JP2003321675A - 窒化物蛍光体及びその製造方法 - Google Patents

窒化物蛍光体及びその製造方法

Info

Publication number
JP2003321675A
JP2003321675A JP2002126566A JP2002126566A JP2003321675A JP 2003321675 A JP2003321675 A JP 2003321675A JP 2002126566 A JP2002126566 A JP 2002126566A JP 2002126566 A JP2002126566 A JP 2002126566A JP 2003321675 A JP2003321675 A JP 2003321675A
Authority
JP
Japan
Prior art keywords
light emitting
phosphor
emitting device
nitride phosphor
nitride
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002126566A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003321675A5 (enExample
Inventor
Hiroto Tamaoki
寛人 玉置
Masatoshi Kameshima
正敏 亀島
Masaru Takashima
優 高島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Chemical Industries Ltd
Original Assignee
Nichia Chemical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichia Chemical Industries Ltd filed Critical Nichia Chemical Industries Ltd
Priority to JP2002126566A priority Critical patent/JP2003321675A/ja
Priority to KR1020097013180A priority patent/KR100961342B1/ko
Priority to PCT/JP2003/003418 priority patent/WO2003080764A1/ja
Priority to SG2009037052A priority patent/SG173925A1/en
Priority to CA2447288A priority patent/CA2447288C/en
Priority to US10/478,598 priority patent/US7258816B2/en
Priority to SG200600830-4A priority patent/SG155768A1/en
Priority to EP03710450.2A priority patent/EP1433831B1/en
Priority to KR1020097013178A priority patent/KR100961322B1/ko
Priority to KR1020097013179A priority patent/KR100983193B1/ko
Priority to SG2009037094A priority patent/SG185827A1/en
Priority to CNB038004542A priority patent/CN100430456C/zh
Priority to KR1020037015150A priority patent/KR100961324B1/ko
Priority to AU2003221442A priority patent/AU2003221442A1/en
Priority to MYPI20030992 priority patent/MY148692A/en
Priority to TW092106347A priority patent/TWI258499B/zh
Publication of JP2003321675A publication Critical patent/JP2003321675A/ja
Publication of JP2003321675A5 publication Critical patent/JP2003321675A5/ja
Priority to US11/252,111 priority patent/US7297293B2/en
Priority to US11/905,720 priority patent/US7597823B2/en
Priority to US11/905,725 priority patent/US7556744B2/en
Priority to US12/453,535 priority patent/US7964113B2/en
Priority to US12/453,534 priority patent/US8058793B2/en
Priority to US12/453,587 priority patent/US8076847B2/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01037—Rubidium [Rb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01055—Cesium [Cs]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01066—Dysprosium [Dy]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01067—Holmium [Ho]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01068—Erbium [Er]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Luminescent Compositions (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
JP2002126566A 2002-03-22 2002-04-26 窒化物蛍光体及びその製造方法 Pending JP2003321675A (ja)

Priority Applications (22)

