WO2005090517A1 - 発光デバイス及び照明装置 - Google Patents
発光デバイス及び照明装置Info
- Publication number
- WO2005090517A1 WO2005090517A1 PCT/JP2005/004973 JP2005004973W WO2005090517A1 WO 2005090517 A1 WO2005090517 A1 WO 2005090517A1 JP 2005004973 W JP2005004973 W JP 2005004973W WO 2005090517 A1 WO2005090517 A1 WO 2005090517A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- light
- light emitting
- phosphor
- emitting device
- fluorescent substance
- Prior art date
Links
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 106
- 239000000126 substance Substances 0.000 claims abstract description 26
- 239000013078 crystal Substances 0.000 claims abstract description 11
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 7
- 238000002156 mixing Methods 0.000 claims abstract description 3
- 239000004065 semiconductor Substances 0.000 claims description 18
- 239000000463 material Substances 0.000 claims description 13
- 150000004767 nitrides Chemical class 0.000 claims description 12
- 238000000149 argon plasma sintering Methods 0.000 claims description 6
- 102100032047 Alsin Human genes 0.000 claims description 5
- 101710187109 Alsin Proteins 0.000 claims description 5
- 229910052710 silicon Inorganic materials 0.000 claims description 5
- 235000005811 Viola adunca Nutrition 0.000 claims description 4
- 240000009038 Viola odorata Species 0.000 claims description 4
- 235000013487 Viola odorata Nutrition 0.000 claims description 4
- 235000002254 Viola papilionacea Nutrition 0.000 claims description 4
- -1 nitride compound Chemical class 0.000 claims description 3
- HXQQNYSFSLBXQJ-UHFFFAOYSA-N COC1=C(NC(CO)C(O)=O)CC(O)(CO)CC1=NCC(O)=O Chemical compound COC1=C(NC(CO)C(O)=O)CC(O)(CO)CC1=NCC(O)=O HXQQNYSFSLBXQJ-UHFFFAOYSA-N 0.000 claims description 2
- 238000009877 rendering Methods 0.000 abstract description 16
- 229910052757 nitrogen Inorganic materials 0.000 abstract description 3
- 229910003564 SiAlON Inorganic materials 0.000 abstract 1
- 239000000843 powder Substances 0.000 description 26
- 239000011575 calcium Substances 0.000 description 20
- 229920005989 resin Polymers 0.000 description 17
- 239000011347 resin Substances 0.000 description 17
- 238000010586 diagram Methods 0.000 description 13
- 238000000295 emission spectrum Methods 0.000 description 11
- 230000007774 longterm Effects 0.000 description 11
- 239000000203 mixture Substances 0.000 description 11
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 8
- 238000005259 measurement Methods 0.000 description 8
- 229910052791 calcium Inorganic materials 0.000 description 7
- 238000000695 excitation spectrum Methods 0.000 description 7
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 5
- 229910052693 Europium Inorganic materials 0.000 description 5
- OGPBJKLSAFTDLK-UHFFFAOYSA-N europium atom Chemical compound [Eu] OGPBJKLSAFTDLK-UHFFFAOYSA-N 0.000 description 5
- 239000006104 solid solution Substances 0.000 description 5
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 4
- 229910052581 Si3N4 Inorganic materials 0.000 description 4
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 4
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 4
- 230000005284 excitation Effects 0.000 description 4
- 239000002994 raw material Substances 0.000 description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 4
- 238000005245 sintering Methods 0.000 description 4
- 229910052725 zinc Inorganic materials 0.000 description 4
- 230000005457 Black-body radiation Effects 0.000 description 3
- 229910052793 cadmium Inorganic materials 0.000 description 3
- 238000010304 firing Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000004570 mortar (masonry) Substances 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 2
- 229910052684 Cerium Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- PSBUJOCDKOWAGJ-UHFFFAOYSA-N azanylidyneeuropium Chemical compound [Eu]#N PSBUJOCDKOWAGJ-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 description 2
- ZMIGMASIKSOYAM-UHFFFAOYSA-N cerium Chemical compound [Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce] ZMIGMASIKSOYAM-UHFFFAOYSA-N 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 229910001940 europium oxide Inorganic materials 0.000 description 2
- AEBZCFFCDTZXHP-UHFFFAOYSA-N europium(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Eu+3].[Eu+3] AEBZCFFCDTZXHP-UHFFFAOYSA-N 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000012299 nitrogen atmosphere Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 238000000634 powder X-ray diffraction Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000003786 synthesis reaction Methods 0.000 description 2
- 229910019655 synthetic inorganic crystalline material Inorganic materials 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 101150027751 Casr gene Proteins 0.000 description 1
- 229910002483 Cu Ka Inorganic materials 0.000 description 1
- 101001012040 Pseudomonas aeruginosa (strain ATCC 15692 / DSM 22644 / CIP 104116 / JCM 14847 / LMG 12228 / 1C / PRS 101 / PAO1) Immunomodulating metalloprotease Proteins 0.000 description 1
- JNDMLEXHDPKVFC-UHFFFAOYSA-N aluminum;oxygen(2-);yttrium(3+) Chemical compound [O-2].[O-2].[O-2].[Al+3].[Y+3] JNDMLEXHDPKVFC-UHFFFAOYSA-N 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000005338 frosted glass Substances 0.000 description 1
- 239000002223 garnet Substances 0.000 description 1
- 230000004313 glare Effects 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000005121 nitriding Methods 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- PYWVYCXTNDRMGF-UHFFFAOYSA-N rhodamine B Chemical compound [Cl-].C=12C=CC(=[N+](CC)CC)C=C2OC2=CC(N(CC)CC)=CC=C2C=1C1=CC=CC=C1C(O)=O PYWVYCXTNDRMGF-UHFFFAOYSA-N 0.000 description 1
- 229940043267 rhodamine b Drugs 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 230000001502 supplementing effect Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
- 229910019901 yttrium aluminum garnet Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
- C04B35/58—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides
- C04B35/597—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides based on silicon oxynitride, e.g. SIALONS
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/0883—Arsenides; Nitrides; Phosphides
