (ja) * | 2009-12-25 | 2023-10-03 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| JP2024019558A (ja) * | 2009-11-20 | 2024-02-09 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| JP2024177317A (ja) * | 2011-03-11 | 2024-12-19 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| JP2025020457A (ja) * | 2009-11-06 | 2025-02-12 | 株式会社半導体エネルギー研究所 | 半導体装置 |
Families Citing this family (56)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3955409B2 (ja) * | 1999-03-17 | 2007-08-08 | 株式会社ルネサステクノロジ | 半導体記憶装置 |
| GB0002958D0 (en) * | 2000-02-09 | 2000-03-29 | Cambridge Display Tech Ltd | Optoelectronic devices |
| US20050152899A1 (en) * | 2002-05-10 | 2005-07-14 | Kinch Michael S. | EphA2 agonistic monoclonal antibodies and methods of use thereof |
| US6787835B2 (en) * | 2002-06-11 | 2004-09-07 | Hitachi, Ltd. | Semiconductor memories |
| US6982897B2 (en) * | 2003-10-07 | 2006-01-03 | International Business Machines Corporation | Nondestructive read, two-switch, single-charge-storage device RAM devices |
| US7123500B2 (en) * | 2003-12-30 | 2006-10-17 | Intel Corporation | 1P1N 2T gain cell |
| JP4907117B2 (ja) * | 2004-08-30 | 2012-03-28 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| KR100673901B1 (ko) * | 2005-01-28 | 2007-01-25 | 주식회사 하이닉스반도체 | 저전압용 반도체 메모리 장치 |
| KR100742758B1 (ko) * | 2005-11-02 | 2007-07-26 | 경북대학교 산학협력단 | 플래시 메모리 소자 및 그 제조방법 |
| US7359265B2 (en) * | 2006-01-04 | 2008-04-15 | Etron Technology, Inc. | Data flow scheme for low power DRAM |
| US7821050B1 (en) * | 2006-07-31 | 2010-10-26 | Altera Corporation | CRAM transistors with high immunity to soft error |
| US7400525B1 (en) * | 2007-01-11 | 2008-07-15 | International Business Machines Corporation | Memory cell with independent-gate controlled access devices and memory using the cell |
| US7675799B2 (en) * | 2007-02-26 | 2010-03-09 | Infineon Technologies Ag | Method of operating a memory cell, memory cell and memory unit |
| US7929332B2 (en) * | 2007-06-29 | 2011-04-19 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor memory device and semiconductor device |
| JP5265898B2 (ja) * | 2007-09-25 | 2013-08-14 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| US8190810B2 (en) * | 2008-04-18 | 2012-05-29 | Silicon Motion, Inc. | Non-volatile memory apparatus and method for accessing a non-volatile memory apparatus |
| KR101566403B1 (ko) * | 2008-11-10 | 2015-11-13 | 삼성전자주식회사 | 반도체 소자의 동작 방법 |
| KR102321812B1 (ko) * | 2009-10-29 | 2021-11-03 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| US8780629B2 (en) | 2010-01-15 | 2014-07-15 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and driving method thereof |
| CN102714026B (zh) * | 2010-01-24 | 2016-09-14 | 株式会社半导体能源研究所 | 显示装置 |
| KR101822962B1 (ko) * | 2010-02-05 | 2018-01-31 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| KR101921618B1 (ko) * | 2010-02-05 | 2018-11-26 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 반도체 장치의 구동 방법 |
| WO2012002186A1 (en) | 2010-07-02 | 2012-01-05 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| US8735892B2 (en) | 2010-12-28 | 2014-05-27 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device using oxide semiconductor |
