JP2003078043A5 - - Google Patents
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- JP2003078043A5 JP2003078043A5 JP2001264754A JP2001264754A JP2003078043A5 JP 2003078043 A5 JP2003078043 A5 JP 2003078043A5 JP 2001264754 A JP2001264754 A JP 2001264754A JP 2001264754 A JP2001264754 A JP 2001264754A JP 2003078043 A5 JP2003078043 A5 JP 2003078043A5
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Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001264754A JP4198903B2 (ja) | 2001-08-31 | 2001-08-31 | 半導体記憶装置 |
US10/230,092 US20030042558A1 (en) | 2001-08-31 | 2002-08-29 | Nonvolatile semiconductor memory device having erasing characteristic improved |
CNB021322171A CN100334734C (zh) | 2001-08-31 | 2002-08-30 | 半导体存储单元和半导体存储装置 |
TW091119793A TW569428B (en) | 2001-08-31 | 2002-08-30 | Semiconductor memory cell and semiconductor memory device |
KR1020020052175A KR20030019259A (ko) | 2001-08-31 | 2002-08-30 | 반도체 메모리 셀 및 반도체 기억 장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001264754A JP4198903B2 (ja) | 2001-08-31 | 2001-08-31 | 半導体記憶装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2003078043A JP2003078043A (ja) | 2003-03-14 |
JP2003078043A5 true JP2003078043A5 (ja) | 2007-07-26 |
JP4198903B2 JP4198903B2 (ja) | 2008-12-17 |
Family
ID=19091306
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2001264754A Expired - Fee Related JP4198903B2 (ja) | 2001-08-31 | 2001-08-31 | 半導体記憶装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20030042558A1 (ja) |
JP (1) | JP4198903B2 (ja) |
KR (1) | KR20030019259A (ja) |
CN (1) | CN100334734C (ja) |
TW (1) | TW569428B (ja) |
Families Citing this family (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6940152B2 (en) * | 2002-02-21 | 2005-09-06 | Matsushita Electric Industrial Co., Ltd. | Semiconductor storage device and its manufacturing method |
JP4256198B2 (ja) * | 2003-04-22 | 2009-04-22 | 株式会社東芝 | データ記憶システム |
JP4620334B2 (ja) * | 2003-05-20 | 2011-01-26 | シャープ株式会社 | 半導体記憶装置、半導体装置及びそれらを備える携帯電子機器、並びにicカード |
JP4040534B2 (ja) | 2003-06-04 | 2008-01-30 | 株式会社東芝 | 半導体記憶装置 |
US7005335B2 (en) * | 2003-07-15 | 2006-02-28 | Hewlett-Packard Development, L.P. | Array of nanoscopic mosfet transistors and fabrication methods |
US7064032B2 (en) * | 2003-07-25 | 2006-06-20 | Macronix International Co., Ltd. | Method for forming non-volatile memory cell with low-temperature-formed dielectric between word and bit lines, and non-volatile memory array including such memory cells |
KR100578131B1 (ko) * | 2003-10-28 | 2006-05-10 | 삼성전자주식회사 | 비휘발성 기억 소자 및 그 형성 방법 |
US7202523B2 (en) * | 2003-11-17 | 2007-04-10 | Micron Technology, Inc. | NROM flash memory devices on ultrathin silicon |
US7164177B2 (en) * | 2004-01-02 | 2007-01-16 | Powerchip Semiconductor Corp. | Multi-level memory cell |
KR100630680B1 (ko) * | 2004-03-19 | 2006-10-02 | 삼성전자주식회사 | 비대칭 게이트 유전체층을 지닌 비휘발성 메모리 소자 및그 제조 방법 |