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
- C04B35/62605—Treating the starting powders individually or as mixtures
- C04B35/6261—Milling
- C04B35/6262—Milling of calcined, sintered clinker or ceramics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
- C09K11/77347—Silicon Nitrides or Silicon Oxynitrides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
- C09K11/77348—Silicon Aluminium Nitrides or Silicon Aluminium Oxynitrides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
- H05B33/14—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of the electroluminescent material, or by the simultaneous addition of the electroluminescent material in or onto the light source
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3205—Alkaline earth oxides or oxide forming salts thereof, e.g. beryllium oxide
- C04B2235/3208—Calcium oxide or oxide-forming salts thereof, e.g. lime
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3224—Rare earth oxide or oxide forming salts thereof, e.g. scandium oxide
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/38—Non-oxide ceramic constituents or additives
- C04B2235/3852—Nitrides, e.g. oxynitrides, carbonitrides, oxycarbonitrides, lithium nitride, magnesium nitride
- C04B2235/3865—Aluminium nitrides
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/38—Non-oxide ceramic constituents or additives
- C04B2235/3852—Nitrides, e.g. oxynitrides, carbonitrides, oxycarbonitrides, lithium nitride, magnesium nitride
- C04B2235/3873—Silicon nitrides, e.g. silicon carbonitride, silicon oxynitride
- C04B2235/3878—Alpha silicon nitrides
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/44—Metal salt constituents or additives chosen for the nature of the anions, e.g. hydrides or acetylacetonate
- C04B2235/442—Carbonates
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
- C04B2235/74—Physical characteristics
- C04B2235/76—Crystal structural characteristics, e.g. symmetry
- C04B2235/766—Trigonal symmetry, e.g. alpha-Si3N4 or alpha-Sialon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
- H01L33/504—Elements with two or more wavelength conversion materials
Definitions
- the present invention relates to a light emitting device and a lighting device using the same.
- white light emitting diode lamps have already achieved luminous efficiency equal to or higher than that of incandescent light bulbs, and are still being improved, and in the near future, are considered to be widely used as energy saving lighting equipment. .
- the white light emitting diode lamp does not contain a substance having a high environmental load such as mercury. Furthermore, since the size of the element is small, it is incorporated in a backlight of a liquid crystal display device, a mobile phone, and the like, and is widely used.
- the white light-emitting diode lamp is a light-emitting diode element that emits light at a short wavelength such as blue, and is excited by absorbing part or all of the light emitted from the light-emitting diode to emit a longer-wavelength fluorescent light such as yellow. And a white light-emitting diode including a fluorescent substance that emits light.
- Examples of the white light emitting diode include a compound semiconductor blue light emitting diode element and a yttrium aluminum garnet activated with cerium which absorbs blue light and emits yellow fluorescence which is a complementary color of blue.
- Garnet: YAG) based phosphor for example, Japanese Patent No. 2900928, Japanese Patent No. 2927279, K. Bando, K. Sakano, Y. Noguchi and Y. Shimizu, 'Development of High- Bright and Pure-white LED Lamps, "J. Light & Vis. Env. Vol. 22, No. l (1998), pp. 2-5.).
- a red phosphor is added to compensate for the shortage of the red component.
- a red light-emitting material (SrBaCa) SiN: Eu2 + or SrS: Eu is used for a white light-emitting diode composed of a blue light-emitting diode element and a YAG-based phosphor activated with cerium.
- a white light emitting diode is realized by using a blue light emitting diode element, a blue excited green light emitting phosphor, and a blue excited red light emitting phosphor (see, for example, Japanese Patent Application Laid-Open No. 10-163535). ).
- SrGa S: Eu 2+ which is a blue-excited green-emitting phosphor, and blue-excited red-emitting fluorescence
- the body SrS: Eu 2+ is used (see, eg, Paul S. Martin, "Performance, Thermal, ost & Reliability challenges, solid state lighting, uIDA conference, May 30th 2002.).
- oxide phosphors or sulfide phosphors have been mainly used, and in recent years, oxynitride phosphors or nitride phosphors having more excellent long-term reliability have been used. The development of the body is becoming active.
- the present inventors have proposed that a blue light emitting diode element and a calcium (Ca) solid solution alpha sialon phosphor activated with europium element (Eu) are used to generate warm white light in the bulb color range.
- a white light emitting diode lamp that emits light has been realized.
- the realized light-emitting diode lamp has a room for improvement in the evaluation results of the color rendering properties related to red, due to the slight lack of the red component.
- the present invention is highly efficient especially in a region where the color temperature is low, and has a long-term reliability. It is an object of the present invention to provide a light emitting device having excellent color rendering properties and improved color rendering properties, and a lighting device using the same.
- the present invention according to claim 1 provides a semiconductor light emitting device that emits blue-violet light or blue light, and a device that absorbs part or all of the light emitted from the semiconductor light emitting device and has a wavelength different from the light.
- a fluorescent substance that emits fluorescent light wherein the fluorescent substance includes a first fluorescent substance X percent that emits any of yellow-green light, yellow light, and yellow-red light, and a yellow light that has a longer dominant emission wavelength than the first fluorescent substance.