Application Number Priority Date Filing Date Title
JP2002126566A JP2003321675A (ja) 2002-04-26 2002-04-26 窒化物蛍光体及びその製造方法
KR1020037015150A KR100961324B1 (ko) 2002-03-22 2003-03-20 질화물 형광체와 그 제조 방법 및 발광 장치
CNB038004542A CN100430456C (zh) 2002-03-22 2003-03-20 氮化物荧光体,其制造方法及发光装置
SG2009037052A SG173925A1 (en) 2002-03-22 2003-03-20 Nitride phosphor and production process thereof, and light emitting device
CA2447288A CA2447288C (en) 2002-03-22 2003-03-20 Nitride phosphor and method for preparation thereof, and light emitting device
US10/478,598 US7258816B2 (en) 2002-03-22 2003-03-20 Nitride phosphor and method for preparation thereof, and light emitting device
SG200600830-4A SG155768A1 (en) 2002-03-22 2003-03-20 Nitride phosphor and production process thereof, and light emitting device
PCT/JP2003/003418 WO2003080764A1 (en) 2002-03-22 2003-03-20 Nitride phosphor and method for preparation thereof, and light emitting device
KR1020097013178A KR100961322B1 (ko) 2002-03-22 2003-03-20 질화물 형광체와 그 제조 방법 및 발광 장치
KR1020097013179A KR100983193B1 (ko) 2002-03-22 2003-03-20 질화물 형광체와 그 제조 방법 및 발광 장치
SG2009037094A SG185827A1 (en) 2002-03-22 2003-03-20 Nitride phosphor and production process thereof, and light emitting device
KR1020097013180A KR100961342B1 (ko) 2002-03-22 2003-03-20 질화물 형광체와 그 제조 방법 및 발광 장치
EP03710450.2A EP1433831B1 (en) 2002-03-22 2003-03-20 Nitride phosphor and method for preparation thereof, and light emitting device
AU2003221442A AU2003221442A1 (en) 2002-03-22 2003-03-20 Nitride phosphor and method for preparation thereof, and light emitting device
MYPI20030992 MY148692A (en) 2002-03-22 2003-03-21 Nitride phosphor and production process thereof, and light emitting device
TW092106347A TWI258499B (en) 2002-03-22 2003-03-21 Nitride phosphor and method for preparation thereof, and light emitting device
US11/252,111 US7297293B2 (en) 2002-03-22 2005-10-18 Nitride phosphor and production process thereof, and light emitting device
US11/905,720 US7597823B2 (en) 2002-03-22 2007-10-03 Nitride phosphor and production process thereof, and light emitting device
US11/905,725 US7556744B2 (en) 2002-03-22 2007-10-03 Nitride phosphor and production process thereof, and light emitting device
US12/453,535 US7964113B2 (en) 2002-03-22 2009-05-14 Nitride phosphor and production process thereof, and light emitting device
US12/453,534 US8058793B2 (en) 2002-03-22 2009-05-14 Nitride phosphor and production process thereof, and light emitting device
US12/453,587 US8076847B2 (en) 2002-03-22 2009-05-15 Nitride phosphor and production process thereof, and light emitting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002126566A JP2003321675A (ja) 2002-04-26 2002-04-26 窒化物蛍光体及びその製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2004312020A Division JP4009868B2 (ja) 2004-10-27 2004-10-27 窒化物蛍光体及びそれを用いた発光装置

Publications (2)

Publication Number Publication Date
JP2003321675A true JP2003321675A (ja) 2003-11-14
JP2003321675A5 JP2003321675A5 (enExample) 2005-07-07

Family

ID=29540943

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002126566A Pending JP2003321675A (ja) 2002-03-22 2002-04-26 窒化物蛍光体及びその製造方法

Country Status (1)

Country Link
JP (1) JP2003321675A (enExample)