KR100606929B1 (ko) | 2004-05-27 | 2006-08-01 | 동부일렉트로닉스 주식회사 | 플래시 메모리 소자의 프로그래밍/소거 방법 |
US7393761B2 (en) * | 2005-01-31 | 2008-07-01 | Tokyo Electron Limited | Method for fabricating a semiconductor device |
WO2006092824A1 (ja) * | 2005-02-28 | 2006-09-08 | Spansion Llc | 半導体装置及びその製造方法 |
US7158420B2 (en) * | 2005-04-29 | 2007-01-02 | Macronix International Co., Ltd. | Inversion bit line, charge trapping non-volatile memory and method of operating same |
KR100669089B1 (ko) * | 2005-07-11 | 2007-01-16 | 삼성전자주식회사 | 게이트 구조물, 이를 갖는 소노스 타입의 비휘발성 메모리장치 및 그 제조 방법 |
JP2007109954A (ja) * | 2005-10-14 | 2007-04-26 | Sharp Corp | 半導体記憶装置、その製造方法及びその動作方法 |
WO2007046144A1 (ja) * | 2005-10-19 | 2007-04-26 | Fujitsu Limited | 抵抗記憶素子及びその製造方法、並びに不揮発性半導体記憶装置 |
JP2007287856A (ja) * | 2006-04-14 | 2007-11-01 | Toshiba Corp | 半導体装置の製造方法 |
JP4282702B2 (ja) * | 2006-09-22 | 2009-06-24 | 株式会社東芝 | 不揮発性半導体記憶装置 |
KR100856701B1 (ko) * | 2006-12-04 | 2008-09-04 | 경북대학교 산학협력단 | 고집적 플래시 메모리 셀 스트링,셀 소자,및 그 제조방법 |
US7557008B2 (en) * | 2007-01-23 | 2009-07-07 | Freescale Semiconductor, Inc. | Method of making a non-volatile memory device |
US8410543B2 (en) | 2007-02-01 | 2013-04-02 | Renesas Electronics Corporation | Semiconductor storage device and manufacturing method thereof |
JP5149539B2 (ja) * | 2007-05-21 | 2013-02-20 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
US7875516B2 (en) * | 2007-09-14 | 2011-01-25 | Qimonda Ag | Integrated circuit including a first gate stack and a second gate stack and a method of manufacturing |
KR200450515Y1 (ko) * | 2008-05-14 | 2010-10-07 | (주)오앤드 | 파우더 화장품 용기 |
JP2010067854A (ja) | 2008-09-11 | 2010-03-25 | Toshiba Corp | 不揮発性半導体記憶装置およびその製造方法 |
JP2011071240A (ja) * | 2009-09-24 | 2011-04-07 | Toshiba Corp | 半導体記憶装置、及びその製造方法 |
US11646309B2 (en) * | 2009-10-12 | 2023-05-09 | Monolithic 3D Inc. | 3D semiconductor devices and structures with metal layers |
CN102136456A (zh) * | 2010-01-27 | 2011-07-27 | 中芯国际集成电路制造(上海)有限公司 | 一种存储器栅极结构的制造方法 |
CN101814509A (zh) * | 2010-04-15 | 2010-08-25 | 复旦大学 | 一种半导体器件结构及其制备方法 |
US8598032B2 (en) * | 2011-01-19 | 2013-12-03 | Macronix International Co., Ltd | Reduced number of masks for IC device with stacked contact levels |
US8557647B2 (en) * | 2011-09-09 | 2013-10-15 | International Business Machines Corporation | Method for fabricating field effect transistor devices with high-aspect ratio mask |
JP5930650B2 (ja) * | 2011-10-07 | 2016-06-08 | キヤノン株式会社 | 半導体装置の製造方法 |
WO2015050137A1 (ja) * | 2013-10-02 | 2015-04-09 | Jx日鉱日石エネルギー株式会社 | 冷凍機油、冷凍機用作動流体組成物 |
JP2015122343A (ja) * | 2013-12-20 | 2015-07-02 | 株式会社東芝 | 不揮発性半導体記憶装置の製造方法および不揮発性半導体記憶装置 |
US9391084B2 (en) | 2014-06-19 | 2016-07-12 | Macronix International Co., Ltd. | Bandgap-engineered memory with multiple charge trapping layers storing charge |