- the first phosphor is represented by the general formula Ca (Si, Al) (0, N): Eu 2+ , and the main phase is alpha sialo.
- the gist is a sialon phosphor having a crystal structure.
- the sialon phosphor according to the first aspect wherein the X is 0.75 or more and 1.0 or less and the y is 0.04 or more and 0.25 or less.
- the gist is that
- the present invention according to claim 3 is the invention according to claim 1 or 2, wherein the second fluorescent substance is a nitride represented by the general formula (SrBaCa) SiN: Eu2 + .
- the gist is that there is.
- the present invention according to claim 4 is the invention according to claim 1 or 2, wherein the second phosphor is a nitride crystal red phosphor represented by a general formula Ca AlSiN: Eu 2+. That there is
- the gist The gist.
- the present invention according to claim 5 is the invention according to any one of claims 1 to 4, wherein the semiconductor light emitting device is a semiconductor light emitting diode device having a light emission center wavelength of 400 nm to 480 nm.
- the gist is that there is.
- a light-emitting device according to any one of the first to fifth aspects, a supporting portion on which the light-emitting device is mounted, and a light-emitting device for driving the light-emitting device.
- a gist of the present invention includes a device driving unit.
- the present invention described in claim 7 is, in the invention described in claim 6, characterized in that a cover made of a translucent material or a light scattering material and covering the light emitting device is provided.
- the light-emitting device of the present invention absorbs a part or all of the light emitted from the semiconductor light-emitting element that emits blue-violet light or blue light, and emits light having a wavelength different from that of the semiconductor light-emitting element.
- a fluorescent substance that emits light is represented by the general formula Ca (Si, Al) (0, N): Eu 2+ .
- the main phase has an alpha sialon crystal structure and is a sialon phosphor that emits either yellow-green light, yellow light or yellow-red light, so it has high efficiency even in the region of low color temperature.
- a light emitting device having excellent long-term reliability and improved color rendering can be provided.
- the light emitting device of the present invention includes a semiconductor light emitting element that emits blue-violet light or blue light and a part or all of the light emitted from the semiconductor light emitting element, and has a wavelength different from this light.
- a first fluorescent substance that emits any of yellow-green light, yellow light, and yellow-red light; and a yellow-red light that has a longer emission dominant wavelength than the first fluorescent substance.
- a mixture of a second fluorescent substance that emits red light, and the first fluorescent substance is represented by the general formula Ca (Si, Al) (O, N): Eu 2+ , and the main phase is alpha.
- the X is 0.75 or more and 1.0 or less and the y is 0.04 or more and 0.25 or less. Therefore, high efficiency is obtained even in a region where the color temperature is low. A light emitting device having excellent long-term reliability and improved color rendering can be realized.
- the second fluorescent substance is represented by the general formula (SrBaCa) SiN: Eu2 +.
- the second fluorescent substance is a nitride crystal represented by the general formula Ca AlSiN: Eu 2+.
- the above-mentioned semiconductor light emitting device is a semiconductor light emitting diode device having a light emission center wavelength of 400 nm to 480 nm, it has high efficiency even in a region where the color temperature is low, and has excellent long-term reliability and color rendering properties. Can be realized.
- the lighting device of the present invention includes the above light emitting device and the light emitting device.
- a light emitting device driving unit for driving the light emitting device, the lighting device having high efficiency, especially in a low color temperature region, excellent long-term reliability, and improved color rendering. realizable.
- the lighting device of the present invention is made of a translucent material or a light scattering material, and includes a cover that covers the light emitting device, so that light emitted from the light emitting device directly enters the human eye. Can be prevented.
- FIG. 1 is a sectional view of a white light emitting diode lamp according to a first embodiment of the present invention.
- FIG. 2 is a perspective view of the white light emitting diode lamp of FIG. 1.
- FIG. 3 is a diagram showing an emission spectrum of a phosphor.
- FIG. 4 is a diagram showing an excitation spectrum of a phosphor.
- FIG. 5 is a diagram showing chromaticity coordinates of a blue light emitting diode element and a phosphor.
- FIG. 6 is a diagram showing a light emission spectrum of a white light emitting diode lamp using only the first phosphor.
- FIG. 7 is a diagram showing a light emission spectrum of a white light emitting diode lamp using the first and second phosphors.
- FIG. 8 is a diagram showing chromaticity coordinates of a white light emitting diode lamp.
- FIG. 9 is a sectional view of a lighting device according to a second embodiment of the present invention.
- the light emitting device of the present invention is a white light emitting diode lamp for illumination.
- the following examples are merely illustrative of the invention and do not limit the scope of the invention. Therefore, those skilled in the art can employ various embodiments including each of these elements or all the elements, but these embodiments are also included in the scope of the present invention.
- the present inventors have provided a blue light emitting diode element and a calcium (Ca) solid solution alpha sialon phosphor activated with europium element (Eu), By adding a small amount of a nitride red phosphor to a white light emitting diode lamp that emits warm white light, an improvement in color rendering properties of a highly reliable light bulb color (white) light emitting diode lamp was achieved. The details are described below.
- the first phosphor is a calcium (Ca) solid solution alpha-sialon phosphor activated by divalent europium (Eu), and has a composition represented by a general formula Ca (Si, Al) ( ⁇ , N): x 12 16 y represented by Eu 2+ and emits any of yellow-green light, yellow light or yellow-red light.
- this phosphor will be referred to as "sialon phosphor" as appropriate.