| US9048142B2 (en) | 2010-12-28 | 2015-06-02 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| US9153662B2 (en) | 2012-03-29 | 2015-10-06 | Taiwan Semiconductor Manufacturing Company, Ltd. | MOSFET with selective dopant deactivation underneath gate |
| JP6250955B2 (ja) | 2012-05-25 | 2017-12-20 | 株式会社半導体エネルギー研究所 | 半導体装置の駆動方法 |
| KR20140092537A (ko) | 2013-01-16 | 2014-07-24 | 삼성전자주식회사 | 메모리 셀 및 이를 포함하는 메모리 장치 |
| US9230852B2 (en) * | 2013-02-25 | 2016-01-05 | Texas Instruments Incorporated | Integrated circuit (IC) having electrically conductive corrosion protecting cap over bond pads |
| JP2014195243A (ja) | 2013-02-28 | 2014-10-09 | Semiconductor Energy Lab Co Ltd | 半導体装置 |
| US10840239B2 (en) * | 2014-08-26 | 2020-11-17 | Monolithic 3D Inc. | 3D semiconductor device and structure |
| US9612795B2 (en) | 2013-03-14 | 2017-04-04 | Semiconductor Energy Laboratory Co., Ltd. | Data processing device, data processing method, and computer program |
| JP6516978B2 (ja) | 2013-07-17 | 2019-05-22 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| JP2015084418A (ja) | 2013-09-23 | 2015-04-30 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| JP6570817B2 (ja) | 2013-09-23 | 2019-09-04 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| KR102168652B1 (ko) | 2013-12-16 | 2020-10-23 | 삼성전자주식회사 | 감지 증폭기, 그것을 포함하는 반도체 메모리 장치 및 그것의 읽기 방법 |
| US9349418B2 (en) | 2013-12-27 | 2016-05-24 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for driving the same |
| US9336863B2 (en) * | 2014-06-30 | 2016-05-10 | Qualcomm Incorporated | Dual write wordline memory cell |
| JP6689062B2 (ja) | 2014-12-10 | 2020-04-28 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| US9601162B1 (en) * | 2015-09-10 | 2017-03-21 | Taiwan Semiconductor Manufacturing Co., Ltd. | Memory devices with strap cells |
| US9773787B2 (en) | 2015-11-03 | 2017-09-26 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, memory device, electronic device, or method for driving the semiconductor device |
| US10008502B2 (en) | 2016-05-04 | 2018-06-26 | Semiconductor Energy Laboratory Co., Ltd. | Memory device |
| KR102458660B1 (ko) | 2016-08-03 | 2022-10-26 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 표시 장치 및 전자 기기 |
| US10614875B2 (en) | 2018-01-30 | 2020-04-07 | Micron Technology, Inc. | Logical operations using memory cells |
| US10958453B2 (en) * | 2018-07-03 | 2021-03-23 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method and apparatus for noise injection for PUF generator characterization |
| US10629601B2 (en) * | 2018-07-11 | 2020-04-21 | International Business Machines Corporation | Transistor and capacitor structures for analog memory neural network |
| US10755766B2 (en) | 2018-09-04 | 2020-08-25 | Micron Technology, Inc. | Performing logical operations using a logical operation component based on a rate at which a digit line is discharged |
| US11996133B2 (en) | 2019-06-21 | 2024-05-28 | Semiconductor Energy Laboratory Co., Ltd. | Memory circuit using oxide semiconductor |
| KR102628537B1 (ko) * | 2019-09-23 | 2024-01-24 | 에스케이하이닉스 시스템아이씨 주식회사 | 불휘발성 메모리 장치 및 리드 방법 |
