JP2004006753A - 光半導体用パッケージ - Google Patents

光半導体用パッケージ Download PDF

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Publication number
JP2004006753A
JP2004006753A JP2003085357A JP2003085357A JP2004006753A JP 2004006753 A JP2004006753 A JP 2004006753A JP 2003085357 A JP2003085357 A JP 2003085357A JP 2003085357 A JP2003085357 A JP 2003085357A JP 2004006753 A JP2004006753 A JP 2004006753A
Authority
JP
Japan
Prior art keywords
light
optical semiconductor
semiconductor package
light emitting
emitting element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003085357A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004006753A5 (enExample
Inventor
Masahiko Igaki
井垣　正彦
Makoto Ogura
小倉　誠
Tadashi Kosaka
小坂　忠志
Akio Atsuta
熱田　暁生
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2003085357A priority Critical patent/JP2004006753A/ja
Priority to US10/406,943 priority patent/US7026654B2/en
Priority to EP03252143.7A priority patent/EP1351319B1/en
Publication of JP2004006753A publication Critical patent/JP2004006753A/ja
Publication of JP2004006753A5 publication Critical patent/JP2004006753A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/40—Optical elements or arrangements
    • H10F77/407—Optical elements or arrangements indirectly associated with the devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F55/00—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto
    • H10F55/20—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the electric light source controls the radiation-sensitive semiconductor devices, e.g. optocouplers
    • H10F55/25—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the electric light source controls the radiation-sensitive semiconductor devices, e.g. optocouplers wherein the radiation-sensitive devices and the electric light source are all semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Light Receiving Elements (AREA)
  • Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
  • Led Device Packages (AREA)
JP2003085357A 2002-04-05 2003-03-26 光半導体用パッケージ Pending JP2004006753A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2003085357A JP2004006753A (ja) 2002-04-05 2003-03-26 光半導体用パッケージ
US10/406,943 US7026654B2 (en) 2002-04-05 2003-04-03 Package for optical semiconductor
EP03252143.7A EP1351319B1 (en) 2002-04-05 2003-04-04 Package for optical semiconductor

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002103628 2002-04-05
JP2003085357A JP2004006753A (ja) 2002-04-05 2003-03-26 光半導体用パッケージ

Publications (2)

Publication Number Publication Date
JP2004006753A true JP2004006753A (ja) 2004-01-08
JP2004006753A5 JP2004006753A5 (enExample) 2006-05-11

Family

ID=28043873

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003085357A Pending JP2004006753A (ja) 2002-04-05 2003-03-26 光半導体用パッケージ

Country Status (3)

Country Link
US (1) US7026654B2 (enExample)
EP (1) EP1351319B1 (enExample)
JP (1) JP2004006753A (enExample)

Cited By (14)

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JP2006261302A (ja) * 2005-03-16 2006-09-28 Rohm Co Ltd 光通信モジュール
JP2008028025A (ja) * 2006-07-19 2008-02-07 Canon Inc 反射型センサ
KR100820627B1 (ko) * 2006-07-31 2008-04-10 한국 고덴시 주식회사 반사형 광센서 패키지 및 이의 제조 방법
US8035079B2 (en) 2007-04-10 2011-10-11 Olympus Corporation Optical encoder
JP2012160527A (ja) * 2011-01-31 2012-08-23 Hitachi Cable Ltd 光電変換モジュール及び光電変換モジュールの製造方法
JP2012216648A (ja) * 2011-03-31 2012-11-08 Seiko Instruments Inc 光学センサおよび光学センサの製造方法
JP2013070078A (ja) * 2012-11-21 2013-04-18 Canon Inc 反射型センサ
JP2016027657A (ja) * 2012-04-25 2016-02-18 京セラ株式会社 受発光素子モジュールおよびこれを用いたセンサ装置
JP6407502B1 (ja) * 2018-02-20 2018-10-17 三菱電機株式会社 アブソリュートエンコーダ
WO2019078161A1 (ja) * 2017-10-17 2019-04-25 株式会社デンソー 発受光装置の筐体
JP2020144037A (ja) * 2019-03-07 2020-09-10 ミツミ電機株式会社 光学モジュール及び光学式エンコーダ
WO2021010219A1 (ja) * 2019-07-16 2021-01-21 Ａｇｃ株式会社 透明センシングデバイス、合わせガラス、及び透明センシングデバイスの製造方法
JP2023155460A (ja) * 2018-01-29 2023-10-20 ローム株式会社 受発光装置
US12467782B2 (en) 2019-08-19 2025-11-11 Casio Computer Co., Ltd. Window member, method for manufacturing window member, and electronic device