- composition range was 0.75 ⁇ x ⁇ l.0. (x is 0.75 or more and 1.0 or less) and 0.04 ⁇ y ⁇ 0.25 (yi is 0.04 or more and 0.25 or less).
- the mixed raw material powder was dried by a rotary evaporator, was sufficiently loosened using a mortar, and was housed in a container made of boron nitride with a lid.
- the raw material powder together with the above-mentioned container with a lid was placed in a gas pressure sintering furnace, and the sintering temperature was set to 170.
- the gas was pressurized at 0 ° C and a nitrogen atmosphere of 0.5 MPa, and sintering was performed for 50 hours.
- the powder after sintering is in the form of a single lump, It can be in powder form.
- the first phosphor in the present invention has been described above. Next, the second phosphor in the present invention will be described.
- the second phosphor is added to supplement the red component, and emits yellow-red light or red light.
- Those having optical characteristics usable for the second phosphor include (Zn, Cd) S: Cu, A
- these phosphors are all oxide phosphors or sulfide phosphors, and from the viewpoint of securing long-term reliability, it is desirable to select a nitride phosphor from the viewpoint of .
- the nitride phosphor usable as the second phosphor in the present invention includes (Sr B
- Ca AlSiN: Eu 2+ is preferable because of its excellent excitation efficiency and emission intensity.
- a silicon nitride powder, an aluminum nitride powder, a calcium nitride powder, and europium nitride synthesized by nitriding europium metal in ammonia were prepared.
- the firing atmosphere is evacuated by a diffusion pump
- the obtained sintered body was pulverized using an agate pestle and mortar, and a powder X-ray diffraction measurement using a Cu Ka line was performed on the obtained powder phosphor.
- the obtained chart confirmed that the powder phosphor had a CaAlSiN crystal phase (structure).
- a spectrofluorometer was used for this measurement. This measuring device performs calibration using the rhodamine B method and a standard light source, and corrects the spectrum based on the calibration to perform the measurement.
- FIG. 3 is a diagram showing emission spectra of the first phosphor and the second phosphor.
- line 12 shows the emission spectrum of the first phosphor
- line 13 shows the emission spectrum of the second phosphor. 3 shows the emission status of the phosphor.
- FIG. 4 is a diagram showing the excitation spectra of the first phosphor and the second phosphor.
- Line 14 in the drawing shows the excitation spectrum of the first phosphor
- line 15 in the drawing shows the excitation spectrum of the first phosphor.
- 3 shows an excitation spectrum of a second phosphor.
- the emission monitor wavelength was 585 nm.
- the emission monitor wavelength was set to 655.
- Each of the phosphors has a very broad excitation peak in the blue region
- FIG. 5 shows the blackbody radiation locus (line 16 in the figure) and the chromaticity coordinates of the blue light-emitting diode element having a light emission center wavelength of 450 nm on the XYZ color system chromaticity diagram of CIE1931
- FIG. 17 is a diagram showing a point 17), chromaticity coordinates of a first phosphor (point 18 in the figure), and chromaticity coordinates of a second phosphor (point 19 in the figure).
- a white light emitting diode lamp that emits warm white near the color of a light bulb having a low color temperature, in which a red component is added to the white light-emitting diode lamp to improve its color rendering properties, will be described.
- the configuration of the light emitting device of the present invention including the blue light emitting diode element, the first phosphor, and the second phosphor, any intermediate color of the area 20 indicated by the triangle in FIG. It is possible to easily realize a neutral-color visible light emitting diode lamp that emits light in such a manner.
- Such a light emitting device is also included in the scope of the present invention.
- Example 1 a white light emitting diode lamp as a light emitting device according to a first example (Example 1) of the present invention will be described.
- FIG. 1 is a sectional view of the white light emitting diode lamp 1 described above
- FIG. 2 is a perspective view of the white light emitting diode lamp 1 of FIG.
- the white light emitting diode lamp 1 has a substantially cylindrical shape having a lens-shaped curved surface formed at the tip, in other words, has a shape similar to a shell, and emits blue wires and lead wires 2 and 3. It consists of a blue light emitting diode element (semiconductor light source element) 4, a bonding wire 5, the above-mentioned phosphor 7, a transparent first resin 6 and a second resin 8, and the lower portions of the lead wires 2 and 3 are exposed.
- a blue light emitting diode element semiconductor light source element
- a concave portion is provided at the upper end of the lead wire 2, and the light emitting diode element 4 is mounted in the concave portion.
- the light emitting diode element 4 is electrically connected to the lead wire 2 by die bonding using a conductive paste or the like.
- the light emitting diode element 4 is bonded It is also electrically connected to the lead wire 3 by wire bonding using the wire 5 or the like.
- the vicinity of the blue light emitting diode element 4 including the concave portion is sealed with the first resin 6, and the phosphor 7 is dispersed in the first resin 6.
- the first resin 6 is sealed with the second resin 8.
- the blue light emitting diode element 4 preferably has an emission center wavelength of 400 nm to 480 nm, and particularly preferably has a light emission center wavelength of 450 nm capable of efficiently exciting the sialon phosphor.
- the emission center wavelength was 454 nm.
- the first phosphor and the second phosphor are weighed and mixed as the phosphor 7
- the blue light emitting diode element 4 is die-bonded to the element mounting recess on the lead wire 2 using a conductive paste.
- the light emitting diode element and the other lead wire 3 are wire-bonded with the bonding wire 5.
- the first resin 6 in which the phosphor 7 is dispersed at 35% by weight is pre-dipped in the recess for mounting the element so as to cover the blue light-emitting diode element 4, The resin 6 is cured.