Cited By (63)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005053041A1 (ja) * 2003-11-25 2005-06-09 Matsushita Electric Works, Ltd. 発光ダイオードチップを用いた発光装置
WO2005052087A1 (ja) 2003-11-26 2005-06-09 Independent Administrative Institution National Institute For Materials Science 蛍光体と蛍光体を用いた発光器具
JP2005166734A (ja) * 2003-11-28 2005-06-23 Matsushita Electric Works Ltd 発光装置
WO2005078811A1 (ja) * 2004-02-18 2005-08-25 National Institute For Materials Science 発光素子及び照明器具
JP2005259825A (ja) * 2004-03-09 2005-09-22 Mitsubishi Chemicals Corp 発光装置及びそれを用いた照明装置並びにディスプレイ
WO2005090517A1 (ja) 2004-03-22 2005-09-29 Fujikura Ltd. 発光デバイス及び照明装置
JP2005350649A (ja) * 2004-06-10 2005-12-22 Seoul Semiconductor Co Ltd 発光物質
WO2006006582A1 (ja) 2004-07-13 2006-01-19 Fujikura Ltd. 蛍光体及びその蛍光体を用いた電球色光を発する電球色光発光ダイオードランプ
JP2006156505A (ja) * 2004-11-25 2006-06-15 Koito Mfg Co Ltd 白色発光モジュールおよび車両用灯具
JP2006169526A (ja) * 2004-12-10 2006-06-29 Lumileds Lighting Us Llc 燐光変換発光装置
WO2006077740A1 (ja) * 2004-12-28 2006-07-27 Nichia Corporation 窒化物蛍光体及びその製造方法並びに窒化物蛍光体を用いた発光装置
WO2006093135A1 (ja) * 2005-02-28 2006-09-08 Denki Kagaku Kogyo Kabushiki Kaisha 蛍光体とその製造方法、及びそれを用いた発光素子
JP2006261512A (ja) * 2005-03-18 2006-09-28 Fujikura Ltd 発光デバイス及び照明装置
JP2006282872A (ja) * 2005-03-31 2006-10-19 Dowa Mining Co Ltd 窒化物蛍光体または酸窒化物蛍光体、及びその製造方法、並びに当該蛍光体を用いた発光装置
JP2006306981A (ja) * 2005-04-27 2006-11-09 Nichia Chem Ind Ltd 窒化物蛍光体及びそれを用いた発光装置
JP2006306982A (ja) * 2005-04-27 2006-11-09 Nichia Chem Ind Ltd 窒化物蛍光体及びそれを用いた発光装置
JP2006319373A (ja) * 2006-08-22 2006-11-24 National Institute For Materials Science 発光素子及び照明器具
JP2006321921A (ja) * 2005-05-19 2006-11-30 Denki Kagaku Kogyo Kk α型サイアロン蛍光体とそれを用いた照明器具
KR100658458B1 (ko) 2004-06-22 2006-12-15 한국에너지기술연구원 황적색 형광체, 이를 이용한 백색 ｌｅｄ소자 및 황적색ｌｅｄ 소자
JP2007103965A (ja) * 2006-12-27 2007-04-19 National Institute For Materials Science 発光素子を用いた照明装置
US7258816B2 (en) 2002-03-22 2007-08-21 Nichia Corporation Nitride phosphor and method for preparation thereof, and light emitting device
JP2008016861A (ja) * 2004-04-27 2008-01-24 Matsushita Electric Ind Co Ltd 発光装置
WO2008020541A1 (fr) 2006-08-14 2008-02-21 Fujikura Ltd. Dispositif électroluminescent et dispositif d'éclairage
US7391060B2 (en) 2004-04-27 2008-06-24 Matsushita Electric Industrial Co., Ltd. Phosphor composition and method for producing the same, and light-emitting device using the same
CN100416874C (zh) * 2003-11-25 2008-09-03 松下电工株式会社 采用发光二极管芯片的发光器件
EP2025734A3 (en) * 2004-06-10 2009-06-10 Seoul Semiconductor Co., Ltd. Light emitting device
US7713443B2 (en) 2005-01-27 2010-05-11 National Institute For Materials Science Phosphor production method
US7808012B2 (en) 2007-07-13 2010-10-05 Sharp Kabushiki Kaisha Group of phosphor particles for light-emitting device, light-emitting device and backlight for liquid crystal display
JP2010222587A (ja) * 2005-04-01 2010-10-07 Mitsubishi Chemicals Corp 蛍光体の製造方法
JP2010265463A (ja) * 2010-07-06 2010-11-25 Dowa Electronics Materials Co Ltd 窒化物蛍光体、窒化物蛍光体の製造方法、並びに上記窒化物蛍光体を用いた光源及びｌｅｄ
JP2011040779A (ja) * 2010-10-12 2011-02-24 Nichia Corp 発光装置、発光素子用蛍光体及びその製造方法
US7906041B2 (en) 2004-08-04 2011-03-15 Intematix Corporation Silicate-based green phosphors in red-green-blue (RGB) backlighting and white illumination systems
WO2011091839A1 (de) * 2010-01-29 2011-08-04 Merck Patent Gmbh Leuchtstoffe
EP2360225A1 (en) 2004-09-22 2011-08-24 National Institute for Materials Science Phosphor, production method thereof and light emitting instrument
WO2011105157A1 (ja) 2010-02-26 2011-09-01 シャープ株式会社 発光装置
US8071988B2 (en) 2004-05-06 2011-12-06 Seoul Semiconductor Co., Ltd. White light emitting device comprising a plurality of light emitting diodes with different peak emission wavelengths and a wavelength converter
US8134165B2 (en) 2007-08-28 2012-03-13 Seoul Semiconductor Co., Ltd. Light emitting device employing non-stoichiometric tetragonal alkaline earth silicate phosphors
US8137589B2 (en) 2007-08-22 2012-03-20 Seoul Semiconductor Co., Ltd. Non stoichiometric tetragonal copper alkaline earth silicate phosphors and method of preparing the same
US8188492B2 (en) 2006-08-29 2012-05-29 Seoul Semiconductor Co., Ltd. Light emitting device having plural light emitting diodes and at least one phosphor for emitting different wavelengths of light
US8206611B2 (en) 2005-05-24 2012-06-26 Mitsubishi Chemical Corporation Phosphor and use thereof
JP2012519943A (ja) * 2009-03-10 2012-08-30 オーシャンズ キング ライティング サイエンスアンドテクノロジー カンパニー リミテッド 白色光発光方法及び発光装置
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