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JP6445940B2 (ja) * 2015-08-03 2018-12-26 株式会社東芝 光結合装置
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CN107785357B (zh) * 2016-08-26 2025-04-08 意法半导体研发(深圳)有限公司 用于光学传感器封装体的防粘胶溢出帽盖
CN107799512B (zh) * 2017-11-28 2024-09-13 无锡豪帮高科股份有限公司 一种立体封装集成光耦电路的结构及其方法
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JP2006261302A (ja) * 2005-03-16 2006-09-28 Rohm Co Ltd 光通信モジュール
JP2008028025A (ja) * 2006-07-19 2008-02-07 Canon Inc 反射型センサ
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KR100820627B1 (ko) * 2006-07-31 2008-04-10 한국 고덴시 주식회사 반사형 광센서 패키지 및 이의 제조 방법
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JP2012160527A (ja) * 2011-01-31 2012-08-23 Hitachi Cable Ltd 光電変換モジュール及び光電変換モジュールの製造方法
JP2012216648A (ja) * 2011-03-31 2012-11-08 Seiko Instruments Inc 光学センサおよび光学センサの製造方法
US10121930B2 (en) 2012-04-25 2018-11-06 Kyocera Corporation Light receiving and emitting element module and sensor device using same
JP2016027657A (ja) * 2012-04-25 2016-02-18 京セラ株式会社 受発光素子モジュールおよびこれを用いたセンサ装置
US9627572B2 (en) 2012-04-25 2017-04-18 Kyocera Corporation Light receiving and emitting element module and sensor device using same
JP2013070078A (ja) * 2012-11-21 2013-04-18 Canon Inc 反射型センサ
WO2019078161A1 (ja) * 2017-10-17 2019-04-25 株式会社デンソー 発受光装置の筐体
JP2019075473A (ja) * 2017-10-17 2019-05-16 株式会社デンソー 発受光装置の筐体
JP7583132B2 (ja) 2018-01-29 2024-11-13 ローム株式会社 受発光装置
JP2023155460A (ja) * 2018-01-29 2023-10-20 ローム株式会社 受発光装置
CN110392820A (zh) * 2018-02-20 2019-10-29 三菱电机株式会社 绝对编码器
KR20190102172A (ko) * 2018-02-20 2019-09-03 미쓰비시덴키 가부시키가이샤 앱솔루트 인코더
KR102037786B1 (ko) * 2018-02-20 2019-10-29 미쓰비시덴키 가부시키가이샤 앱솔루트 인코더
CN110392820B (zh) * 2018-02-20 2020-05-01 三菱电机株式会社 绝对编码器
WO2019162998A1 (ja) * 2018-02-20 2019-08-29 三菱電機株式会社 アブソリュートエンコーダ
JP6407502B1 (ja) * 2018-02-20 2018-10-17 三菱電機株式会社 アブソリュートエンコーダ
JP2020144037A (ja) * 2019-03-07 2020-09-10 ミツミ電機株式会社 光学モジュール及び光学式エンコーダ
JP7206489B2 (ja) 2019-03-07 2023-01-18 ミツミ電機株式会社 光学モジュール及び光学式エンコーダ
WO2021010219A1 (ja) * 2019-07-16 2021-01-21 Ａｇｃ株式会社 透明センシングデバイス、合わせガラス、及び透明センシングデバイスの製造方法
US12467782B2 (en) 2019-08-19 2025-11-11 Casio Computer Co., Ltd. Window member, method for manufacturing window member, and electronic device

Also Published As

Publication number Publication date
EP1351319A3 (en) 2009-04-15
EP1351319A2 (en) 2003-10-08
EP1351319B1 (en) 2014-04-30
US20030189213A1 (en) 2003-10-09
US7026654B2 (en) 2006-04-11

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