- the upper portion of the lead wires 2 and 3, the blue light emitting diode element 4, and the first resin 6 are surrounded by the second resin 8 and cured.
- the fifth step is generally performed by casting.
- the lead wires 2 and 3 can be manufactured integrally.
- the lead wires 2 and 3 have a shape connected at the lower part thereof, and thus are integrally formed.
- a step of removing the portion connecting the lead wires 2 and 3 after Step 5 and using the lead wires 2 and 3 as separate members is provided.
- the same epoxy resin is used for the first resin 6 and the second resin 8. Further, in the present embodiment, the case where the phosphor is dispersed in the first resin 6 has been described.
- the phosphor is contained in a single resin (corresponding to the second resin 8 of the present embodiment) that seals the lead wires 2 and 3, the blue light emitting diode element 4, and the bonding wire 5. 7 may be dispersed.
- the blue light emitting diode element 4 is located above (the bonding wire
- the blue light emitting diode element 4 only needs to be appropriately fixed.
- the third step there is no need to use a conductive paste in the second step, and bonding is performed using two bonding wires.
- the shape of the lead wire in the present invention may be any shape as long as the light emitting diode element can be mounted thereon.
- FIG. 6 is a diagram showing an emission spectrum (line 21 in the figure) of the white light emitting diode lamp 1 using only the first phosphor as the phosphor 7. In performing this measurement, a high-speed LED test 'measurement device was used.
- FIG. 7 shows an emission spectrum of a white light-emitting diode lamp 1 using the above-mentioned phosphor 7 in which a first phosphor and a second phosphor are mixed at a weight ratio of 3: 1.
- the middle line 22 shows an emission spectrum of a white light-emitting diode lamp 1 using the above-mentioned phosphor 7 in which a first phosphor and a second phosphor are mixed at a weight ratio of 3: 1.
- the middle line 22 shows an emission spectrum of a white light-emitting diode lamp 1 using the above-mentioned phosphor 7 in which a first phosphor and a second phosphor are mixed at a weight ratio of 3: 1.
- the middle line 22 shows an emission spectrum of a white light-emitting diode lamp 1 using the above-mentioned phosphor 7 in which a first phosphor and a second phosphor are mixed at a weight ratio of 3: 1.
- the middle line 22 shows an emission
- the first fluorescent lamp 7 in which the phosphor 7 is dispersed was compared with a white light-emitting diode lamp having an emission spectrum shown in FIG. The amount of resin applied was slightly increased.
- the color rendering properties were improved from Ra55 to Ra65 when the first phosphor was used. This value is inferior to the ordinary fluorescent lamp Ra60. Suitable for general colorless lighting applications.
- the chromaticity coordinates of the white light emitting diode lamp having the emission spectrum shown in FIG. 6 (point 23 in the figure) and the white light emission having the emission spectrum shown in FIG. All of the chromaticity coordinates (point 24 in the figure) of the diode lamp are on the blackbody radiation locus 16, and the color temperature is 2750 K for the light-emitting diode lamp using only the first phosphor (Fig. 6) and 1
- the light emitting diode lamp (Fig. 7) using a mixture of this phosphor and the second phosphor is 2300 ⁇ .
- Example 2 a lighting device according to a second embodiment (Example 2) of the present invention will be described.
- FIG. 9 is a cross-sectional view of the lighting device 9 described above.
- the lighting device 9 includes one or a plurality of white light-emitting diode lamps 1, a support unit 10 on which the white light-emitting diode lamps 1 are mounted, and a lamp (light-emitting device) driving unit ( (Not shown) and a cover 11 made of a translucent material or a light scattering material and covering the white light emitting diode lamp.
- the support portion 10 is a box-shaped member having a certain strength, and has a structure fixed to a ceiling or a side wall.
- the drive unit is an electric circuit for turning on the white light emitting diode lamp 1 using a power supply supplied from the outside, and is built in the support unit.
- the drive unit usually includes a power supply circuit, a driver IC for a white light emitting diode lamp, and peripheral parts attached thereto.
- the driver IC may be provided with a function of driving the white light emitting diode lamp 1 in a pulsed manner or a dimming function.
- One or more white light-emitting diode lamps 1 are provided on the support portion 10, and are electrically connected to the above-described drive portion.
- the cover 11 is arranged so as to cover the whole of the white light emitting diode lamp 1, and for this, a translucent material or a light scattering material is used.
- this light scattering material include , Frosted glass, resin having a surface with a certain roughness, and the like.
- the white light emitted from the white light-emitting diode lamp 1 is recognized as being brightly illuminated by the entire lighting device 9 that does not directly enter the human eye. Even if the lamp 1 is a high-brightness light emitting device, the glare can be prevented from directly causing a problem.
- a light-emitting diode lamp having high reliability is provided.