CN105679712A (zh) * | 2015-12-31 | 2016-06-15 | 上海华虹宏力半导体制造有限公司 | Sonos器件的工艺方法 |
JP2019192869A (ja) * | 2018-04-27 | 2019-10-31 | 東芝メモリ株式会社 | 半導体記憶装置 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US640995A (en) * | 1899-09-19 | 1900-01-09 | Thomas Coldwell | Lawn-mower. |
US4151537A (en) * | 1976-03-10 | 1979-04-24 | Gte Laboratories Incorporated | Gate electrode for MNOS semiconductor memory device |
US5104819A (en) * | 1989-08-07 | 1992-04-14 | Intel Corporation | Fabrication of interpoly dielctric for EPROM-related technologies |
JP2660446B2 (ja) * | 1990-01-12 | 1997-10-08 | 三菱電機株式会社 | 微小なmis型fetとその製造方法 |
JP3099887B2 (ja) * | 1990-04-12 | 2000-10-16 | 株式会社東芝 | 不揮発性半導体記憶装置 |
JPH05110114A (ja) * | 1991-10-17 | 1993-04-30 | Rohm Co Ltd | 不揮発性半導体記憶素子 |
JPH05226666A (ja) * | 1992-02-13 | 1993-09-03 | Kawasaki Steel Corp | 半導体装置の製造方法 |
JP3546644B2 (ja) * | 1996-06-04 | 2004-07-28 | ソニー株式会社 | 不揮発性半導体記憶装置 |
KR20000029664A (ko) * | 1996-08-01 | 2000-05-25 | 칼 하인쯔 호르닝어 | 메모리셀장치의작동방법 |
JP2000515327A (ja) * | 1996-08-01 | 2000-11-14 | シーメンス アクチエンゲゼルシヤフト | メモリセル装置の作動方法 |
IL125604A (en) * | 1997-07-30 | 2004-03-28 | Saifun Semiconductors Ltd | Non-volatile electrically erasable and programmble semiconductor memory cell utilizing asymmetrical charge |
US5851881A (en) * | 1997-10-06 | 1998-12-22 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method of making monos flash memory for multi-level logic |
JP4810712B2 (ja) * | 1997-11-05 | 2011-11-09 | ソニー株式会社 | 不揮発性半導体記憶装置及びその読み出し方法 |
US6140676A (en) * | 1998-05-20 | 2000-10-31 | Cypress Semiconductor Corporation | Semiconductor non-volatile memory device having an improved write speed |
KR20000020006A (ko) * | 1998-09-17 | 2000-04-15 | 김영환 | 반도체장치의 제조방법 |
JP2001102553A (ja) * | 1999-09-29 | 2001-04-13 | Sony Corp | 半導体装置、その駆動方法および製造方法 |
US6180538B1 (en) * | 1999-10-25 | 2001-01-30 | Advanced Micro Devices, Inc. | Process for fabricating an ONO floating-gate electrode in a two-bit EEPROM device using rapid-thermal-chemical-vapor-deposition |
US6501681B1 (en) * | 2000-08-15 | 2002-12-31 | Advanced Micro Devices, Inc. | Using a low drain bias during erase verify to ensure complete removal of residual charge in the nitride in sonos non-volatile memories |
CN1174490C (zh) * | 2001-07-27 | 2004-11-03 | 旺宏电子股份有限公司 | 具有双顶氧化层的氮化物只读存储单元结构及其制造方法 |
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2001
- 2001-08-31 JP JP2001264754A patent/JP4198903B2/ja not_active Expired - Fee Related
-
2002
- 2002-08-29 US US10/230,092 patent/US20030042558A1/en not_active Abandoned
- 2002-08-30 TW TW091119793A patent/TW569428B/zh not_active IP Right Cessation
- 2002-08-30 KR KR1020020052175A patent/KR20030019259A/ko not_active Application Discontinuation
- 2002-08-30 CN CNB021322171A patent/CN100334734C/zh not_active Expired - Fee Related