| CN112002357B (zh) * | 2020-08-13 | 2023-09-26 | 长江存储科技有限责任公司 | 用于操作半导体器件的方法及半导体器件 |
| US20220254812A1 (en) * | 2020-11-12 | 2022-08-11 | Skyworks Solutions, Inc. | Front end integrated circuits incorporating differing silicon-on-insulator technologies |
| KR20220069717A (ko) * | 2020-11-20 | 2022-05-27 | 에스케이하이닉스 주식회사 | 휘발성 메모리 장치, 저장 장치 및 휘발성 메모리 장치의 동작 방법 |
| US11515250B2 (en) | 2021-02-03 | 2022-11-29 | Sandisk Technologies Llc | Three dimensional semiconductor device containing composite contact via structures and methods of making the same |
| WO2022239192A1 (ja) * | 2021-05-13 | 2022-11-17 | ユニサンティス エレクトロニクス シンガポール プライベート リミテッド | 半導体素子を用いたメモリ装置 |
| KR102766751B1 (ko) * | 2021-11-04 | 2025-02-13 | 가천대학교 산학협력단 | 두 개의 트랜지스터로 구성된 메모리 셀, 이를 이용한 시냅스 셀과 뉴런 모방 셀 및 그 동작방법 |
| US20240008239A1 (en) * | 2022-07-01 | 2024-01-04 | Intel Corporation | Stacked sram with shared wordline connection |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR950001424B1 (en) * | 1986-03-28 | 1995-02-24 | Hitachi Ltd | 3-transistor dynamic random access memory |
| KR0124393B1 (ko) * | 1994-03-18 | 1997-12-11 | 김주용 | 캐패시터 제조방법 |
| US5646903A (en) * | 1996-03-06 | 1997-07-08 | Xilinx, Inc. | Memory cell having a shared read/write line |
| DE69630944D1 (de) * | 1996-03-29 | 2004-01-15 | St Microelectronics Srl | Hochspannungsfester MOS-Transistor und Verfahren zur Herstellung |
| JPH104148A (ja) * | 1996-06-18 | 1998-01-06 | Fujitsu Ltd | 強誘電体メモリ |
| JP3955409B2 (ja) * | 1999-03-17 | 2007-08-08 | 株式会社ルネサステクノロジ | 半導体記憶装置 |
| US6787835B2 (en) * | 2002-06-11 | 2004-09-07 | Hitachi, Ltd. | Semiconductor memories |
-
2002
- 2002-06-11 US US10/167,754 patent/US6787835B2/en not_active Expired - Fee Related
- 2002-11-04 TW TW091132512A patent/TWI295105B/zh not_active IP Right Cessation
- 2002-12-26 KR KR1020020084256A patent/KR20030095182A/ko not_active Ceased
-
2003
- 2003-02-12 JP JP2003033112A patent/JP2004014094A/ja active Pending
-
2004
- 2004-03-02 US US10/790,183 patent/US6949782B2/en not_active Expired - Fee Related
-
2005
- 2005-06-20 US US11/155,780 patent/US20050237786A1/en not_active Abandoned
Cited By (73)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005243059A (ja) * | 2004-02-24 | 2005-09-08 | Renesas Technology Corp | 半導体集積回路 |
| JP2006012878A (ja) * | 2004-06-22 | 2006-01-12 | Renesas Technology Corp | 半導体記憶装置 |
| US8106449B2 (en) | 2005-09-16 | 2012-01-31 | Renesas Electronics Corporation | Semiconductor device |
| JP2007081335A (ja) * | 2005-09-16 | 2007-03-29 | Renesas Technology Corp | 半導体装置 |
| JP2008034007A (ja) * | 2006-07-27 | 2008-02-14 | Sony Corp | 半導体メモリデバイス |
| US9735163B2 (en) | 2008-09-19 | 2017-08-15 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
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Also Published As
| Publication number | Publication date |
|---|---|
| US20050237786A1 (en) | 2005-10-27 |
| US6949782B2 (en) | 2005-09-27 |
| TW200308077A (en) | 2003-12-16 |
| US20030227041A1 (en) | 2003-12-11 |
| KR20030095182A (ko) | 2003-12-18 |
| TWI295105B (en) | 2008-03-21 |
| US6787835B2 (en) | 2004-09-07 |
| US20040164326A1 (en) | 2004-08-26 |
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