- a lighting device can be realized. Further, by supplementing the red component, the color rendering properties can be improved.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Structural Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Luminescent Compositions (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006511246A JP4045298B2 (ja) | 2004-03-22 | 2005-03-18 | 発光デバイス及び照明装置 |
EP05726716A EP1734096B1 (en) | 2004-03-22 | 2005-03-18 | Light-emitting device and illuminating device |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004083399 | 2004-03-22 | ||
JP2004-083399 | 2004-03-22 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2005090517A1 true WO2005090517A1 (ja) | 2005-09-29 |
Family
ID=34993684
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2005/004973 WO2005090517A1 (ja) | 2004-03-22 | 2005-03-18 | 発光デバイス及び照明装置 |
Country Status (7)
Country | Link |
---|---|
US (1) | US7564065B2 (ja) |
EP (1) | EP1734096B1 (ja) |
JP (1) | JP4045298B2 (ja) |
KR (1) | KR100841677B1 (ja) |
CN (1) | CN100549129C (ja) |
TW (1) | TW200604325A (ja) |
WO (1) | WO2005090517A1 (ja) |
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006016413A (ja) * | 2004-06-30 | 2006-01-19 | National Institute For Materials Science | 蛍光体と発光器具 |
JP2006169526A (ja) * | 2004-12-10 | 2006-06-29 | Lumileds Lighting Us Llc | 燐光変換発光装置 |
WO2007052200A1 (en) * | 2005-11-07 | 2007-05-10 | Philips Intellectual Property & Standards Gmbh | Light emitting device with an improved caalsin light converting material |
JP2007180483A (ja) * | 2005-11-30 | 2007-07-12 | Sharp Corp | 発光装置 |
JP2007188962A (ja) * | 2006-01-11 | 2007-07-26 | Sharp Corp | 蛍光体膜付発光素子及びその製造方法 |
JP2008088266A (ja) * | 2006-09-29 | 2008-04-17 | Dowa Holdings Co Ltd | 窒化物蛍光体または酸窒化物蛍光体の製造方法 |
JP2009516774A (ja) * | 2005-11-22 | 2009-04-23 | ルミネイション リミテッド ライアビリティ カンパニー | 照明用途において使用するための電荷補償窒化物蛍光体 |
JP2009534863A (ja) * | 2006-04-25 | 2009-09-24 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 白色光を作る蛍光照明 |
US20110235309A1 (en) * | 2008-11-28 | 2011-09-29 | Showa Denko K.K. | Illumination device for display device, and display device |
US8125060B2 (en) | 2006-12-08 | 2012-02-28 | Infineon Technologies Ag | Electronic component with layered frame |
US8203164B2 (en) | 2007-03-14 | 2012-06-19 | Samsung Led Co., Ltd. | Light emitting diode package |
US8206611B2 (en) | 2005-05-24 | 2012-06-26 | Mitsubishi Chemical Corporation | Phosphor and use thereof |
WO2012165022A1 (ja) * | 2011-06-02 | 2012-12-06 | 三菱化学株式会社 | 半導体発光装置、半導体発光システムおよび照明器具 |
US8974698B2 (en) | 2010-03-31 | 2015-03-10 | Ube Industries, Ltd. | Production method of sialon-based oxynitride phosphor, and sialon-based oxynitride phosphor |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2005123876A1 (ja) * | 2004-06-18 | 2005-12-29 | National Institute For Materials Science | α型サイアロン及びα型サイアロン蛍光体並びにその製造方法 |
JP4511885B2 (ja) * | 2004-07-09 | 2010-07-28 | Dowaエレクトロニクス株式会社 | 蛍光体及びled並びに光源 |
CN1854858A (zh) * | 2005-04-19 | 2006-11-01 | 夏普株式会社 | 发光装置、液晶显示装置和照明装置 |
JP5137847B2 (ja) | 2005-12-21 | 2013-02-06 | クリー インコーポレイテッド | 照明装置、および照明方法 |
CN101449099A (zh) * | 2006-04-20 | 2009-06-03 | 科锐Led照明科技公司 | 照明装置及照明方法 |
US7923928B2 (en) * | 2006-06-27 | 2011-04-12 | Mitsubishi Chemical Corporation | Illuminating device |
JP5578597B2 (ja) | 2007-09-03 | 2014-08-27 | 独立行政法人物質・材料研究機構 | 蛍光体及びその製造方法、並びにそれを用いた発光装置 |
WO2011108053A1 (ja) * | 2010-03-01 | 2011-09-09 | パナソニック株式会社 | Ledランプおよびled照明装置 |
DE102010046790A1 (de) * | 2010-09-28 | 2012-03-29 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauelement und Verfahren zu dessen Herstellung |
EP2646523B1 (en) * | 2010-12-01 | 2015-11-25 | Koninklijke Philips N.V. | Red emitting luminescent materials |
DE102011115879A1 (de) * | 2011-10-12 | 2013-04-18 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Leuchtstoffe |
DE102012101920A1 (de) * | 2012-03-07 | 2013-09-12 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement |
EP2832817A4 (en) * | 2012-03-29 | 2015-12-09 | Ube Industries | LUMINOPHORE POWDER BASED ON OXYNITRIDE |
DE102013100429B4 (de) * | 2013-01-16 | 2023-12-07 | Osram Gmbh | Verfahren zur Herstellung eines pulverförmigen Precursormaterials und Verwendung eines mit dem Verfahren hergestellten pulverförmigen Precursormaterials |
JP6284079B2 (ja) * | 2014-03-14 | 2018-02-28 | パナソニックIpマネジメント株式会社 | 発光装置、照明用光源、および照明装置 |
WO2016094863A1 (en) * | 2014-12-11 | 2016-06-16 | Nitto Denko Corporation | Nitride phosphor element for light emitting diodes |
Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10163535A (ja) | 1996-11-27 | 1998-06-19 | Kasei Optonix Co Ltd | 白色発光素子 |
JP2900928B2 (ja) | 1997-10-20 | 1999-06-02 | 日亜化学工業株式会社 | 発光ダイオード |
JP2927279B2 (ja) | 1996-07-29 | 1999-07-28 | 日亜化学工業株式会社 | 発光ダイオード |
JP2002363554A (ja) * | 2001-06-07 | 2002-12-18 | National Institute For Materials Science | 希土類元素を付活させた酸窒化物蛍光体 |
JP2003124527A (ja) * | 2001-07-16 | 2003-04-25 | Patent Treuhand Ges Elektr Gluehlamp Mbh | 光源として少なくとも1つのledを備えた照明ユニット |
JP2003206481A (ja) * | 2001-09-25 | 2003-07-22 | Patent Treuhand Ges Elektr Gluehlamp Mbh | 光源として少なくとも1つのledを備えた照明ユニット |
JP2003273409A (ja) | 2002-02-25 | 2003-09-26 | Lumileds Lighting Us Llc | 赤色不足補償蛍光発光素子 |
JP2003321675A (ja) | 2002-04-26 | 2003-11-14 | Nichia Chem Ind Ltd | 窒化物蛍光体及びその製造方法 |
JP2004067837A (ja) * | 2002-08-06 | 2004-03-04 | Toyota Central Res & Dev Lab Inc | α−サイアロン蛍光体 |
JP2004186278A (ja) * | 2002-11-29 | 2004-07-02 | Toyoda Gosei Co Ltd | 発光装置及び発光方法 |
JP2004238505A (ja) * | 2003-02-06 | 2004-08-26 | Ube Ind Ltd | サイアロン系酸窒化物蛍光体およびその製造方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1104799A1 (en) * | 1999-11-30 | 2001-06-06 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH | Red emitting luminescent material |
US6632379B2 (en) * | 2001-06-07 | 2003-10-14 | National Institute For Materials Science | Oxynitride phosphor activated by a rare earth element, and sialon type phosphor |
US6717353B1 (en) * | 2002-10-14 | 2004-04-06 | Lumileds Lighting U.S., Llc | Phosphor converted light emitting device |
JP4524470B2 (ja) * | 2004-08-20 | 2010-08-18 | Dowaエレクトロニクス株式会社 | 蛍光体およびその製造方法、並びに当該蛍光体を用いた光源 |
-
2005
- 2005-03-18 KR KR1020067021529A patent/KR100841677B1/ko not_active IP Right Cessation
- 2005-03-18 CN CNB2005800091917A patent/CN100549129C/zh not_active Expired - Fee Related
- 2005-03-18 WO PCT/JP2005/004973 patent/WO2005090517A1/ja active Application Filing
- 2005-03-18 TW TW094108482A patent/TW200604325A/zh not_active IP Right Cessation
- 2005-03-18 EP EP05726716A patent/EP1734096B1/en not_active Expired - Fee Related
- 2005-03-18 JP JP2006511246A patent/JP4045298B2/ja not_active Expired - Fee Related
- 2005-03-22 US US11/085,070 patent/US7564065B2/en not_active Expired - Fee Related
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2927279B2 (ja) | 1996-07-29 | 1999-07-28 | 日亜化学工業株式会社 | 発光ダイオード |
JPH10163535A (ja) | 1996-11-27 | 1998-06-19 | Kasei Optonix Co Ltd | 白色発光素子 |
JP2900928B2 (ja) | 1997-10-20 | 1999-06-02 | 日亜化学工業株式会社 | 発光ダイオード |
JP2002363554A (ja) * | 2001-06-07 | 2002-12-18 | National Institute For Materials Science | 希土類元素を付活させた酸窒化物蛍光体 |
JP2003124527A (ja) * | 2001-07-16 | 2003-04-25 | Patent Treuhand Ges Elektr Gluehlamp Mbh | 光源として少なくとも1つのledを備えた照明ユニット |
JP2003206481A (ja) * | 2001-09-25 | 2003-07-22 | Patent Treuhand Ges Elektr Gluehlamp Mbh | 光源として少なくとも1つのledを備えた照明ユニット |
JP2003273409A (ja) | 2002-02-25 | 2003-09-26 | Lumileds Lighting Us Llc | 赤色不足補償蛍光発光素子 |
JP2003321675A (ja) | 2002-04-26 | 2003-11-14 | Nichia Chem Ind Ltd | 窒化物蛍光体及びその製造方法 |
JP2004067837A (ja) * | 2002-08-06 | 2004-03-04 | Toyota Central Res & Dev Lab Inc | α−サイアロン蛍光体 |
JP2004186278A (ja) * | 2002-11-29 | 2004-07-02 | Toyoda Gosei Co Ltd | 発光装置及び発光方法 |
JP2004238505A (ja) * | 2003-02-06 | 2004-08-26 | Ube Ind Ltd | サイアロン系酸窒化物蛍光体およびその製造方法 |
Non-Patent Citations (4)
Title |
---|
K. BANDO; K. SAKANO; Y. NOGUCHI; Y. SHIMIZU, J. LIGHT & VIS. ENV., vol. 22, no. 1, 1998, pages 2 - 5 |
M. YAMADA; T. NAITOU; K. IZUNO; H. TAMAKI; Y. MURAZAKI; M. KAMESHIMA; T. MUKAI, JPN. J. APPL. PHYS., vol. 42, 2003, pages L20 - L23 |
PAUL S. MARTIN: "Thermal, Cost & Reliability challenges for Solid State Lighting", OIDA CONFERENCE, 30 May 2002 (2002-05-30) |
See also references of EP1734096A4 |
Cited By (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006016413A (ja) * | 2004-06-30 | 2006-01-19 | National Institute For Materials Science | 蛍光体と発光器具 |
JP4565141B2 (ja) * | 2004-06-30 | 2010-10-20 | 独立行政法人物質・材料研究機構 | 蛍光体と発光器具 |
US7947198B2 (en) | 2004-06-30 | 2011-05-24 | National Institute For Materials Science | Phosphor and light emitting instrument |
JP2006169526A (ja) * | 2004-12-10 | 2006-06-29 | Lumileds Lighting Us Llc | 燐光変換発光装置 |
US8703019B2 (en) | 2005-05-24 | 2014-04-22 | Mitsubishi Chemical Corporation | Phosphor and use thereof |
US8206611B2 (en) | 2005-05-24 | 2012-06-26 | Mitsubishi Chemical Corporation | Phosphor and use thereof |
WO2007052200A1 (en) * | 2005-11-07 | 2007-05-10 | Philips Intellectual Property & Standards Gmbh | Light emitting device with an improved caalsin light converting material |
US8159126B2 (en) | 2005-11-07 | 2012-04-17 | Koninklijke Philips Electronics N.V. | Light emitting device with an improved CaAlSiN light converting material |
JP2009516774A (ja) * | 2005-11-22 | 2009-04-23 | ルミネイション リミテッド ライアビリティ カンパニー | 照明用途において使用するための電荷補償窒化物蛍光体 |
JP2007180483A (ja) * | 2005-11-30 | 2007-07-12 | Sharp Corp | 発光装置 |
JP4726633B2 (ja) * | 2006-01-11 | 2011-07-20 | シャープ株式会社 | 発光素子の製造方法 |
JP2007188962A (ja) * | 2006-01-11 | 2007-07-26 | Sharp Corp | 蛍光体膜付発光素子及びその製造方法 |
JP2009534863A (ja) * | 2006-04-25 | 2009-09-24 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 白色光を作る蛍光照明 |
JP2008088266A (ja) * | 2006-09-29 | 2008-04-17 | Dowa Holdings Co Ltd | 窒化物蛍光体または酸窒化物蛍光体の製造方法 |
US8125060B2 (en) | 2006-12-08 | 2012-02-28 | Infineon Technologies Ag | Electronic component with layered frame |
US8703544B2 (en) | 2006-12-08 | 2014-04-22 | Infineon Technologies Ag | Electronic component employing a layered frame |
US8203164B2 (en) | 2007-03-14 | 2012-06-19 | Samsung Led Co., Ltd. | Light emitting diode package |
US20110235309A1 (en) * | 2008-11-28 | 2011-09-29 | Showa Denko K.K. | Illumination device for display device, and display device |
US8550645B2 (en) * | 2008-11-28 | 2013-10-08 | Showa Denko K.K. | Illumination device for display device, and display device |
US8974698B2 (en) | 2010-03-31 | 2015-03-10 | Ube Industries, Ltd. | Production method of sialon-based oxynitride phosphor, and sialon-based oxynitride phosphor |
WO2012165022A1 (ja) * | 2011-06-02 | 2012-12-06 | 三菱化学株式会社 | 半導体発光装置、半導体発光システムおよび照明器具 |
JP2013012711A (ja) * | 2011-06-02 | 2013-01-17 | Mitsubishi Chemicals Corp | 半導体発光装置、半導体発光システムおよび照明器具 |
US8779455B2 (en) | 2011-06-02 | 2014-07-15 | Mitsubishi Chemical Corporation | Semiconductor light-emitting device, semiconductor light-emitting system and illumination fixture |
Also Published As
Publication number | Publication date |
---|---|
KR20070013283A (ko) | 2007-01-30 |
CN1934220A (zh) | 2007-03-21 |
JPWO2005090517A1 (ja) | 2008-01-31 |
EP1734096B1 (en) | 2011-07-06 |
TW200604325A (en) | 2006-02-01 |
EP1734096A1 (en) | 2006-12-20 |
EP1734096A4 (en) | 2008-12-31 |
KR100841677B1 (ko) | 2008-06-26 |
CN100549129C (zh) | 2009-10-14 |
US7564065B2 (en) | 2009-07-21 |
TWI293327B (ja) | 2008-02-11 |
JP4045298B2 (ja) | 2008-02-13 |
US20070278510A1 (en) | 2007-12-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4045298B2 (ja) | 発光デバイス及び照明装置 | |
JP4104013B2 (ja) | 発光デバイス及び照明装置 | |
JP3931239B2 (ja) | 発光素子及び照明器具 | |
JP4963705B2 (ja) | 発光デバイス及び照明装置 | |
JP4559496B2 (ja) | 発光装置 | |
KR100806243B1 (ko) | 산질화물 형광체 및 발광 디바이스 | |
US20080258110A1 (en) | Phosphor composition and method for producing the same, and light-emitting device using the same | |
JP2007088248A (ja) | 有色発光ダイオードランプ、装飾用照明装置及びカラーディスプレイサイン装置 | |
JP2015142056A (ja) | 半導体発光装置 | |
JP4234161B2 (ja) | 発光素子及び照明器具 | |
JP2008007564A (ja) | 酸窒化物系蛍光体及びこれを用いた発光装置 | |
JP4070219B2 (ja) | 発光素子を用いた照明装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A1 Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NA NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SM SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW |
|
AL | Designated countries for regional patents |
Kind code of ref document: A1 Designated state(s): BW GH GM KE LS MW MZ NA SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LT LU MC NL PL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2006511246 Country of ref document: JP |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
WWE | Wipo information: entry into national phase |
Ref document number: 200580009191.7 Country of ref document: CN |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
WWW | Wipo information: withdrawn in national office |
Country of ref document: DE |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2005726716 Country of ref document: EP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 1020067021529 Country of ref document: KR |
|
WWP | Wipo information: published in national office |
Ref document number: 2005726716 Country of ref document: EP |
|
WWP | Wipo information: published in national office |
Ref document number: 1020067021529 Country of ref document: KR |